with apertures for inspecting the surface to be abraded

Industry

CPC
B24D7/12

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B24Grinding technology B24DTOOLS FOR GRINDING, BUFFING, OR SHARPENING B24D7/00Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery

Current Industry

B24D7/12with apertures for inspecting the surface to be abraded

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Processing end point detection method, polishing method, and polish...
- Patent number 10,207,390
- Issue date Feb 19, 2019
- TOSHIBA MEMORY CORPORATION
- Noburu Shimizu
- B24 - GRINDING POLISHING
Information Patent Grant
Peak-based endpointing for chemical mechanical polishing
- Patent number 9,564,377
- Issue date Feb 7, 2017
- Applied Materials, Inc.
- Dominic J. Benvegnu
- B24 - GRINDING POLISHING
Information Patent Grant
Double-side polishing apparatus
- Patent number 9,108,289
- Issue date Aug 18, 2015
- Shin-Etsu Handotai Co., Ltd.
- Daisuke Furukawa
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer polishing method and double-side polishing apparatus
- Patent number 8,834,230
- Issue date Sep 16, 2014
- Shin-Etsu Handotai Co., Ltd.
- Daisuke Furukawa
- B24 - GRINDING POLISHING
Information Patent Grant
Peak-based endpointing for chemical mechanical polishing
- Patent number 8,591,698
- Issue date Nov 26, 2013
- Applied Materials, Inc.
- Dominic J. Benvegnu
- B24 - GRINDING POLISHING
Information Patent Grant
Peak-based endpointing for chemical mechanical polishing
- Patent number 7,998,358
- Issue date Aug 16, 2011
- Applied Materials, Inc.
- Dominic J. Benvegnu
- B24 - GRINDING POLISHING
Information Patent Grant
Grinding disc for grinding machines
- Patent number 7,458,884
- Issue date Dec 2, 2008
- UFI Schleiftechnik GmbH & Co. KG
- Ulrich Falk
- B24 - GRINDING POLISHING
Information Patent Grant
Grinding or polishing arrangement
- Patent number 7,377,837
- Issue date May 27, 2008
- Raffi Piliguian
- B24 - GRINDING POLISHING
Information Patent Grant
Reducing polishing pad deformation
- Patent number 7,354,334
- Issue date Apr 8, 2008
- Applied Materials, Inc.
- Manoocher Birang
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing apparatus with rotating belt
- Patent number 7,303,467
- Issue date Dec 4, 2007
- Applied Materials, Inc.
- Manoocher Birang
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatuses and methods for in-situ optical endpointing on web-form...
- Patent number 7,229,338
- Issue date Jun 12, 2007
- Micron Technology, Inc.
- Vishnu K. Agarwal
- B24 - GRINDING POLISHING
Information Patent Grant
CMP pad having a streamlined windowpane
- Patent number 7,182,670
- Issue date Feb 27, 2007
- Rohm and Haas Electronic Materials CMP Holdings, Inc.
- Gregory P. Muldowney
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing apparatus with rotating belt
- Patent number 7,104,875
- Issue date Sep 12, 2006
- Applied Materials, Inc.
- Manoocher Birang
- B24 - GRINDING POLISHING
Information Patent Grant
Method for monitoring a substrate during chemical mechanical polishing
- Patent number 7,018,271
- Issue date Mar 28, 2006
- Applied Materials Inc.
- Andreas Norbert Wiswesser
- B24 - GRINDING POLISHING
Information Patent Grant
Ultrasonic welding method for the manufacture of a polishing pad co...
- Patent number 6,997,777
- Issue date Feb 14, 2006
- Cabot Microelectronics Corporation
- Kelly J. Newell
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatuses for in-situ optical endpointing on web-format planarizi...
- Patent number 6,986,700
- Issue date Jan 17, 2006
- Micron Technology, Inc.
- Vishnu K. Agarwal
- B24 - GRINDING POLISHING
Information Patent Grant
Grinding wheel
- Patent number 6,926,583
- Issue date Aug 9, 2005
- Hilti Aktiengesellschaft
- Josef Nussbaumer
- B24 - GRINDING POLISHING
Information Patent Grant
Multizone carrier with process monitoring system for chemical-mecha...
- Patent number 6,923,711
- Issue date Aug 2, 2005
- SpeedFam-IPEC Corporation
- Thomas Laursen
- B24 - GRINDING POLISHING
Information Patent Grant
Planarizing machines and control systems for mechanical and/or chem...
- Patent number 6,922,253
- Issue date Jul 26, 2005
- Micron Technology, Inc.
- Scott E. Moore
- B24 - GRINDING POLISHING
Information Patent Grant
