with a staggered arrangement

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CPC
H01L2224/17133

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/17133with a staggered arrangement

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
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- Samsung Electronics Co., Ltd.
- Taehwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including test bumps
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- Issue date Oct 22, 2024
- Samsung Electronics Co., Ltd.
- Taehyeong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alternative surfaces for conductive pad layers of silicon bridges f...
- Patent number 11,848,259
- Issue date Dec 19, 2023
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit and electronic device comprising a plurality of...
- Patent number 11,742,311
- Issue date Aug 29, 2023
- STMicroelectronics S.r.l.
- Angelo Scuderi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising a substrate and interconnect device configured f...
- Patent number 11,562,962
- Issue date Jan 24, 2023
- QUALCOMM Incorporated
- Joan Rey Villarba Buot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High speed semiconductor device with noise reduction wiring pattern
- Patent number 10,643,939
- Issue date May 5, 2020
- Renesas Electronics Corporation
- Shuuichi Kariyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduction of solder interconnect stress
- Patent number 10,276,534
- Issue date Apr 30, 2019
- International Business Machines Corporation
- Anson J. Call
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating contacts of an electronic package structure t...
- Patent number 10,276,535
- Issue date Apr 30, 2019
- International Business Machines Corporation
- Anson J. Call
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduction of solder interconnect stress
- Patent number 9,865,557
- Issue date Jan 9, 2018
- International Business Machines Corporation
- Anson J. Call
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming pad layout for flipchip...
- Patent number 9,780,057
- Issue date Oct 3, 2017
- STATS ChipPAC Pte. Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and packages having through electrodes
- Patent number 9,368,481
- Issue date Jun 14, 2016
- SK Hynix Inc.
- Hyeong Seok Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method therefor
- Patent number 9,355,974
- Issue date May 31, 2016
- SOCIONEXT INC.
- Masashi Takenaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method therefor
- Patent number 9,142,516
- Issue date Sep 22, 2015
- SOCIONEXT INC.
- Masashi Takenaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an electronic power component, and an elect...
- Patent number 6,589,859
- Issue date Jul 8, 2003
- Alstom
- Alain Petitbon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE BUMPS OF A PACKAGE SUBSTRATE
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- Publication date Jun 20, 2024
- QUALCOMM Incorporated
- Ashish RAJ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED 3D CACHE CONFIGURATION WITH ON-CHIP POWER SUPPORT
- Publication number 20240162192
- Publication date May 16, 2024
- International Business Machines Corporation
- Arvind Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGE HAVING BALL GRID ARRAY SUBSTRATE WITH SIGNAL AND PO...
- Publication number 20240145363
- Publication date May 2, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Vivek SRIDHARAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240088082
- Publication date Mar 14, 2024
- Samsung Electronics Co., Ltd.
- Sang Ho Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND BUMP ARRANGEMENT METHOD
- Publication number 20240021557
- Publication date Jan 18, 2024
- RENESAS ELECTRONICS CORPORATION
- Kazuo SAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND ELECTRONIC DEVICE COMPRISING A PLURALITY OF...
- Publication number 20230335524
- Publication date Oct 19, 2023
- STMicroelectronics S.r.l.
- Angelo SCUDERI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURES WITH PATTERNED DIE BACKSIDE LAYER
- Publication number 20230317545
- Publication date Oct 5, 2023
- Intel Corporation
- Pilin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING STRUCTURE AND METHOD FOR PREPARING THE SAME, AND MET...
- Publication number 20230197666
- Publication date Jun 22, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Zengyan FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230034654
- Publication date Feb 2, 2023
- Samsung Electronics Co., Ltd.
- Yong Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING TEST BUMPS
- Publication number 20220148994
- Publication date May 12, 2022
- Samsung Electronics Co., Ltd.
- Taehyeong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND ELECTRONIC DEVICE COMPRISING A PLURALITY OF...
- Publication number 20210242157
- Publication date Aug 5, 2021
- STMicroelectronics S.r.l.
- Angelo SCUDERI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190115295
- Publication date Apr 18, 2019
- RENESAS ELECTRONICS CORPORATION
- Shuuichi KARIYAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCTION OF SOLDER INTERCONNECT STRESS
- Publication number 20180061799
- Publication date Mar 1, 2018
- International Business Machines Corporation
- Anson J. Call
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCTION OF SOLDER INTERCONNECT STRESS
- Publication number 20180061800
- Publication date Mar 1, 2018
- International Business Machines Corporation
- Anson J. Call
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING THROUGH ELECTRODES, SEMICONDUCTOR PACK...
- Publication number 20160099229
- Publication date Apr 7, 2016
- SK HYNIX INC.
- Hyeong Seok CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Pad Layout for Flipchip...
- Publication number 20150054167
- Publication date Feb 26, 2015
- STATS ChipPAC, Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20130026649
- Publication date Jan 31, 2013
- FUJITSU SEMICONDUCTOR LIMITED
- Masashi Takenaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Pad Layout for Flipchip...
- Publication number 20120241984
- Publication date Sep 27, 2012
- STATS ChipPAC, Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Pad Layout for Flipchip...
- Publication number 20110074047
- Publication date Mar 31, 2011
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing an electronic power component, and an elect...
- Publication number 20020006685
- Publication date Jan 17, 2002
- ALSTOM
- Alain Petitbon
- H01 - BASIC ELECTRIC ELEMENTS

with a staggered arrangement

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package

Semiconductor package including test bumps

Alternative surfaces for conductive pad layers of silicon bridges f...

Integrated circuit and electronic device comprising a plurality of...

Package comprising a substrate and interconnect device configured f...

High speed semiconductor device with noise reduction wiring pattern

Reduction of solder interconnect stress

Method of fabricating contacts of an electronic package structure t...

Reduction of solder interconnect stress

Semiconductor device and method of forming pad layout for flipchip...

Semiconductor devices and packages having through electrodes

Semiconductor device and manufacturing method therefor

Semiconductor device and manufacturing method therefor

Method of manufacturing an electronic power component, and an elect...

Patents Applicationslast 30 patents

PACKAGE BUMPS OF A PACKAGE SUBSTRATE

STACKED 3D CACHE CONFIGURATION WITH ON-CHIP POWER SUPPORT

FAN-OUT PACKAGE HAVING BALL GRID ARRAY SUBSTRATE WITH SIGNAL AND PO...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND BUMP ARRANGEMENT METHOD

INTEGRATED CIRCUIT AND ELECTRONIC DEVICE COMPRISING A PLURALITY OF...

PACKAGE STRUCTURES WITH PATTERNED DIE BACKSIDE LAYER

CHIP PACKAGING STRUCTURE AND METHOD FOR PREPARING THE SAME, AND MET...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING TEST BUMPS

INTEGRATED CIRCUIT AND ELECTRONIC DEVICE COMPRISING A PLURALITY OF...

SEMICONDUCTOR DEVICE

REDUCTION OF SOLDER INTERCONNECT STRESS

REDUCTION OF SOLDER INTERCONNECT STRESS

SEMICONDUCTOR DEVICES HAVING THROUGH ELECTRODES, SEMICONDUCTOR PACK...

Semiconductor Device and Method of Forming Pad Layout for Flipchip...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

Semiconductor Device and Method of Forming Pad Layout for Flipchip...

Semiconductor Device and Method of Forming Pad Layout for Flipchip...

Method of manufacturing an electronic power component, and an elect...