with antimony or bismuth as the next major constituent

Industry

CPC
C22C13/02

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Parent Industries

CCHEMISTRY METALLURGY C22Metallurgy C22CALLOYS C22C13/00Alloys based on tin

Current Industry

C22C13/02with antimony or bismuth as the next major constituent

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Solder material
- Patent number 12,296,409
- Issue date May 13, 2025
- Fuji Electric Co., Ltd.
- Hirohiko Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Anisotropic conductive film and method for producing the anisotropi...
- Patent number 12,247,270
- Issue date Mar 11, 2025
- Resonac Corporation
- Kunihiko Akai
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
SnIn solder alloys
- Patent number 12,240,060
- Issue date Mar 4, 2025
- Indium Corporation
- Francis M. Mutuku
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder alloy, solder ball, solder paste, and solder joint
- Patent number 12,109,653
- Issue date Oct 8, 2024
- Senju Metal Industry Co., Ltd.
- Takahiro Matsufuji
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High reliability lead-free solder alloys for harsh environment elec...
- Patent number 12,090,579
- Issue date Sep 17, 2024
- Indium Corporation
- Weiping Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder alloy, solder paste, solder ball, solder preform, solder joi...
- Patent number 12,053,843
- Issue date Aug 6, 2024
- Senju Metal Industry Co., Ltd.
- Shunsaku Yoshikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free solder alloy and method of manufacturing electronic devic...
- Patent number 12,030,140
- Issue date Jul 9, 2024
- MK Electron Co., Ltd.
- Young Woo Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device for the treatment and elimination of bacteria in hydrocarbon...
- Patent number 12,025,080
- Issue date Jul 2, 2024
- Rodrigo Coquis Sanchez-Concha
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Solder paste
- Patent number 12,017,306
- Issue date Jun 25, 2024
- Senju Metal Industry Co., Ltd.
- Takeshi Sakamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
SnBi and SnIn solder alloys
- Patent number 11,999,018
- Issue date Jun 4, 2024
- Indium Corporation
- Francis M. Mutuku
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder alloy, solder paste, solder preform and solder joint
- Patent number 11,911,854
- Issue date Feb 27, 2024
- Senju Metal Industry Co., Ltd.
- Yoshie Tachibana
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tin production, which includes a composition comprising tin, lead,...
- Patent number 11,913,091
- Issue date Feb 27, 2024
- METALLO BELGIUM
- Bert Coletti
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cold storage material and cold storage type cryogenic refrigerator...
- Patent number 11,906,228
- Issue date Feb 20, 2024
- CSIC PRIDE (NANJING) CRYOGENIC TECHNOLOGY CO., LTD.
- Zhipo Zhou
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Core material, electronic component and method for forming bump ele...
- Patent number 11,872,656
- Issue date Jan 16, 2024
- Senju Metal Industry Co., Ltd.
- Shigeki Kondoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder alloy, solder paste, solder ball, solder preform, and solder...
- Patent number 11,858,071
- Issue date Jan 2, 2024
- Senju Metal Industry Co., Ltd.
- Yoshie Tachibana
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder material
- Patent number 11,850,685
- Issue date Dec 26, 2023
- Fuji Electric Co., Ltd.
- Hirohiko Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free solder alloy and solder joint part
- Patent number 11,839,937
- Issue date Dec 12, 2023
- Nihon Superior Co., Ltd.
- Tetsuro Nishimura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder composition for use in solder joints of printed circuit boards
- Patent number 11,832,386
- Issue date Nov 28, 2023
- Dell Products L.P.
- Deeder M. Aurongzeb
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding member and bonding method
- Patent number 11,819,915
- Issue date Nov 21, 2023
- Murata Manufacturing Co., Ltd.
- Seitaro Washizuka
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Solder alloy, solder paste, solder ball, solder preform, solder joi...
