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Panel-molded electronic assemblies
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Patent number 11,751,338
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Issue date Sep 5, 2023
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Vicor Corporation
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Patrizio Vinciarelli
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B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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Work machine and mounting method
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Patent number 11,432,451
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Issue date Aug 30, 2022
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FUJI CORPORATION
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Noriaki Iwaki
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Method of mounting component
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Patent number 11,202,374
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Issue date Dec 14, 2021
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PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
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Hideaki Watanabe
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Electronic component mounter
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Patent number 11,013,161
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Issue date May 18, 2021
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FUJI CORPORATION
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Daisuke Nakayama
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Power module package
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Patent number 11,004,698
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Issue date May 11, 2021
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Semiconductor Components Industries, LLC
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Keunhyuk Lee
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H01 - BASIC ELECTRIC ELEMENTS
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Component mounting method
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Patent number 10,668,584
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Issue date Jun 2, 2020
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PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
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Yoichi Makino
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B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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Working apparatus and working method
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Patent number 10,327,367
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Issue date Jun 18, 2019
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PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
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Minoru Yamamoto
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Passive within via
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Patent number 9,960,079
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Issue date May 1, 2018
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Intel Corporation
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Todd B. Myers
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H01 - BASIC ELECTRIC ELEMENTS
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