with a staggered arrangement

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CPC
H01L2224/09133

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/09133with a staggered arrangement

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
- Patent number 12,368,122
- Issue date Jul 22, 2025
- Samsung Electronics Co., Ltd.
- Jinhee Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fine-pitch joining pad structure
- Patent number 12,354,983
- Issue date Jul 8, 2025
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,300,649
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- Yong Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,142,544
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Taehwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor storage device
- Patent number 12,132,040
- Issue date Oct 29, 2024
- Kioxia Corporation
- Nobuaki Okada
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor storage device
- Patent number 11,710,727
- Issue date Jul 25, 2023
- Kioxia Corporation
- Nobuaki Okada
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and method of forming pad layout for flipchip...
- Patent number 9,780,057
- Issue date Oct 3, 2017
- STATS ChipPAC Pte. Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Segmented bond pads and methods of fabrication thereof
- Patent number 9,543,260
- Issue date Jan 10, 2017
- Infineon Technologies AG
- Albert Birner
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250239552
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Yong Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20250038142
- Publication date Jan 30, 2025
- Fujian Jinhua Integrated Circuit Co., Ltd.
- Yifei Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED PACKAGE WITH AN INTERCHANGEABLE LEADFRAME
- Publication number 20240339382
- Publication date Oct 10, 2024
- TEXAS INSTRUMENTS INCORPORATED
- YOU CHYE HOW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230411328
- Publication date Dec 21, 2023
- KIOXIA Corporation
- Shinya ARAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE-PITCH JOINING PAD STRUCTURE
- Publication number 20230317652
- Publication date Oct 5, 2023
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYOUTS OF DATA PADS ON A SEMICONDUCTOR DIE
- Publication number 20230215828
- Publication date Jul 6, 2023
- Micron Technology, Inc.
- Andreas Kuesel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230215829
- Publication date Jul 6, 2023
- Samsung Electronics Co., Ltd.
- JINHEE HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CASTELLATION, HATCHING, AND OTHER SURFACE PATTERNS IN DIELECTRIC SU...
- Publication number 20230060594
- Publication date Mar 2, 2023
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230034654
- Publication date Feb 2, 2023
- Samsung Electronics Co., Ltd.
- Yong Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230005885
- Publication date Jan 5, 2023
- Samsung Electronics Co., Ltd.
- Hyemi Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE
- Publication number 20210082897
- Publication date Mar 18, 2021
- KIOXIA Corporation
- Nobuaki OKADA
- G11 - INFORMATION STORAGE
Information Patent Application
Semiconductor Device and Method of Forming Pad Layout for Flipchip...
- Publication number 20150054167
- Publication date Feb 26, 2015
- STATS ChipPAC, Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Segmented Bond Pads and Methods of Fabrication Thereof
- Publication number 20150035171
- Publication date Feb 5, 2015
- INFINEON TECHNOLOGIES AG
- Albert Birner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Pad Layout for Flipchip...
- Publication number 20120241984
- Publication date Sep 27, 2012
- STATS ChipPAC, Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Pad Layout for Flipchip...
- Publication number 20110074047
- Publication date Mar 31, 2011
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS

with a staggered arrangement

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package

Fine-pitch joining pad structure

Semiconductor package

Semiconductor package

Semiconductor storage device

Semiconductor storage device

Semiconductor device and method of forming pad layout for flipchip...

Segmented bond pads and methods of fabrication thereof

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

MOLDED PACKAGE WITH AN INTERCHANGEABLE LEADFRAME

SEMICONDUCTOR DEVICE

FINE-PITCH JOINING PAD STRUCTURE

LAYOUTS OF DATA PADS ON A SEMICONDUCTOR DIE

SEMICONDUCTOR PACKAGE

CASTELLATION, HATCHING, AND OTHER SURFACE PATTERNS IN DIELECTRIC SU...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR STORAGE DEVICE

Semiconductor Device and Method of Forming Pad Layout for Flipchip...

Segmented Bond Pads and Methods of Fabrication Thereof

Semiconductor Device and Method of Forming Pad Layout for Flipchip...

Semiconductor Device and Method of Forming Pad Layout for Flipchip...