- Patent number 11,813,686
- Issue date Nov 14, 2023
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device including a solder compound containing a compo...
- Patent number 11,776,927
- Issue date Oct 3, 2023
- Infineon Technologies AG
- Thomas Behrens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High reliability lead-free solder alloy for electronic applications...
- Patent number 11,732,330
- Issue date Aug 22, 2023
- Alpha Assembly Solutions, Inc.
- Md Hasnine
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cost-effective lead-free solder alloy for electronic applications
- Patent number 11,724,342
- Issue date Aug 15, 2023
- Alpha Assembly Solutions Inc.
- Md Hasnine
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low temperature melting and mid temperature melting lead-free solde...
- Patent number 11,712,762
- Issue date Aug 1, 2023
- Indium Corporation
- Hongwen Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fuse element and protective element
- Patent number 11,640,892
- Issue date May 2, 2023
- SCHOTT JAPAN CORPORATION
- Shintaro Nakajima
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Solder joint
- Patent number 11,628,519
- Issue date Apr 18, 2023
- Lenovo (Singapore) Pte. Ltd.
- Ko Inaba
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder alloy, solder joint material, and electronic circuit board
- Patent number 11,607,752
- Issue date Mar 21, 2023
- KOKI COMPANY LIMITED
- Takehiro Wada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low-silver alternative to standard SAC alloys for high reliability...
- Patent number 11,577,343
- Issue date Feb 14, 2023
- Alpha Assembly Solutions Inc.
- Md Hasnine
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder alloy
- Patent number 11,577,344
- Issue date Feb 14, 2023
- Senju Metal Industry Co., Ltd.
- Yuuki Iijima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
SnBiSb series low-temperature lead-free solder and its preparation...
- Patent number 11,479,835
- Issue date Oct 25, 2022
- BEIJING COMPO ADVANCED TECHNOLOGY CO., LTD.
- Shaoming Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MICROMETER METAL PARTICLE REINFORCED TIN-BISMUTH LOW TEMPERATURE SO...
- Publication number 20250128362
- Publication date Apr 24, 2025
- Intel Corporation
- Rui Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMI-SOLID ALLOY THERMAL INTERFACE COMPOSITION AND METHOD FOR DISSI...
- Publication number 20250126754
- Publication date Apr 17, 2025
- National Cheng Kung University
- Shih-kang LIN
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
BONDING MATERIAL AND BONDING STRUCTURE
- Publication number 20250108463
- Publication date Apr 3, 2025
- Panasonic Intellectual Property Management Co., Ltd.
- KIYOHIRO HINE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER ALLOY, SOLDER JOINT, AND SEMICONDUCTOR PACKAGE INCLUDING SOL...
- Publication number 20250001529
- Publication date Jan 2, 2025
- DUKSAN HI-METAL CO., LTD.
- Eun Kwang PARK
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH RELIABILITY LEAD-FREE SOLDER ALLOYS FOR HARSH ENVIRONMENT ELEC...
- Publication number 20250001530
- Publication date Jan 2, 2025
- Indium Corporation
- Weiping Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder Alloy, Solder Ball, Solder Paste, and Solder Joint
- Publication number 20240424615
- Publication date Dec 26, 2024
- SENJU METAL INDUSTRY CO., LTD.
- Takahiro Matsufuji
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder Alloy, Solder Ball, Solder Preform, Solder Paste, and Solder...
- Publication number 20240399512
- Publication date Dec 5, 2024
- SENJU METAL INDUSTRY CO., LTD.
- Takahiro Yokoyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Lead-Free Solder Ball
- Publication number 20240363571
- Publication date Oct 31, 2024
- SENJU METAL INDUSTRY CO., LTD.
- Yoshie Yamanaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joi...
- Publication number 20240342838
- Publication date Oct 17, 2024
- SENJU METAL INDUSTRY CO., LTD.
- Shunsaku YOSHIKAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ALLOY
- Publication number 20240247340
- Publication date Jul 25, 2024
- Peter PRENOSIL
