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with a staggered arrangement

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  • CPC
  • H01L2224/06143
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/06143with a staggered arrangement
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20150287724
    • Publication date Oct 8, 2015
    • RENESAS ELECTRONICS CORPORATION
    • Takahiro HAYASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor Device
    • Publication number 20130341728
    • Publication date Dec 26, 2013
    • RENESAS ELECTRONICS CORPORATION
    • Takahiro HAYASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20120018859
    • Publication date Jan 26, 2012
    • RENESAS ELECTRONICS CORPORATION
    • Yukinori TASHIRO
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20100171177
    • Publication date Jul 8, 2010
    • RENESAS TECHNOLOGY CORP.
    • Takahiro Hayashi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20090050940
    • Publication date Feb 26, 2009
    • RENESAS TECHNOLOGY CORP.
    • Takahiro Hayashi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Wire bonding method and related device for high-frequency applications
    • Publication number 20080227284
    • Publication date Sep 18, 2008
    • Agere Systems, Inc.
    • Ashley Rebelo
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor device
    • Publication number 20070120258
    • Publication date May 31, 2007
    • RENESAS TECHNOLOGY CORP.
    • Takahiro Hayashi
    • H01 - BASIC ELECTRIC ELEMENTS