with a principal constituent of the material being a solid not provided for in groups H01L2224/293 - H01L2224/29391

Industry

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H01L2224/29393

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29393with a principal constituent of the material being a solid not provided for in groups H01L2224/293 - H01L2224/29391

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and temperature measurement method
- Patent number 12,163,845
- Issue date Dec 10, 2024
- Fuji Electric Co., Ltd.
- Shinichi Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Energy augmentation structures, energy emitters or energy collector...
- Patent number 12,121,746
- Issue date Oct 22, 2024
- Immunolight, LLC
- Frederic A Bourke
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Energy augmentation structures in adhesive bonding compositions
- Patent number 12,076,579
- Issue date Sep 3, 2024
- Immunolight, LLC
- Frederic A Bourke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package, heat dissipation structure and manufacturing me...
- Patent number 12,080,618
- Issue date Sep 3, 2024
- Siliconware Precision Industries Co., Ltd.
- Yu-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration and bonding of micro-devices into system substrate
- Patent number 12,014,999
- Issue date Jun 18, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Energy augmentation structures and their use in solar cells and oth...
- Patent number 11,998,760
- Issue date Jun 4, 2024
- Immunolight, LLC
- Frederic A. Bourke
- F21 - LIGHTING
Information Patent Grant
Energy augmentation structures, and their use in adhesive bonding
- Patent number 11,964,166
- Issue date Apr 23, 2024
- Immunolight, LLC
- Frederic A Bourke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Energy augmentation structures for use with energy emitters and col...
- Patent number 11,964,167
- Issue date Apr 23, 2024
- Immunolight, LLC
- Frederic A Bourke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal transfer structures for semiconductor die assemblies
- Patent number 11,862,611
- Issue date Jan 2, 2024
- Micron Technology, Inc.
- Ed A. Schrock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure comprising heat dissipation member
- Patent number 11,804,417
- Issue date Oct 31, 2023
- TECAT TECHNOLOGIES (SUZHOU) LIMITED
- Choon Leong Lou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing stacked semiconductor die assemblies with...
- Patent number 11,776,877
- Issue date Oct 3, 2023
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display module and method of manufacturing the same
- Patent number 11,715,729
- Issue date Aug 1, 2023
- Samsung Electronics Co., Ltd.
- Yoonsuk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED assembly with omnidirectional light field
- Patent number 11,543,081
- Issue date Jan 3, 2023
- Epistar Corporation
- Hong-Zhi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming board assembly with chemical vapor deposition di...
- Patent number 11,538,732
- Issue date Dec 27, 2022
- Microchip Technology Caldicot Limited
- Philip Andrew Swire
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit having die attach materials with channels and pr...
- Patent number 11,424,177
- Issue date Aug 23, 2022
- Wolfspeed, Inc.
- Mitch Flowers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintering materials and attachment methods using same
- Patent number 11,389,865
- Issue date Jul 19, 2022
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Member connection method and adhesive tape
- Patent number 11,342,303
- Issue date May 24, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Tetsuyuki Shirakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radiation-hardened package for an electronic device
- Patent number 11,276,619
- Issue date Mar 15, 2022
- AMS International AG
- Jens Hofrichter
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Thermal transfer structures for semiconductor die assemblies
- Patent number 11,222,868
- Issue date Jan 11, 2022
- Micron Technology, Inc.
- Ed A. Schrock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Board assembly with chemical vapor deposition diamond (CVDD) window...
- Patent number 11,189,543
- Issue date Nov 30, 2021
- Microchip Technology Caldicot Limited
- Philip Andrew Swire
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced adhesive materials and processes for 3D applications
- Patent number 11,168,234
- Issue date Nov 9, 2021
- International Business Machines Corporation
- James L. Hedrick
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Alignment method, method for connecting electronic component, metho...
- Patent number 11,049,842
- Issue date Jun 29, 2021
- Dexerials Corporation
- Yasushi Akutsu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Fan-out antenna packaging structure and preparation thereof
- Patent number 10,886,243
- Issue date Jan 5, 2021
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and methods of manufacture thereof
- Patent number 10,825,747
- Issue date Nov 3, 2020
- NXP USA, INC.
- Li Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration and bonding of micro-devices into system substrate
- Patent number 10,818,622
- Issue date Oct 27, 2020
- VueReal Inc.
- Gholamreza Chaji
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Enhanced adhesive materials and processes for 3D applications
- Patent number 10,767,084
- Issue date Sep 8, 2020
- International Business Machines Corporation
- James L. Hedrick
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor-bonding resin composition, semiconductor-bonding shee...
- Patent number 10,767,085
- Issue date Sep 8, 2020
- KYOCERA Corporation
- Masakazu Fujiwara
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Curing a heat-curable material in an embedded curing zone
- Patent number 10,717,236
- Issue date Jul 21, 2020
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Jeroen van den Brand
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Engineered polymer-based electronic materials
- Patent number 10,682,732
- Issue date Jun 16, 2020
- Alpha Assembly Solutions Inc.
