with a staggered arrangement

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CPC
H01L2224/14143

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/14143with a staggered arrangement

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor chip having a dense arrangement of contact terminals
- Patent number 10,090,251
- Issue date Oct 2, 2018
- Infineon Technologies AG
- Peter Ossimitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing and assembling semiconductor chips with off...
- Patent number 8,394,672
- Issue date Mar 12, 2013
- Advanced Micro Devices, Inc.
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR CHIP WITH OFFSET PADS
- Publication number 20130161814
- Publication date Jun 27, 2013
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH OFFSET PADS
- Publication number 20120038061
- Publication date Feb 16, 2012
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS