TREA

with a principal constituent of the material being a solid not provided for in groups H01L2224/371 - H01L2224/37191

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Industry

  • CPC
  • H01L2224/37193
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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/37193with a principal constituent of the material being a solid not provided for in groups H01L2224/371 - H01L2224/37191
Industries

Patents Grantslast 30 patents

  • Information Patent Grant

    Package structure for power device
    • Patent number 11,183,439
    • Issue date Nov 23, 2021
    • Actron Technology Corporation
    • Hsin-Chang Tsai
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    PACKAGE STRUCTURE FOR POWER DEVICE
    • Publication number 20210074604
    • Publication date Mar 11, 2021
    • ACTRON TECHNOLOGY CORPORATION
    • Hsin-Chang Tsai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE STRUCTURE FOR POWER DEVICE
    • Publication number 20210050320
    • Publication date Feb 18, 2021
    • ACTRON TECHNOLOGY CORPORATION
    • Hsin-Chang Tsai
    • H01 - BASIC ELECTRIC ELEMENTS