with an intermediate bond

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H01L2224/48132

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/48132with an intermediate bond

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,113,104
- Issue date Oct 8, 2024
- Sumitomo Electric Industries, Ltd.
- Koshi Hamano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a dummy pad
- Patent number 11,948,913
- Issue date Apr 2, 2024
- Samsung Electronics Co., Ltd.
- Seunghyun Baik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 11,532,590
- Issue date Dec 20, 2022
- Mitsubishi Electric Corporation
- Hiroyuki Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for testing a high voltage transistor with a field plate
- Patent number 11,302,785
- Issue date Apr 12, 2022
- Texas Instruments Incorporated
- Ramana Tadepalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device and method of manufacturing the same
- Patent number 11,264,303
- Issue date Mar 1, 2022
- Mitsubishi Electric Corporation
- Shinya Nakagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor chip, and test method for semic...
- Patent number 10,600,698
- Issue date Mar 24, 2020
- Lapis Semiconductor Co., Ltd.
- Hideki Masai
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device, semiconductor chip, and test method for semic...
- Patent number 10,199,292
- Issue date Feb 5, 2019
- Lapis Semiconductor Co., Ltd.
- Hideki Masai
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor package and fabrication method thereof
- Patent number 10,192,834
- Issue date Jan 29, 2019
- Siliconware Precision Industries Co., Ltd.
- Fu-Tang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device
- Patent number 9,881,892
- Issue date Jan 30, 2018
- Novatek Microelectronics Corp.
- Jung-Fu Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation device
- Patent number 9,824,965
- Issue date Nov 21, 2017
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Qian Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit layout structure
- Patent number 9,673,145
- Issue date Jun 6, 2017
- United Microelectronics Corp.
- Shih-Chin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,530,766
- Issue date Dec 27, 2016
- Mitsubishi Electric Corporation
- Mikio Ishihara
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Power semiconductor package with conductive clip
- Patent number 9,118,126
- Issue date Aug 25, 2015
- International Rectifier Corporation
- Hsueh-Rong Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including cladded base plate
- Patent number 8,963,321
- Issue date Feb 24, 2015
- Infineon Technologies AG
- Andreas Lenniger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 8,921,998
- Issue date Dec 30, 2014
- Nissan Motor Co., Ltd.
- Yusuke Zushi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,836,150
- Issue date Sep 16, 2014
- Toyota Jidosha Kabushiki Kaisha
- Hiroaki Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for interconnecting electrical device to a module
- Patent number 8,567,049
- Issue date Oct 29, 2013
- Raytheon Company
- Keith V. Guinn
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device including cladded base plate
- Patent number 8,519,532
- Issue date Aug 27, 2013
- Infineon Technologies AG
- Andreas Lenniger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module having an insert and method for producing a se...
- Patent number 8,446,726
- Issue date May 21, 2013
- Infineon Technologies AG
- Ralf Schloerke
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor arrangement
- Patent number 8,441,128
- Issue date May 14, 2013
- Infineon Technologies AG
- Daniel Domes
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
IGBT power semiconductor package having a conductive clip
- Patent number 8,354,733
- Issue date Jan 15, 2013
- International Rectifier Corporation
- Hsueh-Rong Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 8,253,247
- Issue date Aug 28, 2012
- Renesas Electronics Corporation
- Noriko Numata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating method, semiconductor device fabrication method and circuit...
- Patent number 8,058,110
- Issue date Nov 15, 2011
- Fujitsu Limited
- Masataka Mizukoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal foil interconnection of electrical devices
- Patent number 8,009,439
- Issue date Aug 30, 2011
- Raytheon Company
- Keith V. Guinn
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Plating method, semiconductor device fabrication method and circuit...
- Patent number 7,927,998
- Issue date Apr 19, 2011
- Fujitsu Limited
- Masataka Mizukoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor component with improved contact pad and method for fo...
- Patent number 7,884,488
- Issue date Feb 8, 2011
- Qimonda AG
- Harry Hedler
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Plating method, semiconductor device fabrication method and circuit...
- Patent number 7,670,940
- Issue date Mar 2, 2010
- Fujitsu Limited
- Masataka Mizukoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Probe for semiconductor devices
- Patent number 7,084,656
- Issue date Aug 1, 2006
- FormFactor, Inc.
- Igor Y. Khandros
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor integrated circuit device with enhanced protection fr...
- Patent number 6,339,234
- Issue date Jan 15, 2002
- Rohm Co., Ltd.
- Noboru Takizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device and electronic device module includin...
- Patent number 5,198,964
- Issue date Mar 30, 1993
