TREA

with a staggered arrangement

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Industry

  • CPC
  • H01L2224/17143
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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/17143with a staggered arrangement
Industries

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR CHIP
    • Publication number 20230057061
    • Publication date Feb 23, 2023
    • Samsung Electronics Co., Ltd.
    • Seyeong SEOK
    • H01 - BASIC ELECTRIC ELEMENTS