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with antimony or bismuth as the next major constituent
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C22C13/02
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CHEMISTRY METALLURGY
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Metallurgy
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ALLOYS
C22C13/00
Alloys based on tin
Current Industry
C22C13/02
with antimony or bismuth as the next major constituent
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last 30 patents
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Patent Grant
Solder alloy, solder ball, solder paste, and solder joint
Patent number
12,109,653
Issue date
Oct 8, 2024
Senju Metal Industry Co., Ltd.
Takahiro Matsufuji
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Patent Grant
High reliability lead-free solder alloys for harsh environment elec...
Patent number
12,090,579
Issue date
Sep 17, 2024
Indium Corporation
Weiping Liu
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Information
Patent Grant
Solder alloy, solder paste, solder ball, solder preform, solder joi...
Patent number
12,053,843
Issue date
Aug 6, 2024
Senju Metal Industry Co., Ltd.
Shunsaku Yoshikawa
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Patent Grant
Lead-free solder alloy and method of manufacturing electronic devic...
Patent number
12,030,140
Issue date
Jul 9, 2024
MK Electron Co., Ltd.
Young Woo Lee
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Patent Grant
Device for the treatment and elimination of bacteria in hydrocarbon...
Patent number
12,025,080
Issue date
Jul 2, 2024
Rodrigo Coquis Sanchez-Concha
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Grant
Solder paste
Patent number
12,017,306
Issue date
Jun 25, 2024
Senju Metal Industry Co., Ltd.
Takeshi Sakamoto
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Patent Grant
SnBi and SnIn solder alloys
Patent number
11,999,018
Issue date
Jun 4, 2024
Indium Corporation
Francis M. Mutuku
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Information
Patent Grant
Solder alloy, solder paste, solder preform and solder joint
Patent number
11,911,854
Issue date
Feb 27, 2024
Senju Metal Industry Co., Ltd.
Yoshie Tachibana
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Information
Patent Grant
Tin production, which includes a composition comprising tin, lead,...
Patent number
11,913,091
Issue date
Feb 27, 2024
METALLO BELGIUM
Bert Coletti
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Patent Grant
Cold storage material and cold storage type cryogenic refrigerator...
Patent number
11,906,228
Issue date
Feb 20, 2024
CSIC PRIDE (NANJING) CRYOGENIC TECHNOLOGY CO., LTD.
Zhipo Zhou
B22 - CASTING POWDER METALLURGY
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Patent Grant
Core material, electronic component and method for forming bump ele...
Patent number
11,872,656
Issue date
Jan 16, 2024
Senju Metal Industry Co., Ltd.
Shigeki Kondoh
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Information
Patent Grant
Solder alloy, solder paste, solder ball, solder preform, and solder...
Patent number
11,858,071
Issue date
Jan 2, 2024
Senju Metal Industry Co., Ltd.
Yoshie Tachibana
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Information
Patent Grant
Solder material
Patent number
11,850,685
Issue date
Dec 26, 2023
Fuji Electric Co., Ltd.
Hirohiko Watanabe
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Patent Grant
Lead-free solder alloy and solder joint part
Patent number
11,839,937
Issue date
Dec 12, 2023
Nihon Superior Co., Ltd.
Tetsuro Nishimura
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Patent Grant
Solder composition for use in solder joints of printed circuit boards
Patent number
11,832,386
Issue date
Nov 28, 2023
Dell Products L.P.
Deeder M. Aurongzeb
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Patent Grant
Bonding member and bonding method
Patent number
11,819,915
Issue date
Nov 21, 2023
Murata Manufacturing Co., Ltd.
Seitaro Washizuka
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Solder alloy, solder paste, solder ball, solder preform, solder joi...
Patent number
11,813,686
Issue date
Nov 14, 2023
Senju Metal Industry Co., Ltd.
Hiroyoshi Kawasaki
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Information
Patent Grant
Semiconductor device including a solder compound containing a compo...
Patent number
11,776,927
Issue date
Oct 3, 2023
Infineon Technologies AG
Thomas Behrens
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Patent Grant
High reliability lead-free solder alloy for electronic applications...
Patent number
11,732,330
Issue date
Aug 22, 2023
Alpha Assembly Solutions, Inc.
Md Hasnine
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Patent Grant
Cost-effective lead-free solder alloy for electronic applications
Patent number
11,724,342
Issue date
Aug 15, 2023
Alpha Assembly Solutions Inc.
Md Hasnine
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Information
Patent Grant
Low temperature melting and mid temperature melting lead-free solde...
