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  • H01L2224/40139
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/40139with an intermediate bond
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR MODULE
    • Publication number 20240321811
    • Publication date Sep 26, 2024
    • ROHM CO., LTD.
    • Kenji HAYASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SANDWICH PACKAGE FOR MICROELECTRONICS
    • Publication number 20240290757
    • Publication date Aug 29, 2024
    • Semiconductor Components Industries, LLC
    • Atapol PRAJUCKAMOL
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20240290759
    • Publication date Aug 29, 2024
    • Power Master Semiconductor Co., Ltd.
    • Taekkeun LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20240213208
    • Publication date Jun 27, 2024
    • Power Master Semiconductor Co., Ltd.
    • Taekkeun LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR MODULE
    • Publication number 20240170441
    • Publication date May 23, 2024
    • ROHM CO., LTD.
    • Kenji HAYASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POWER SEMICONDUCTOR MODULE HAVING A SUBSTRATE ARRANGEMENT, HAVING P...
    • Publication number 20240079367
    • Publication date Mar 7, 2024
    • SEMIKRON ELEKTRONIK GMBH & CO. KG
    • Ingo BOGEN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR MODULE, POWER CONVERTER, AND POWER CONVERTER MANUFACT...
    • Publication number 20240071876
    • Publication date Feb 29, 2024
    • Fuji Electric Co., Ltd.
    • Akira ISO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
    • Publication number 20240047318
    • Publication date Feb 8, 2024
    • Mitsubishi Electric Corporation
    • Yosuke NAKATA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR MODULE
    • Publication number 20230411339
    • Publication date Dec 21, 2023
    • ROHM CO., LTD.
    • Kenji HAYASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR MODULE
    • Publication number 20230402421
    • Publication date Dec 14, 2023
    • ROHM CO., LTD.
    • Kenji HAYASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20230402432
    • Publication date Dec 14, 2023
    • ROHM CO., LTD.
    • Kenji HAYASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20230343755
    • Publication date Oct 26, 2023
    • Rohm Co., Ltd.
    • Kenji HAYASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE STRUCTURE FOR POWER SEMICONDUCTOR DEVICES WITH IMPROVED PAR...
    • Publication number 20230326907
    • Publication date Oct 12, 2023
    • Nexperia Technology (Shanghai) Ltd.
    • Wei Gong
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR MODULE
    • Publication number 20230307411
    • Publication date Sep 28, 2023
    • Rohm Co., Ltd.
    • Kenji HAYASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20230307430
    • Publication date Sep 28, 2023
    • Kabushiki Kaisha Toshiba
    • Yuning TSAI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR...
    • Publication number 20230154808
    • Publication date May 18, 2023
    • Mitsubishi Electric Corporation
    • Masaki KURACHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20230130373
    • Publication date Apr 27, 2023
    • Mitsubishi Electric Corporation
    • Masayuki NISHIYAMA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Chip Package with Contact Clip
    • Publication number 20230094566
    • Publication date Mar 30, 2023
    • INFINEON TECHNOLOGIES AG
    • Horst Theuss
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POWER CIRCUIT MODULE
    • Publication number 20230052830
    • Publication date Feb 16, 2023
    • Semiconductor Components Industries, LLC
    • Atapol PRAJUCKAMOL
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POWER MODULE AND MANUFACTURING METHOD THEREFOR
    • Publication number 20220230943
    • Publication date Jul 21, 2022
    • Mitsubishi Electric Corporation
    • Masakazu TANI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20220108977
    • Publication date Apr 7, 2022
    • ROHM CO., LTD.
    • Kenji HAYASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
    • Publication number 20210313294
    • Publication date Oct 7, 2021
    • Chau Fatt Chiang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20210134762
    • Publication date May 6, 2021
    • Rohm Co., Ltd.
    • Kenji HAYASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Multi-Chip Package
    • Publication number 20210074614
    • Publication date Mar 11, 2021
    • Ralf Otremba
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POWER SEMICONDUCTOR DEVICE
    • Publication number 20210074647
    • Publication date Mar 11, 2021
    • Hitachi Automotive Systems, Ltd.
    • Takashi HIRAO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC POWER MODULE
    • Publication number 20180358282
    • Publication date Dec 13, 2018
    • Audi AG
    • Andreas APELSMEIER
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
    • Publication number 20180247884
    • Publication date Aug 30, 2018
    • RENESAS ELECTRONICS CORPORATION
    • Kazunori HASEGAWA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CLIP AND RELATED METHODS
    • Publication number 20180197836
    • Publication date Jul 12, 2018
    • Semiconductor Components Industries, LLC
    • Chee Hiong CHEW
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POWER MODULE AND FABRICATION METHOD FOR THE SAME
    • Publication number 20180090338
    • Publication date Mar 29, 2018
    • ROHM CO., LTD.
    • Katsuhiko YOSHIHARA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR MODULE
    • Publication number 20170084568
    • Publication date Mar 23, 2017
    • Mitsubishi Electric Corporation
    • Masakazu TANI
    • H01 - BASIC ELECTRIC ELEMENTS