- Ramakrishna Hosur Venkatagiriyappa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor die assemblies with heat sink and associated systems...
- Patent number 10,636,678
- Issue date Apr 28, 2020
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THERMAL INTERFACE MATERIAL INCLUDING A MULTI-LAYER STRUCTURE AND ME...
- Publication number 20240371722
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chih-Chien Pan
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
CONDUCTIVE ADHESIVE FILM AND FABRICATION METHOD THEREFOR, ELECTRONI...
- Publication number 20240304586
- Publication date Sep 12, 2024
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Shaopeng LI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE
- Publication number 20240297133
- Publication date Sep 5, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENERGY AUGMENTATION STRUCTURES FOR USE WITH ENERGY EMITTERS AND COL...
- Publication number 20240216713
- Publication date Jul 4, 2024
- Immunolight, LLC
- Frederic A. BOURKE
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Application
ENERGY AUGMENTATION STRUCTURES, ENERGY EMITTERS OR ENERGY COLLECTOR...
- Publication number 20240115878
- Publication date Apr 11, 2024
- Immunolight, LLC
- Frederic A. BOURKE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
THERMALLY-CONDUCTIVE SHEET AND ELECTRONIC DEVICE
- Publication number 20240120254
- Publication date Apr 11, 2024
- DEXERIALS CORPORATION
- Keisuke ARAMAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR METHOD AND APPARATUS
- Publication number 20240096745
- Publication date Mar 21, 2024
- Mayank Mayukh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID ALLOY THERMAL PASTE AND FABRICATION METHOD THEREOF
- Publication number 20240067855
- Publication date Feb 29, 2024
- COOLER MATERIALS TECHNOLOGY INC.
- Po-Wen CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CO-PACKAGE FOR QUBITS AND PARAMETRIC JOSEPHSON DEVICES
- Publication number 20240038723
- Publication date Feb 1, 2024
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Structure for Semiconductor Device and Method of Forming th...
- Publication number 20240014091
- Publication date Jan 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Ming Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...
- Publication number 20230395463
- Publication date Dec 7, 2023
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGING STRUCTURES AND RELATED METHODS
- Publication number 20230378209
- Publication date Nov 23, 2023
- Semiconductor Components Industries, LLC
- Chee Peng NEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMBER, CONDUCTIVE LAYER, METHOD FOR MANUFACTURING MEMBER, AND METH...
- Publication number 20230307407
- Publication date Sep 28, 2023
- Tohru YASHIRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOTE MECHANICAL ATTACHMENT FOR BONDED THERMAL MANAGEMENT SOLUTIONS
- Publication number 20230197565
- Publication date Jun 22, 2023
- Jerrod P. Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPEN WEB ELECTRICAL SUPPORT FOR CONTACT PAD AND METHOD OF MANUFACTURE
- Publication number 20220246510
- Publication date Aug 4, 2022
- HYPERTAC S.P.A.
- Alessandro Bosca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND TEMPERATURE MEASUREMENT METHOD
- Publication number 20220244111
- Publication date Aug 4, 2022
- Fuji Electric Co., Ltd.
- Shinichi MASUDA
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20220199488
- Publication date Jun 23, 2022
- TECAT TECHNOLOGIES (SUZHOU) LIMITED
- Choon Leong LOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENERGY AUGMENTATION STRUCTURES IN ADHESIVE BONDING COMPOSITIONS
- Publication number 20220148997
- Publication date May 12, 2022
- Immunolight, LLC
- Frederic A. BOURKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CONDUCTIVE SHEET, METHOD FOR MANUFACTURING THE SAME, AND...
- Publication number 20220098462
- Publication date Mar 31, 2022
- DEXERIALS CORPORATION
- Marina TOBATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming Board Assembly with Chemical Vapor Deposition Di...
- Publication number 20220028753
- Publication date Jan 27, 2022
- Microchip Technology Caldicot Limited
- Philip Andrew Swire
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...
- Publication number 20220013434
- Publication date Jan 13, 2022
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Having Die Attach Materials with Channels and Pr...
- Publication number 20210351113
- Publication date Nov 11, 2021
- Cree, Inc.
- Mitch Flowers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMBER CONNECTION METHOD AND ADHESIVE TAPE
- Publication number 20210074674
- Publication date Mar 11, 2021
- Hitachi Chemical Company, Ltd.
- Tetsuyuki SHIRAKAWA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Board Assembly with Chemical Vapor Deposition Diamond (CVDD) Window...
- Publication number 20210035883
- Publication date Feb 4, 2021
- Microsemi Semiconductor Limited
- Philip Andrew Swire
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIATION-HARDENED PACKAGE FOR AN ELECTRONIC DEVICE
- Publication number 20200176343
- Publication date Jun 4, 2020
- Jens Hofrichter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT ANTENNA PACKAGING STRUCTURE AND PREPARATION THEREOF
- Publication number 20200075515
- Publication date Mar 5, 2020
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR-BONDING RESIN COMPOSITION, SEMICONDUCTOR-BONDING SHEE...
- Publication number 20190264071
- Publication date Aug 29, 2019
- Kyocera Corporation
- Masakazu FUJIWARA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
NANOSCALE INTERCONNECT ARRAY FOR STACKED DIES
- Publication number 20190237437
- Publication date Aug 1, 2019
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILLER COMPOSITIONS AND UNDERFILL COMPOSITIONS AND MOLDING COMPOUND...
- Publication number 20190214323
- Publication date Jul 11, 2019
- Advanced Semiconductor Engineering, Inc.
- Ya-Yu HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE ASSEMBLIES WITH HEAT SINK AND ASSOCIATED SYSTEMS...
- Publication number 20190109019
- Publication date Apr 11, 2019
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS