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAD-FREE SOLDER PASTE
- Publication number 20240238915
- Publication date Jul 18, 2024
- NIHON SUPERIOR CO., LTD.
- Tetsuro NISHIMURA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joi...
- Publication number 20240238913
- Publication date Jul 18, 2024
- SENJU METAL INDUSTRY CO., LTD.
- Takahiro Yokoyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joi...
- Publication number 20240238914
- Publication date Jul 18, 2024
- SENJU METAL INDUSTRY CO., LTD.
- Takahiro Yokoyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CORE MATERIAL, ELECTRONIC COMPONENT AND METHOD FOR FORMING BUMP ELE...
- Publication number 20240100635
- Publication date Mar 28, 2024
- SENJU METAL INDUSTRY CO., LTD.
- Shigeki Kondoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER MATERIAL
- Publication number 20240075559
- Publication date Mar 7, 2024
- Fuji Electric Co., Ltd.
- Hirohiko WATANABE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER ALLOY, JOINT PORTION, JOINING MATERIAL, SOLDER PASTE, JOINT...
- Publication number 20240066638
- Publication date Feb 29, 2024
- TAMURA CORPORATION
- Takanori SHIMAZAKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder Alloy, Solder Ball, Solder Paste, and Solder Joint
- Publication number 20240024990
- Publication date Jan 25, 2024
- SENJU METAL INDUSTRY CO., LTD.
- Takahiro Matsufuji
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER ALLOY, SOLDER BALL AND SOLDER JOINT
- Publication number 20230398643
- Publication date Dec 14, 2023
- SENJU METAL INDUSTRY CO., LTD
- Yuki IIJIMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COST-EFFECTIVE LEAD-FREE SOLDER ALLOY FOR ELECTRONIC APPLICATIONS
- Publication number 20230356333
- Publication date Nov 9, 2023
- Alpha Assembly Solutions Inc.
- Md Hasnine
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH RELIABILITY LEAD-FREE SOLDER ALLOY FOR ELECTRONIC APPLICATIONS...
- Publication number 20230340642
- Publication date Oct 26, 2023
- Alpha Assembly Solutions Inc.
- Md Hasnine
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAD-FREE AND ANTIMONY-FREE TIN SOLDER RELIABLE AT HIGH TEMPERATURES
- Publication number 20230330788
- Publication date Oct 19, 2023
- Alpha Assembly Solutions Inc.
- Pritha Choudhury
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER COMPOSITION FOR USE IN SOLDER JOINTS OF PRINTED CIRCUIT BOARDS
- Publication number 20230199949
- Publication date Jun 22, 2023
- Dell Products L.P.
- Deeder M. Aurongzeb
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER ALLOY, SOLDER BONDING MATERIAL, SOLDER PASTE, AND SEMICONDUC...
- Publication number 20230166363
- Publication date Jun 1, 2023
- TAMURA CORPORATION
- Shouichirou NARUSE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230130647
- Publication date Apr 27, 2023
- DENSO CORPORATION
- Tetsuto YAMAGISHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder Alloy, Solder Paste, Solder Ball, Solder Preform, and Solder...
- Publication number 20230127584
- Publication date Apr 27, 2023
- SENJU METAL INDUSTRY CO., LTD.
- Yoshie Tachibana
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAD-FREE SOLDER ALLOY AND METHOD OF MANUFACTURING ELECTRONIC DEVIC...
- Publication number 20230111798
- Publication date Apr 13, 2023
- MK ELECTRON CO., LTD.
- Young Woo LEE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Lead-Free and Antimony-Free Solder Alloy, Solder Ball, and Solder J...
- Publication number 20230068294
- Publication date Mar 2, 2023
- SENJU METAL INDUSTRY CO., LTD.
- Yuuki IIJIMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SN-BI-IN-BASED LOW MELTING-POINT JOINING MEMBER, PRODUCTION METHOD...
- Publication number 20220395935
- Publication date Dec 15, 2022
- SHINRYO CORPORATION
- Hirotoshi NISHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH RELIABILITY LEAD-FREE SOLDER PASTES WITH MIXED SOLDER ALLOY PO...
- Publication number 20220395936
- Publication date Dec 15, 2022
- Indium Corporation
- Jie Geng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SNIN SOLDER ALLOYS
- Publication number 20220362890
- Publication date Nov 17, 2022
- Indium Corporation
- Francis M. Mutuku
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

