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H01L2224/17163
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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/17163
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Patents Grants
last 30 patents
Information
Patent Grant
Microelectronic package with solder array thermal interface materia...
Patent number
12,205,915
Issue date
Jan 21, 2025
Intel Corporation
Debendra Mallik
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package comprising integrated devices coupled through a metallizati...
Patent number
11,784,157
Issue date
Oct 10, 2023
QUALCOMM Incorporated
Li-Sheng Weng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic package with solder array thermal interface materia...
Patent number
11,735,552
Issue date
Aug 22, 2023
Intel Corporation
Debendra Mallik
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20240120304
Publication date
Apr 11, 2024
Innolux Corporation
Tzu-Sheng Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING CAPACITOR INTERPOSER SUB...
Publication number
20240079352
Publication date
Mar 7, 2024
QUALCOMM Incorporated
Jihong Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIA...
Publication number
20230343738
Publication date
Oct 26, 2023
Intel Corporation
Debendra Mallik
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE COMPRISING INTEGRATED DEVICES COUPLED THROUGH A METALLIZATI...
Publication number
20220392867
Publication date
Dec 8, 2022
QUALCOMM Incorporated
Li-Sheng WENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIA...
Publication number
20200411464
Publication date
Dec 31, 2020
Intel Corporation
Debendra Mallik
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGING SUBSTRATE AND SEMICONDUCTOR PACKAGE HAVING THE SAME
Publication number
20150318256
Publication date
Nov 5, 2015
Siliconware Precision Industries Co., Ltd.
Shih-Yu Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
REACTIVE BONDING OF A FLIP CHIP PACKAGE
Publication number
20150137366
Publication date
May 21, 2015
International Business Machines Corporation
Gregory M. Fritz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
REACTIVE BONDING OF A FLIP CHIP PACKAGE
Publication number
20130320529
Publication date
Dec 5, 2013
International Business Machines Corporation
Gregory M. Fritz
H01 - BASIC ELECTRIC ELEMENTS