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with a principal constituent of the material being a solid not provided for in groups H01L2224/836 - H01L2224/83691
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H01L2224/83693
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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/83693
with a principal constituent of the material being a solid not provided for in groups H01L2224/836 - H01L2224/83691
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last 30 patents
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Patent Grant
Preform structure for soldering a semiconductor chip arrangement, a...
Patent number
9,536,851
Issue date
Jan 3, 2017
Infineon Technologies AG
Friedrich Kroener
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
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Patent Application
SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20140054757
Publication date
Feb 27, 2014
PANASONIC CORPORATION
Keiko Ikuta
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR