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H01L2224/09153
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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/09153
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Patents Grants
last 30 patents
Information
Patent Grant
Solid-state imaging device including a sensor substrate and a logic...
Patent number
10,978,505
Issue date
Apr 13, 2021
Renesas Electronics Corporation
Hidenori Sato
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Segmented bond pads and methods of fabrication thereof
Patent number
9,543,260
Issue date
Jan 10, 2017
Infineon Technologies AG
Albert Birner
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20230317657
Publication date
Oct 5, 2023
Samsung Electronics Co., Ltd.
Wonil SEO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LAYOUTS OF DATA PADS ON A SEMICONDUCTOR DIE
Publication number
20230215828
Publication date
Jul 6, 2023
Micron Technology, Inc.
Andreas Kuesel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR MODULE
Publication number
20230044711
Publication date
Feb 9, 2023
Fuji Electric Co., Ltd.
Tomofumi OOSE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20230005885
Publication date
Jan 5, 2023
Samsung Electronics Co., Ltd.
Hyemi Kang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20190273108
Publication date
Sep 5, 2019
RENESAS ELECTRONICS CORPORATION
Hidenori SATO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Segmented Bond Pads and Methods of Fabrication Thereof
Publication number
20150035171
Publication date
Feb 5, 2015
INFINEON TECHNOLOGIES AG
Albert Birner
H01 - BASIC ELECTRIC ELEMENTS