Membership
Tour
Register
Log in
with a principal constituent of the material being a solid not provided for in groups H01L2224/296 - H01L2224/29691
Follow
Industry
CPC
H01L2224/29693
This industry / category may be too specific. Please go to a parent level for more data
Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Current Industry
H01L2224/29693
with a principal constituent of the material being a solid not provided for in groups H01L2224/296 - H01L2224/29691
Industries
Overview
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Conductive particle and preparation method thereof, conductive adhe...
Patent number
10,479,914
Issue date
Nov 19, 2019
BOE Technology Group Co., Ltd.
Dezhi Xu
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20230109292
Publication date
Apr 6, 2023
Samsung Electronics Co., Ltd.
Hwail JIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONDUCTIVE PARTICLE AND PREPARATION METHOD THEREOF, CONDUCTIVE ADHE...
Publication number
20170088752
Publication date
Mar 30, 2017
BOE TECHNOLOGY GROUP CO., LTD.
Dezhi XU
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...