TREA

with a principal constituent of the material being a solid not provided for in groups H01L2224/458 - H01L2224/45891

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Industry

  • CPC
  • H01L2224/45893
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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/45893with a principal constituent of the material being a solid not provided for in groups H01L2224/458 - H01L2224/45891
Industries

Patents Grantslast 30 patents

  • Information Patent Grant

    Reliable wire method
    • Patent number 9,245,670
    • Issue date Jan 26, 2016
    • Tessera, Inc.
    • Cyprian Uzoh
    • Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Information Patent Grant

    Reliable wire structure and method
    • Patent number 8,692,118
    • Issue date Apr 8, 2014
    • Tessera, Inc.
    • Cyprian Uzoh
    • Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents