with a principal constituent of the material being a solid not provided for in groups H01L2224/133 - H01L2224/13391

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H01L2224/13393

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13393with a principal constituent of the material being a solid not provided for in groups H01L2224/133 - H01L2224/13391

Industries

Patents Grantslast 30 patents

Information Patent Grant
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Information Patent Grant
Engineered polymer-based electronic materials
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- Issue date Jun 16, 2020
- Alpha Assembly Solutions Inc.
- Ramakrishna Hosur Venkatagiriyappa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Expanded head pillar for bump bonds
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- Issue date Apr 28, 2020
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor apparatus, method for manufa...
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- Issue date Sep 17, 2019
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Information Patent Grant
Bonding structure of semiconductor package, method for fabricating...
- Patent number 9,269,670
- Issue date Feb 23, 2016
- SK Hynix Inc.
- Seong Cheol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure of semiconductor package, method for fabricating...
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- Issue date Jul 1, 2014
- SK Hynix Inc.
- Seong Cheol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carbon nanotubes solder composite for high performance interconnect
- Patent number 8,100,314
- Issue date Jan 24, 2012
- Intel Corporation
- Daewoong Suh
- B82 - NANO-TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
EXPANDED HEAD PILLAR FOR BUMP BONDS
- Publication number 20200258856
- Publication date Aug 13, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION OF CONDUCTIVE CIRCUIT
- Publication number 20140374005
- Publication date Dec 25, 2014
- Shin-Etsu Chemical Co., Ltd.
- Yoshitaka Hamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENT, CHIP CARD ARRANGEMENT AND METHOD FOR MANUFACTURIN...
- Publication number 20140328032
- Publication date Nov 6, 2014
- INFINEON TECHNOLOGIES AG
- Frank Pueschner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BONDING STRUCTURE OF SEMICONDUCTOR PACKAGE, METHOD FOR FABRICATING...
- Publication number 20140252652
- Publication date Sep 11, 2014
- SK HYNIX INC.
- Seong Cheol KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC CONTACTS FOR ELECTRONICS APPLICATIONS
- Publication number 20140205851
- Publication date Jul 24, 2014
- Ravindranath V. MAHAJAN
- B32 - LAYERED PRODUCTS
Information Patent Application
BONDING STRUCTURE OF SEMICONDUCTOR PACKAGE, METHOD FOR FABRICATING...
- Publication number 20120139126
- Publication date Jun 7, 2012
- Hynix Semiconductor Inc.
- Seong Cheol KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARBON NANOTUBES SOLDER COMPOSITE FOR HIGH PERFORMANCE INTERCONNECT
- Publication number 20100126631
- Publication date May 27, 2010
- Intel Corporation
- Daewoong Suh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Nanoscale probes for electrophysiological applications
- Publication number 20070187840
- Publication date Aug 16, 2007
- Ludovico M. Dell'Acqua-Bellavitis
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
Carbon nanotubes solder composite for high performance interconnect
- Publication number 20070145097
- Publication date Jun 28, 2007
- Intel Corporation
- Daewoong Suh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

with a principal constituent of the material being a solid not provided for in groups H01L2224/133 - H01L2224/13391

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Sintering materials and attachment methods using same

Engineered polymer-based electronic materials

Expanded head pillar for bump bonds

Method for manufacturing semiconductor apparatus, method for manufa...

Bonding structure of semiconductor package, method for fabricating...

Bonding structure of semiconductor package, method for fabricating...

Carbon nanotubes solder composite for high performance interconnect

Patents Applicationslast 30 patents

EXPANDED HEAD PILLAR FOR BUMP BONDS

FORMATION OF CONDUCTIVE CIRCUIT

CHIP ARRANGEMENT, CHIP CARD ARRANGEMENT AND METHOD FOR MANUFACTURIN...

BONDING STRUCTURE OF SEMICONDUCTOR PACKAGE, METHOD FOR FABRICATING...

MAGNETIC CONTACTS FOR ELECTRONICS APPLICATIONS

BONDING STRUCTURE OF SEMICONDUCTOR PACKAGE, METHOD FOR FABRICATING...

CARBON NANOTUBES SOLDER COMPOSITE FOR HIGH PERFORMANCE INTERCONNECT

Nanoscale probes for electrophysiological applications

Carbon nanotubes solder composite for high performance interconnect