- Hitachi, Ltd.
- Mamoru Ito
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LEADFRAME AND SEMICONDUCTOR DEVICE
- Publication number 20240421050
- Publication date Dec 19, 2024
- Shinko Electric Industries Co., Ltd.
- Etsuo UEMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE
- Publication number 20240297100
- Publication date Sep 5, 2024
- Fuji Electric Co., Ltd.
- Ryusuke KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES WITH DOWNSET
- Publication number 20240282751
- Publication date Aug 22, 2024
- Micron Technology, Inc.
- Ling Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240258208
- Publication date Aug 1, 2024
- Rohm Co., Ltd.
- Hajime OKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUFFER CHIP, AND SEMICONDUCTOR PACKAGE INCLUDING THE BUFFER CHIP AN...
- Publication number 20240249753
- Publication date Jul 25, 2024
- SK HYNIX INC.
- Choung Ki SONG
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240178192
- Publication date May 30, 2024
- KIOXIA Corporation
- Yasuo TAKEMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE PACKAGE HAVING SCRIBE LINE AND METHOD FOR MANUFACTURI...
- Publication number 20240170410
- Publication date May 23, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE PACKAGE HAVING SCRIBE LINE AND METHOD FOR MANUFACTURI...
- Publication number 20240170412
- Publication date May 23, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NAND DIE WITH WIRE-BOND INDUCTIVE COMPENSATION FOR ALTERED BOND WIR...
- Publication number 20240145424
- Publication date May 2, 2024
- Western Digital Technologies, Inc.
- John Contreras
- G11 - INFORMATION STORAGE
Information Patent Application
ISOLATED POWER CHIP BASED ON WAFER LEVEL PACKAGING AND METHOD OF MA...
- Publication number 20240014126
- Publication date Jan 11, 2024
- UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA
- Lin CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE ENCAPSULANT WITH METAL ACTIVATED INORGANIC FI...
- Publication number 20230420319
- Publication date Dec 28, 2023
- INFINEON TECHNOLOGIES AG
- Qun YE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A DUMMY PAD
- Publication number 20220328453
- Publication date Oct 13, 2022
- Samsung Electronics Co., Ltd.
- Seunghyun Baik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200357719
- Publication date Nov 12, 2020
- Mitsubishi Electric Corporation
- Shinya NAKAGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20200328178
- Publication date Oct 15, 2020
- Mitsubishi Electric Corporation
- Hiroyuki MASUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND DRIVE CIRCUIT
- Publication number 20190326248
- Publication date Oct 24, 2019
- Kabushiki Kaisha Toshiba
- Masahiko HORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR CHIP, AND TEST METHOD FOR SEMIC...
- Publication number 20170316990
- Publication date Nov 2, 2017
- LAPIS SEMICONDUCTOR CO., LTD.
- Hideki MASAI
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED CIRCUIT DEVICE
- Publication number 20170133343
- Publication date May 11, 2017
- NOVATEK MICROELECTRONICS CORP.
- Jung-Fu Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION DEVICE
- Publication number 20170117217
- Publication date Apr 27, 2017
- Avago Technologies General IP (Singapore) PTE. LTD.
- Qian Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT LAYOUT STRUCTURE
- Publication number 20160329276
- Publication date Nov 10, 2016
- UNITED MICROELECTRONICS CORP.
- Shih-Chin LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20140191376
- Publication date Jul 10, 2014
- Siliconware Precision Industries Co., Ltd.
- Fu-Tang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20140159225
- Publication date Jun 12, 2014
- NISSAN MOTOR CO., LTD.
- Yusuke Zushi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130241084
- Publication date Sep 19, 2013
- Toyota Jidosha Kabushiki Kaisha
- Hiroaki Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Package with Conductive Clip
- Publication number 20130140602
- Publication date Jun 6, 2013
- International Rectifier Corporation
- Hsueh-Rong Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING CLADDED BASE PLATE
- Publication number 20130134572
- Publication date May 30, 2013
- INFINEON TECHNOLOGIES AG
- Andreas Lenniger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING CLADDED BASE PLATE
- Publication number 20130062750
- Publication date Mar 14, 2013
- INFINEON TECHNOLOGIES AG
- Andreas Lenniger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Arrangement
- Publication number 20130043593
- Publication date Feb 21, 2013
- INFINEON TECHNOLOGIES AG
- Daniel Domes
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
IGBT Power Semiconductor Package Having a Conductive Clip
- Publication number 20120223415
- Publication date Sep 6, 2012
- INTERNATIONAL RECTIFIER CORPORATION
- Hsueh-Rong Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE HAVING AN INSERT AND METHOD FOR PRODUCING A SE...
- Publication number 20120106086
- Publication date May 3, 2012
- INFINEON TECHNOLOGIES AG
- Ralf Schloerke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal foil interconnection of electrical devices
- Publication number 20110278350
- Publication date Nov 17, 2011
- Keith V. Guinn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATING METHOD, SEMICONDUCTOR DEVICE FABRICATION METHOD AND CIRCUIT...
- Publication number 20110168564
- Publication date Jul 14, 2011
- Fujitsu Limited
- Masataka Mizukoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