Patent number
11,712,762
Issue date
Aug 1, 2023
Indium Corporation
Hongwen Zhang
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Information
Patent Grant
Fuse element and protective element
Patent number
11,640,892
Issue date
May 2, 2023
SCHOTT JAPAN CORPORATION
Shintaro Nakajima
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Grant
Solder joint
Patent number
11,628,519
Issue date
Apr 18, 2023
Lenovo (Singapore) Pte. Ltd.
Ko Inaba
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Patent Grant
Solder alloy, solder joint material, and electronic circuit board
Patent number
11,607,752
Issue date
Mar 21, 2023
KOKI COMPANY LIMITED
Takehiro Wada
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Information
Patent Grant
Low-silver alternative to standard SAC alloys for high reliability...
Patent number
11,577,343
Issue date
Feb 14, 2023
Alpha Assembly Solutions Inc.
Md Hasnine
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Information
Patent Grant
Solder alloy
Patent number
11,577,344
Issue date
Feb 14, 2023
Senju Metal Industry Co., Ltd.
Yuuki Iijima
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Information
Patent Grant
SnBiSb series low-temperature lead-free solder and its preparation...
Patent number
11,479,835
Issue date
Oct 25, 2022
BEIJING COMPO ADVANCED TECHNOLOGY CO., LTD.
Shaoming Zhang
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Patent Grant
Metal particle-containing composition and electrically conductive a...
Patent number
11,466,181
Issue date
Oct 11, 2022
Furukawa Electric Co., Ltd.
Norzafriza Nitta
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Information
Patent Grant
Solder alloy, solder ball, chip solder, solder paste and solder joint
Patent number
11,465,244
Issue date
Oct 11, 2022
Senju Metal Industry Co., Ltd.
Ken Tachibana
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Patent Grant
Solder paste using a solder paste flux and solder powder
Patent number
11,425,825
Issue date
Aug 23, 2022
KOKI COMPANY LIMITED
Yuki Yamamoto
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Patents Applications
last 30 patents
Information
Patent Application
SOLDER ALLOY, SOLDER JOINT, AND SEMICONDUCTOR PACKAGE INCLUDING SOL...
Publication number
20250001529
Publication date
Jan 2, 2025
DUKSAN HI-METAL CO., LTD.
Eun Kwang PARK
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Patent Application
HIGH RELIABILITY LEAD-FREE SOLDER ALLOYS FOR HARSH ENVIRONMENT ELEC...
Publication number
20250001530
Publication date
Jan 2, 2025
Indium Corporation
Weiping Liu
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Information
Patent Application
Solder Alloy, Solder Ball, Solder Paste, and Solder Joint
Publication number
20240424615
Publication date
Dec 26, 2024
SENJU METAL INDUSTRY CO., LTD.
Takahiro Matsufuji
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Information
Patent Application
Solder Alloy, Solder Ball, Solder Preform, Solder Paste, and Solder...
Publication number
20240399512
Publication date
Dec 5, 2024
SENJU METAL INDUSTRY CO., LTD.
Takahiro Yokoyama
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Information
Patent Application
Lead-Free Solder Ball
Publication number
20240363571
Publication date
Oct 31, 2024
SENJU METAL INDUSTRY CO., LTD.
Yoshie Yamanaka
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Information
Patent Application
Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joi...
Publication number
20240342838
Publication date
Oct 17, 2024
SENJU METAL INDUSTRY CO., LTD.
Shunsaku YOSHIKAWA
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Information
Patent Application
ALLOY
Publication number
20240247340
Publication date
Jul 25, 2024
Peter PRENOSIL
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Information
Patent Application
LEAD-FREE SOLDER PASTE
Publication number
20240238915
Publication date
Jul 18, 2024
NIHON SUPERIOR CO., LTD.
Tetsuro NISHIMURA
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Information
Patent Application
Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joi...
Publication number
20240238913
Publication date
Jul 18, 2024
SENJU METAL INDUSTRY CO., LTD.
Takahiro Yokoyama
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Information
Patent Application
Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joi...
Publication number
20240238914
Publication date
Jul 18, 2024
SENJU METAL INDUSTRY CO., LTD.
Takahiro Yokoyama
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Information
Patent Application
CORE MATERIAL, ELECTRONIC COMPONENT AND METHOD FOR FORMING BUMP ELE...
Publication number
20240100635
Publication date
Mar 28, 2024
SENJU METAL INDUSTRY CO., LTD.
Shigeki Kondoh
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Information
Patent Application
SOLDER MATERIAL
Publication number
20240075559
Publication date
Mar 7, 2024
Fuji Electric Co., Ltd.