Monitor, method of monitoring, polishing device, and method of manu...
- Patent number 6,916,225
- Issue date Jul 12, 2005
- Nikon Corporation
- Yoshikazu Sugiyama
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical-mechanical polishing apparatus and method for controlling...
- Patent number 6,911,662
- Issue date Jun 28, 2005
- Samsung Electronics Co., Ltd.
- Kyoung-Woo Kim
- B24 - GRINDING POLISHING
Information Patent Grant
Abrasive wheels with workpiece vision feature
- Patent number 6,846,223
- Issue date Jan 25, 2005
- Saint-Gobain Abrasives Technology Company
- Karen M. Conley
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for measuring substrate layer thickness during...
- Patent number 6,764,380
- Issue date Jul 20, 2004
- Applied Materials Inc.
- Andreas Norbert Wiswesser
- B24 - GRINDING POLISHING
Information Patent Grant
Backing plate and disc configured for blowing angled grinding
- Patent number 6,758,732
- Issue date Jul 6, 2004
- Mark A. Hilton
- B24 - GRINDING POLISHING
Information Patent Grant
Knife sharpener
- Patent number 6,752,702
- Issue date Jun 22, 2004
- Ted Thompson
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing apparatus with rotating belt
- Patent number 6,729,944
- Issue date May 4, 2004
- Applied Materials Inc.
- Manoocher Birang
- B24 - GRINDING POLISHING
Information Patent Grant
Buckup plate assembly for grinding system
- Patent number 6,722,955
- Issue date Apr 20, 2004
- 3M Innovative Properties Company
- John Telischak
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus and method for in-situ endpoint detection for chemical me...
- Patent number 6,719,818
- Issue date Apr 13, 2004
- Applied Materials, Inc.
- Manoocher Birang
- B24 - GRINDING POLISHING
Information Patent Grant
CMP endpoint detection system
- Patent number 6,688,945
- Issue date Feb 10, 2004
- Macronix International Co. Ltd.
- Yuh-Turng Liu
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus and methods for detecting killer particles during chemica...
- Patent number 6,671,051
- Issue date Dec 30, 2003
- KLA Tencor
- Mehrdad Nikoonahad
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
POLISHING APPARATUS AND POLISHING METHOD
- Publication number 20250010428
- Publication date Jan 9, 2025
- EBARA CORPORATION
- SAURABH KULKARNI
- B08 - CLEANING
Information Patent Application
UNIVERSAL SHARPENING DEVICE FOR SLICING MACHINES WITH CIRCULAR BLADE
- Publication number 20140127982
- Publication date May 8, 2014
- SLAYER BLADES S.R.L.
- Gaetano Scattolin
- B24 - GRINDING POLISHING
Information Patent Application
PEAK-BASED ENDPOINTING FOR CHEMICAL MECHANICAL POLISHING
- Publication number 20140080232
- Publication date Mar 20, 2014
- Applied Materials, Inc.
- Dominic J. Benvegnu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING END POINT DETECTION METHOD, POLISHING METHOD, AND POLISH...
- Publication number 20140004773
- Publication date Jan 2, 2014
- Kabushiki Kaisha Toshiba
- Noburu SHIMIZU
- G01 - MEASURING TESTING
Information Patent Application
PEAK-BASED ENDPOINTING FOR CHEMICAL MECHANICAL POLISHING
- Publication number 20110287694
- Publication date Nov 24, 2011
- Applied Materials, Inc.
- Dominic J. Benvegnu
- B24 - GRINDING POLISHING
Information Patent Application
WAFER POLISHING METHOD AND DOUBLE-SIDE POLISHING APPARATUS
- Publication number 20110130073
- Publication date Jun 2, 2011
- Shin-Etsu Handotai Co., Ltd.
- Daisuke Furukawa
- B24 - GRINDING POLISHING
Information Patent Application
Processing end point detection method, polishing method,and polishi...
- Publication number 20100015889
- Publication date Jan 21, 2010
- Noburu Shimizu
- G05 - CONTROLLING REGULATING
Information Patent Application
Diagnostic Methods During CMP Pad Dressing and Associated Systems
- Publication number 20090137187
- Publication date May 28, 2009
- Chien-Min Sung
- B24 - GRINDING POLISHING
Information Patent Application
PEAK-BASED ENDPOINTING FOR CHEMICAL MECHANICAL POLISHING
- Publication number 20080099443
- Publication date May 1, 2008
- APPLIED MATERIALS, INC.
- Dominic J. Benvegnu
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING WITH NAPPED POROMERIC
- Publication number 20080076330
- Publication date Mar 27, 2008
- Applied Materials, Inc.