with antimony or bismuth as the next major constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Solder material

Anisotropic conductive film and method for producing the anisotropi...

SnIn solder alloys

Solder alloy, solder ball, solder paste, and solder joint

High reliability lead-free solder alloys for harsh environment elec...

Solder alloy, solder paste, solder ball, solder preform, solder joi...

Lead-free solder alloy and method of manufacturing electronic devic...

Device for the treatment and elimination of bacteria in hydrocarbon...

Solder paste

SnBi and SnIn solder alloys

Solder alloy, solder paste, solder preform and solder joint

Tin production, which includes a composition comprising tin, lead,...

Cold storage material and cold storage type cryogenic refrigerator...

Core material, electronic component and method for forming bump ele...

Solder alloy, solder paste, solder ball, solder preform, and solder...

Solder material

Lead-free solder alloy and solder joint part

Solder composition for use in solder joints of printed circuit boards

Bonding member and bonding method

Solder alloy, solder paste, solder ball, solder preform, solder joi...

Semiconductor device including a solder compound containing a compo...

High reliability lead-free solder alloy for electronic applications...

Cost-effective lead-free solder alloy for electronic applications

Low temperature melting and mid temperature melting lead-free solde...

Fuse element and protective element

Solder joint

Solder alloy, solder joint material, and electronic circuit board

Low-silver alternative to standard SAC alloys for high reliability...

Solder alloy

SnBiSb series low-temperature lead-free solder and its preparation...

Patents Applicationslast 30 patents

MICROMETER METAL PARTICLE REINFORCED TIN-BISMUTH LOW TEMPERATURE SO...

SEMI-SOLID ALLOY THERMAL INTERFACE COMPOSITION AND METHOD FOR DISSI...

BONDING MATERIAL AND BONDING STRUCTURE

SOLDER ALLOY, SOLDER JOINT, AND SEMICONDUCTOR PACKAGE INCLUDING SOL...

HIGH RELIABILITY LEAD-FREE SOLDER ALLOYS FOR HARSH ENVIRONMENT ELEC...

Solder Alloy, Solder Ball, Solder Paste, and Solder Joint

Solder Alloy, Solder Ball, Solder Preform, Solder Paste, and Solder...

Lead-Free Solder Ball

Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joi...

ALLOY

LEAD-FREE SOLDER PASTE

Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joi...

Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joi...

CORE MATERIAL, ELECTRONIC COMPONENT AND METHOD FOR FORMING BUMP ELE...

SOLDER MATERIAL

SOLDER ALLOY, JOINT PORTION, JOINING MATERIAL, SOLDER PASTE, JOINT...

Solder Alloy, Solder Ball, Solder Paste, and Solder Joint

SOLDER ALLOY, SOLDER BALL AND SOLDER JOINT

COST-EFFECTIVE LEAD-FREE SOLDER ALLOY FOR ELECTRONIC APPLICATIONS

HIGH RELIABILITY LEAD-FREE SOLDER ALLOY FOR ELECTRONIC APPLICATIONS...

LEAD-FREE AND ANTIMONY-FREE TIN SOLDER RELIABLE AT HIGH TEMPERATURES

SOLDER COMPOSITION FOR USE IN SOLDER JOINTS OF PRINTED CIRCUIT BOARDS

SOLDER ALLOY, SOLDER BONDING MATERIAL, SOLDER PASTE, AND SEMICONDUC...

SEMICONDUCTOR DEVICE

Solder Alloy, Solder Paste, Solder Ball, Solder Preform, and Solder...

LEAD-FREE SOLDER ALLOY AND METHOD OF MANUFACTURING ELECTRONIC DEVIC...

Lead-Free and Antimony-Free Solder Alloy, Solder Ball, and Solder J...

SN-BI-IN-BASED LOW MELTING-POINT JOINING MEMBER, PRODUCTION METHOD...

HIGH RELIABILITY LEAD-FREE SOLDER PASTES WITH MIXED SOLDER ALLOY PO...

SNIN SOLDER ALLOYS