with a principal constituent of the material being a solid not provided for in groups H01L2224/293 - H01L2224/29391

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and temperature measurement method

Energy augmentation structures, energy emitters or energy collector...

Energy augmentation structures in adhesive bonding compositions

Electronic package, heat dissipation structure and manufacturing me...

Integration and bonding of micro-devices into system substrate

Energy augmentation structures and their use in solar cells and oth...

Energy augmentation structures, and their use in adhesive bonding

Energy augmentation structures for use with energy emitters and col...

Thermal transfer structures for semiconductor die assemblies

Semiconductor structure comprising heat dissipation member

Methods of manufacturing stacked semiconductor die assemblies with...

Display module and method of manufacturing the same

LED assembly with omnidirectional light field

Method for forming board assembly with chemical vapor deposition di...

Integrated circuit having die attach materials with channels and pr...

Sintering materials and attachment methods using same

Member connection method and adhesive tape

Radiation-hardened package for an electronic device

Thermal transfer structures for semiconductor die assemblies

Board assembly with chemical vapor deposition diamond (CVDD) window...

Enhanced adhesive materials and processes for 3D applications

Alignment method, method for connecting electronic component, metho...

Fan-out antenna packaging structure and preparation thereof

Semiconductor device package and methods of manufacture thereof

Integration and bonding of micro-devices into system substrate

Enhanced adhesive materials and processes for 3D applications

Semiconductor-bonding resin composition, semiconductor-bonding shee...

Curing a heat-curable material in an embedded curing zone

Engineered polymer-based electronic materials

Semiconductor die assemblies with heat sink and associated systems...

Patents Applicationslast 30 patents

THERMAL INTERFACE MATERIAL INCLUDING A MULTI-LAYER STRUCTURE AND ME...

CONDUCTIVE ADHESIVE FILM AND FABRICATION METHOD THEREFOR, ELECTRONI...

INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE

ENERGY AUGMENTATION STRUCTURES FOR USE WITH ENERGY EMITTERS AND COL...

ENERGY AUGMENTATION STRUCTURES, ENERGY EMITTERS OR ENERGY COLLECTOR...

THERMALLY-CONDUCTIVE SHEET AND ELECTRONIC DEVICE

STACKED SEMICONDUCTOR METHOD AND APPARATUS

LIQUID ALLOY THERMAL PASTE AND FABRICATION METHOD THEREOF

CO-PACKAGE FOR QUBITS AND PARAMETRIC JOSEPHSON DEVICES

Thermal Structure for Semiconductor Device and Method of Forming th...

METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...

IMAGE SENSOR PACKAGING STRUCTURES AND RELATED METHODS

MEMBER, CONDUCTIVE LAYER, METHOD FOR MANUFACTURING MEMBER, AND METH...

REMOTE MECHANICAL ATTACHMENT FOR BONDED THERMAL MANAGEMENT SOLUTIONS

OPEN WEB ELECTRICAL SUPPORT FOR CONTACT PAD AND METHOD OF MANUFACTURE

SEMICONDUCTOR DEVICE AND TEMPERATURE MEASUREMENT METHOD

SEMICONDUCTOR STRUCTURE

ENERGY AUGMENTATION STRUCTURES IN ADHESIVE BONDING COMPOSITIONS

THERMALLY CONDUCTIVE SHEET, METHOD FOR MANUFACTURING THE SAME, AND...

Method for forming Board Assembly with Chemical Vapor Deposition Di...

METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...

Integrated Circuit Having Die Attach Materials with Channels and Pr...

MEMBER CONNECTION METHOD AND ADHESIVE TAPE

Board Assembly with Chemical Vapor Deposition Diamond (CVDD) Window...

RADIATION-HARDENED PACKAGE FOR AN ELECTRONIC DEVICE

FAN-OUT ANTENNA PACKAGING STRUCTURE AND PREPARATION THEREOF

SEMICONDUCTOR-BONDING RESIN COMPOSITION, SEMICONDUCTOR-BONDING SHEE...

NANOSCALE INTERCONNECT ARRAY FOR STACKED DIES

FILLER COMPOSITIONS AND UNDERFILL COMPOSITIONS AND MOLDING COMPOUND...

SEMICONDUCTOR DIE ASSEMBLIES WITH HEAT SINK AND ASSOCIATED SYSTEMS...