- Manoocher Birang
- B24 - GRINDING POLISHING
Information Patent Application
REDUCING POLISHING PAD DEFORMATION
- Publication number 20080020690
- Publication date Jan 24, 2008
- Applied Materials, Inc.
- Manoocher Birang
- B24 - GRINDING POLISHING
Information Patent Application
Chemical mechanical polishing apparatus with rotating belt
- Publication number 20070021043
- Publication date Jan 25, 2007
- Applied Materials, Inc.
- Manoocher Birang
- B24 - GRINDING POLISHING
Information Patent Application
Grinding disc for grinding machines
- Publication number 20060189268
- Publication date Aug 24, 2006
- Ulrich Falk
- B24 - GRINDING POLISHING
Information Patent Application
CMP pad having a streamlined windowpane
- Publication number 20060063471
- Publication date Mar 23, 2006
- Gregory P. Muldowney
- B24 - GRINDING POLISHING
Information Patent Application
Grinding or polishing arrangement
- Publication number 20060040597
- Publication date Feb 23, 2006
- Raffi Piliguian
- B24 - GRINDING POLISHING
Information Patent Application
Apparatuses and methods for in-situ optical endpointing on web-form...
- Publication number 20050266773
- Publication date Dec 1, 2005
- Micron Technology, Inc.
- Vishnu K. Agarwal
- B24 - GRINDING POLISHING
Information Patent Application
Grinding or polishing arrangement
- Publication number 20050255798
- Publication date Nov 17, 2005
- Raffi Piliguian
- B24 - GRINDING POLISHING
Information Patent Application
Detection system for chemical-mechanical planarization tool
- Publication number 20050026542
- Publication date Feb 3, 2005
- Tezer Battal
- B24 - GRINDING POLISHING
Information Patent Application
Ultrasonic welding method for the manufacture of a polishing pad co...
- Publication number 20040259483
- Publication date Dec 23, 2004
- Cabot Microelectronics Corporation
- Kelly J. Newell
- B24 - GRINDING POLISHING
Information Patent Application
Method for monitoring a substrate during chemical mechanical polishing
- Publication number 20040242123
- Publication date Dec 2, 2004
- APPLIED MATERIALS, INC.
- Andreas Norbert Wiswesser
- B24 - GRINDING POLISHING
Information Patent Application
Chemical mechanical polishing apparatus with rotating belt
- Publication number 20040209559
- Publication date Oct 21, 2004
- Applied Materials, a Delaware corporation
- Manoocher Birang
- B24 - GRINDING POLISHING
Information Patent Application
Apparatuses and methods for in-situ optical endpointing on web-form...
- Publication number 20040029490
- Publication date Feb 12, 2004
- Vishnu K. Agarwal
- B24 - GRINDING POLISHING
Information Patent Application
Planarizing machines and control systems for mechanical and/or chem...
- Publication number 20040012795
- Publication date Jan 22, 2004
- Scott E. Moore
- B24 - GRINDING POLISHING
Information Patent Application
Abrasive wheels with workpiece vision feature
- Publication number 20040009744
- Publication date Jan 15, 2004
- Karen M. Conley
- B24 - GRINDING POLISHING
Information Patent Application
CMP endpoint detection system
- Publication number 20030181135
- Publication date Sep 25, 2003
- Yuh-Turng Liu
- B24 - GRINDING POLISHING
Information Patent Application
Chemical-mechanical polishing apparatus and method for controlling...
- Publication number 20030178587
- Publication date Sep 25, 2003
- Kyoung-Woo Kim
- B24 - GRINDING POLISHING
Information Patent Application
Grinding or polishing arrangement
- Publication number 20030143926
- Publication date Jul 31, 2003
- Raffi Piliguian
- B24 - GRINDING POLISHING
Information Patent Application
Method and apparatus for measuring substrate layer thickness during...
- Publication number 20030104761
- Publication date Jun 5, 2003
- Applied Materials, Inc., a Delaware corporation
- Andreas Norbert Wiswesser
- B24 - GRINDING POLISHING
Information Patent Application
Method and apparatus for endpoint detection during chemical mechani...
- Publication number 20030092269
- Publication date May 15, 2003
- Prabodh J. Parikh
- B24 - GRINDING POLISHING
Information Patent Application
Chemical mechanical polishing apparatus with rotating belt
- Publication number 20030060143
- Publication date Mar 27, 2003
- APPLIED MATERIALS, INC.
- Manoocher Birang
- B24 - GRINDING POLISHING