with an intermediate bond

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Semiconductor package including a dummy pad

Semiconductor device and method for manufacturing semiconductor device

Method for testing a high voltage transistor with a field plate

Power semiconductor device and method of manufacturing the same

Semiconductor device, semiconductor chip, and test method for semic...

Semiconductor device, semiconductor chip, and test method for semic...

Semiconductor package and fabrication method thereof

Integrated circuit device

Isolation device

Semiconductor integrated circuit layout structure

Semiconductor device

Power semiconductor package with conductive clip

Semiconductor device including cladded base plate

Semiconductor module

Semiconductor device

Method for interconnecting electrical device to a module

Semiconductor device including cladded base plate

Semiconductor module having an insert and method for producing a se...

Semiconductor arrangement

IGBT power semiconductor package having a conductive clip

Semiconductor device and method for manufacturing the same

Plating method, semiconductor device fabrication method and circuit...

Metal foil interconnection of electrical devices

Plating method, semiconductor device fabrication method and circuit...

Semiconductor component with improved contact pad and method for fo...

Plating method, semiconductor device fabrication method and circuit...

Probe for semiconductor devices

Semiconductor integrated circuit device with enhanced protection fr...

Packaged semiconductor device and electronic device module includin...

Patents Applicationslast 30 patents

LEADFRAME AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE

SUBSTRATES WITH DOWNSET

SEMICONDUCTOR DEVICE

BUFFER CHIP, AND SEMICONDUCTOR PACKAGE INCLUDING THE BUFFER CHIP AN...

SEMICONDUCTOR DEVICE

MEMORY DEVICE PACKAGE HAVING SCRIBE LINE AND METHOD FOR MANUFACTURI...

MEMORY DEVICE PACKAGE HAVING SCRIBE LINE AND METHOD FOR MANUFACTURI...

NAND DIE WITH WIRE-BOND INDUCTIVE COMPENSATION FOR ALTERED BOND WIR...

ISOLATED POWER CHIP BASED ON WAFER LEVEL PACKAGING AND METHOD OF MA...

SEMICONDUCTOR PACKAGE ENCAPSULANT WITH METAL ACTIVATED INORGANIC FI...

SEMICONDUCTOR PACKAGE INCLUDING A DUMMY PAD

POWER SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND DRIVE CIRCUIT

SEMICONDUCTOR DEVICE, SEMICONDUCTOR CHIP, AND TEST METHOD FOR SEMIC...

INTEGRATED CIRCUIT DEVICE

ISOLATION DEVICE

SEMICONDUCTOR INTEGRATED CIRCUIT LAYOUT STRUCTURE

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE

Power Semiconductor Package with Conductive Clip

SEMICONDUCTOR DEVICE INCLUDING CLADDED BASE PLATE

SEMICONDUCTOR DEVICE INCLUDING CLADDED BASE PLATE

Semiconductor Arrangement

IGBT Power Semiconductor Package Having a Conductive Clip

SEMICONDUCTOR MODULE HAVING AN INSERT AND METHOD FOR PRODUCING A SE...

Metal foil interconnection of electrical devices

PLATING METHOD, SEMICONDUCTOR DEVICE FABRICATION METHOD AND CIRCUIT...