Hirohiko WATANABE
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Information
Patent Application
SOLDER ALLOY, JOINT PORTION, JOINING MATERIAL, SOLDER PASTE, JOINT...
Publication number
20240066638
Publication date
Feb 29, 2024
TAMURA CORPORATION
Takanori SHIMAZAKI
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Information
Patent Application
Solder Alloy, Solder Ball, Solder Paste, and Solder Joint
Publication number
20240024990
Publication date
Jan 25, 2024
SENJU METAL INDUSTRY CO., LTD.
Takahiro Matsufuji
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Information
Patent Application
SOLDER ALLOY, SOLDER BALL AND SOLDER JOINT
Publication number
20230398643
Publication date
Dec 14, 2023
SENJU METAL INDUSTRY CO., LTD
Yuki IIJIMA
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Information
Patent Application
COST-EFFECTIVE LEAD-FREE SOLDER ALLOY FOR ELECTRONIC APPLICATIONS
Publication number
20230356333
Publication date
Nov 9, 2023
Alpha Assembly Solutions Inc.
Md Hasnine
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Information
Patent Application
HIGH RELIABILITY LEAD-FREE SOLDER ALLOY FOR ELECTRONIC APPLICATIONS...
Publication number
20230340642
Publication date
Oct 26, 2023
Alpha Assembly Solutions Inc.
Md Hasnine
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Information
Patent Application
LEAD-FREE AND ANTIMONY-FREE TIN SOLDER RELIABLE AT HIGH TEMPERATURES
Publication number
20230330788
Publication date
Oct 19, 2023
Alpha Assembly Solutions Inc.
Pritha Choudhury
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Patent Application
SOLDER COMPOSITION FOR USE IN SOLDER JOINTS OF PRINTED CIRCUIT BOARDS
Publication number
20230199949
Publication date
Jun 22, 2023
Dell Products L.P.
Deeder M. Aurongzeb
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Information
Patent Application
SOLDER ALLOY, SOLDER BONDING MATERIAL, SOLDER PASTE, AND SEMICONDUC...
Publication number
20230166363
Publication date
Jun 1, 2023
TAMURA CORPORATION
Shouichirou NARUSE
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Patent Application
SEMICONDUCTOR DEVICE
Publication number
20230130647
Publication date
Apr 27, 2023
DENSO CORPORATION
Tetsuto YAMAGISHI
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Information
Patent Application
Solder Alloy, Solder Paste, Solder Ball, Solder Preform, and Solder...
Publication number
20230127584
Publication date
Apr 27, 2023
SENJU METAL INDUSTRY CO., LTD.
Yoshie Tachibana
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Information
Patent Application
LEAD-FREE SOLDER ALLOY AND METHOD OF MANUFACTURING ELECTRONIC DEVIC...
Publication number
20230111798
Publication date
Apr 13, 2023
MK ELECTRON CO., LTD.
Young Woo LEE
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Patent Application
Lead-Free and Antimony-Free Solder Alloy, Solder Ball, and Solder J...
Publication number
20230068294
Publication date
Mar 2, 2023
SENJU METAL INDUSTRY CO., LTD.
Yuuki IIJIMA
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Information
Patent Application
SN-BI-IN-BASED LOW MELTING-POINT JOINING MEMBER, PRODUCTION METHOD...
Publication number
20220395935
Publication date
Dec 15, 2022
SHINRYO CORPORATION
Hirotoshi NISHI
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Patent Application
HIGH RELIABILITY LEAD-FREE SOLDER PASTES WITH MIXED SOLDER ALLOY PO...
Publication number
20220395936
Publication date
Dec 15, 2022
Indium Corporation
Jie Geng
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Patent Application
SNIN SOLDER ALLOYS
Publication number
20220362890
Publication date
Nov 17, 2022
Indium Corporation
Francis M. Mutuku
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Patent Application
SOLDER ALLOY, SOLDER PASTE, SOLDER BALL, SOLDER PREFORM, SOLDER JOI...
Publication number
20220355420
Publication date
Nov 10, 2022
SENJU METAL INDUSTRY CO., LTD.
Shunsaku YOSHIKAWA
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Patent Application
HIGH RELIABILITY LEAD-FREE SOLDER ALLOYS FOR HARSH ENVIRONMENT ELEC...
Publication number
20220331913
Publication date
Oct 20, 2022
Indium Corporation
Weiping Liu
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Patent Application
METHOD FOR PRODUCING A PRE-TINNING ARRANGEMENT AND PRE-TINNING ARRA...
Publication number
20220256714
Publication date
Aug 11, 2022
Few Fahrzeugelektrik Werk GMBH & CO. KG
Hendrik Niemann
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