with apertures for inspecting the surface to be abraded

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Processing end point detection method, polishing method, and polish...

Peak-based endpointing for chemical mechanical polishing

Double-side polishing apparatus

Wafer polishing method and double-side polishing apparatus

Peak-based endpointing for chemical mechanical polishing

Peak-based endpointing for chemical mechanical polishing

Grinding disc for grinding machines

Grinding or polishing arrangement

Reducing polishing pad deformation

Chemical mechanical polishing apparatus with rotating belt

Apparatuses and methods for in-situ optical endpointing on web-form...

CMP pad having a streamlined windowpane

Chemical mechanical polishing apparatus with rotating belt

Method for monitoring a substrate during chemical mechanical polishing

Ultrasonic welding method for the manufacture of a polishing pad co...

Apparatuses for in-situ optical endpointing on web-format planarizi...

Grinding wheel

Multizone carrier with process monitoring system for chemical-mecha...

Planarizing machines and control systems for mechanical and/or chem...

Monitor, method of monitoring, polishing device, and method of manu...

Chemical-mechanical polishing apparatus and method for controlling...

Abrasive wheels with workpiece vision feature

Method and apparatus for measuring substrate layer thickness during...

Backing plate and disc configured for blowing angled grinding

Knife sharpener

Chemical mechanical polishing apparatus with rotating belt

Buckup plate assembly for grinding system

Apparatus and method for in-situ endpoint detection for chemical me...

CMP endpoint detection system

Apparatus and methods for detecting killer particles during chemica...

Patents Applicationslast 30 patents

POLISHING APPARATUS AND POLISHING METHOD

UNIVERSAL SHARPENING DEVICE FOR SLICING MACHINES WITH CIRCULAR BLADE

PEAK-BASED ENDPOINTING FOR CHEMICAL MECHANICAL POLISHING

PROCESSING END POINT DETECTION METHOD, POLISHING METHOD, AND POLISH...

PEAK-BASED ENDPOINTING FOR CHEMICAL MECHANICAL POLISHING

WAFER POLISHING METHOD AND DOUBLE-SIDE POLISHING APPARATUS

Processing end point detection method, polishing method,and polishi...

Diagnostic Methods During CMP Pad Dressing and Associated Systems

PEAK-BASED ENDPOINTING FOR CHEMICAL MECHANICAL POLISHING

CHEMICAL MECHANICAL POLISHING WITH NAPPED POROMERIC

REDUCING POLISHING PAD DEFORMATION

Chemical mechanical polishing apparatus with rotating belt

Grinding disc for grinding machines

CMP pad having a streamlined windowpane

Grinding or polishing arrangement

Apparatuses and methods for in-situ optical endpointing on web-form...

Grinding or polishing arrangement

Detection system for chemical-mechanical planarization tool

Ultrasonic welding method for the manufacture of a polishing pad co...

Method for monitoring a substrate during chemical mechanical polishing

Chemical mechanical polishing apparatus with rotating belt

Apparatuses and methods for in-situ optical endpointing on web-form...

Planarizing machines and control systems for mechanical and/or chem...

Abrasive wheels with workpiece vision feature

CMP endpoint detection system

Chemical-mechanical polishing apparatus and method for controlling...

Grinding or polishing arrangement

Method and apparatus for measuring substrate layer thickness during...

Method and apparatus for endpoint detection during chemical mechani...

Chemical mechanical polishing apparatus with rotating belt