with a staggered arrangement

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CPC
H01L2224/09133

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/09133with a staggered arrangement

Industries

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Patents Grantslast 30 patents

Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
Segmented bond pads and methods of fabrication thereof
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- Issue date Jan 10, 2017
- Infineon Technologies AG
- Albert Birner
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MOLDED PACKAGE WITH AN INTERCHANGEABLE LEADFRAME
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- TEXAS INSTRUMENTS INCORPORATED
- YOU CHYE HOW
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Information Patent Application
SEMICONDUCTOR DEVICE
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Information Patent Application
FINE-PITCH JOINING PAD STRUCTURE
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Information Patent Application
LAYOUTS OF DATA PADS ON A SEMICONDUCTOR DIE
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Information Patent Application
SEMICONDUCTOR PACKAGE
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Information Patent Application
CASTELLATION, HATCHING, AND OTHER SURFACE PATTERNS IN DIELECTRIC SU...
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Information Patent Application
SEMICONDUCTOR PACKAGE
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Information Patent Application
SEMICONDUCTOR PACKAGE
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Information Patent Application
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Information Patent Application
Semiconductor Device and Method of Forming Pad Layout for Flipchip...
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Information Patent Application
Segmented Bond Pads and Methods of Fabrication Thereof
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- Publication date Feb 5, 2015
- INFINEON TECHNOLOGIES AG
- Albert Birner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Pad Layout for Flipchip...
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Pad Layout for Flipchip...
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- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS

with a staggered arrangement

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package

Semiconductor storage device

Semiconductor storage device

Semiconductor device and method of forming pad layout for flipchip...

Segmented bond pads and methods of fabrication thereof

Patents Applicationslast 30 patents

MOLDED PACKAGE WITH AN INTERCHANGEABLE LEADFRAME

SEMICONDUCTOR DEVICE

FINE-PITCH JOINING PAD STRUCTURE

LAYOUTS OF DATA PADS ON A SEMICONDUCTOR DIE

SEMICONDUCTOR PACKAGE

CASTELLATION, HATCHING, AND OTHER SURFACE PATTERNS IN DIELECTRIC SU...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR STORAGE DEVICE

Semiconductor Device and Method of Forming Pad Layout for Flipchip...

Segmented Bond Pads and Methods of Fabrication Thereof

Semiconductor Device and Method of Forming Pad Layout for Flipchip...

Semiconductor Device and Method of Forming Pad Layout for Flipchip...