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with a staggered arrangement

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  • CPC
  • H01L2224/06163
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/06163with a staggered arrangement
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20230207440
    • Publication date Jun 29, 2023
    • Rohm Co., Ltd.
    • Hideo HARA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME
    • Publication number 20230049315
    • Publication date Feb 16, 2023
    • SAMSUNG DISPLAY CO., LTD.
    • Jin Woo CHOI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDED ASSEMBLY INCLUDING INTERCONNECT-LEVEL BONDING PADS AND METHO...
    • Publication number 20220336394
    • Publication date Oct 20, 2022
    • SANDISK TECHNOLOGIES LLC
    • Kensuke ISHIKAWA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DISPLAY SUBSTRATE AND DISPLAY DEVICE
    • Publication number 20220216183
    • Publication date Jul 7, 2022
    • BOE TECHNOLOGY GROUP CO., LTD.
    • Mingxing WANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FLIP-CHIP FLEXIBLE UNDER BUMP METALLIZATION SIZE
    • Publication number 20210407939
    • Publication date Dec 30, 2021
    • QUALCOMM Incorporated
    • Yangyang SUN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ARRANGEMENT OF BOND PADS ON AN INTEGRATED CIRCUIT CHIP
    • Publication number 20210167028
    • Publication date Jun 3, 2021
    • Changxin Memory Technologies, Inc.
    • Chia-Chi HSU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR WAFER
    • Publication number 20210098439
    • Publication date Apr 1, 2021
    • Canon Kabushiki Kaisha
    • Mari Isobe
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DISPLAY DEVICE
    • Publication number 20180076235
    • Publication date Mar 15, 2018
    • SAMSUNG DISPLAY CO., LTD.
    • Byoung Yong KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR INTEGRATED CIRCUIT
    • Publication number 20150372008
    • Publication date Dec 24, 2015
    • SONY CORPORATION
    • Dwi Antono Danardono
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20150287724
    • Publication date Oct 8, 2015
    • RENESAS ELECTRONICS CORPORATION
    • Takahiro HAYASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LEAD FRAME FOR SEMICONDUCTOR PACKAGE WITH ENHANCED STRESS RELIEF
    • Publication number 20140264793
    • Publication date Sep 18, 2014
    • Kai Yun Yow
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20140054801
    • Publication date Feb 27, 2014
    • Realtek Semiconductor Corp.
    • Ta-Hsun Yeh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor Device
    • Publication number 20130341728
    • Publication date Dec 26, 2013
    • RENESAS ELECTRONICS CORPORATION
    • Takahiro HAYASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CONDUCTIVE STRUCTURE AND METHOD FOR FORMING THE SAME
    • Publication number 20130292821
    • Publication date Nov 7, 2013
    • CHIPMOS TECHNOLOGIES INC.
    • Chung-Pang Chi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTEGRATED CIRCUIT PACKAGE AND PHYSICAL LAYER INTERFACE ARRANGEMENT
    • Publication number 20120126398
    • Publication date May 24, 2012
    • VIA TECHNOLOGIES, INC.
    • Wei-Chih Lai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20100171177
    • Publication date Jul 8, 2010
    • RENESAS TECHNOLOGY CORP.
    • Takahiro Hayashi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20090050940
    • Publication date Feb 26, 2009
    • RENESAS TECHNOLOGY CORP.
    • Takahiro Hayashi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor device
    • Publication number 20070120258
    • Publication date May 31, 2007
    • RENESAS TECHNOLOGY CORP.
    • Takahiro Hayashi
    • H01 - BASIC ELECTRIC ELEMENTS