with encapsulating core

Industry

  • CPC
  • H01F2017/048
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Patents Grantslast 30 patents

  • Information Patent Grant

    Coil component

    • Patent number 11,978,579
    • Issue date May 7, 2024
    • Murata Manufacturing Co., Ltd.
    • Kenichi Araki
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Magnetic material and coil component

    • Patent number 11,972,885
    • Issue date Apr 30, 2024
    • Taiyo Yuden Co., Ltd.
    • Kenji Otake
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil component and electronic device

    • Patent number 11,961,654
    • Issue date Apr 16, 2024
    • Taiyo Yuden Co., Ltd.
    • Hirotaka Wakabayashi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Inductive component

    • Patent number 11,955,265
    • Issue date Apr 9, 2024
    • Sumida Components & Modules GmbH
    • Martin Grubl
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil electronic component

    • Patent number 11,942,257
    • Issue date Mar 26, 2024
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Jae Hun Kim
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Composite magnetic particle including metal magnetic particle

    • Patent number 11,942,249
    • Issue date Mar 26, 2024
    • Taiyo Yuden Co., Ltd.
    • Atsushi Tanada
    • B22 - CASTING POWDER METALLURGY
  • Information Patent Grant

    Electronic component and method for manufacturing the same

    • Patent number 11,919,084
    • Issue date Mar 5, 2024
    • Murata Manufacturing Co., Ltd.
    • Keita Muneuchi
    • B22 - CASTING POWDER METALLURGY
  • Information Patent Grant

    Wire coil component and method for producing wire coil component

    • Patent number 11,915,854
    • Issue date Feb 27, 2024
    • Murata Manufacturing Co., Ltd.
    • Yuya Ishida
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil component

    • Patent number 11,908,612
    • Issue date Feb 20, 2024
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Dong Seob Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Manufacturing method for surface mounted inductor

    • Patent number 11,908,611
    • Issue date Feb 20, 2024
    • Murata Manufacturing Co., Ltd.
    • Yoshitoshi Shoda
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Inversely coupled inductor and power supply module

    • Patent number 11,901,113
    • Issue date Feb 13, 2024
    • Delta Electronics (Shanghai) Co., Ltd.
    • Pengkai Ji
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil component

    • Patent number 11,901,112
    • Issue date Feb 13, 2024
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Ju Hwan Yang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Insulating material-coated soft magnetic powder, dust core, magneti...

    • Patent number 11,901,101
    • Issue date Feb 13, 2024
    • Seiko Epson Corporation
    • Atsushi Nakamura
    • B22 - CASTING POWDER METALLURGY
  • Information Patent Grant

    Soft magnetic powder, powder magnetic core, magnetic element, and e...

    • Patent number 11,894,168
    • Issue date Feb 6, 2024
    • Seiko Epson Corporation
    • Yasuko Kudo
    • B22 - CASTING POWDER METALLURGY
  • Information Patent Grant

    Electronic component and coil component

    • Patent number 11,894,177
    • Issue date Feb 6, 2024
    • TDK Corporation
    • Takahiro Kawahara
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil component

    • Patent number 11,894,174
    • Issue date Feb 6, 2024
    • TDK Corporation
    • Hitoshi Ohkubo
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil component

    • Patent number 11,887,768
    • Issue date Jan 30, 2024
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Hyung Ho Kim
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Surface mount inductor

    • Patent number 11,887,772
    • Issue date Jan 30, 2024
    • Murata Manufacturing Co., Ltd.
    • Takumi Arai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil component

    • Patent number 11,881,339
    • Issue date Jan 23, 2024
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Ji Su Song
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil component

    • Patent number 11,869,698
    • Issue date Jan 9, 2024
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Ju Hwan Yang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Soft magnetic material and method for manufacturing the same

    • Patent number 11,851,738
    • Issue date Dec 26, 2023
    • Murata Manufacturing Co., Ltd.
    • Kazuhiro Henmi
    • B22 - CASTING POWDER METALLURGY
  • Information Patent Grant

    Metal magnetic powder and method for manufacturing same, as well as...

    • Patent number 11,854,724
    • Issue date Dec 26, 2023
    • Taiyo Yuden Co., Ltd.
    • Yoko Orimo
    • B22 - CASTING POWDER METALLURGY
  • Information Patent Grant

    Coil and inductor including the same

    • Patent number 11,848,145
    • Issue date Dec 19, 2023
    • Murata Manufacturing Co., Ltd.
    • Takeo Ohaga
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil component

    • Patent number 11,848,139
    • Issue date Dec 19, 2023
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Hyung Ho Kim
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil component

    • Patent number 11,848,136
    • Issue date Dec 19, 2023
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Jae Hun Kim
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil component

    • Patent number 11,842,833
    • Issue date Dec 12, 2023
    • Murata Manufacturing Co., Ltd.
    • Takuya Ishida
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil component

    • Patent number 11,842,834
    • Issue date Dec 12, 2023
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Kwang Il Park
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil component

    • Patent number 11,823,830
    • Issue date Nov 21, 2023
    • Murata Manufacturing Co., Ltd.
    • Takashi Sukegawa
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Electronic component

    • Patent number 11,817,251
    • Issue date Nov 14, 2023
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Kun Hoi Koo
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Surface mount inductor and method of manufacturing surface mount in...

    • Patent number 11,817,248
    • Issue date Nov 14, 2023
    • Murata Manufacturing Co., Ltd.
    • Hideyuki Isobe
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    INDUCTOR

    • Publication number 20240120139
    • Publication date Apr 11, 2024
    • Murata Manufacturing Co., Ltd.
    • Yasuo SHIMOMURA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL COMPONENT

    • Publication number 20240105381
    • Publication date Mar 28, 2024
    • Taiyo Yuden Co., Ltd.
    • Motoki MATSUI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    REACTOR, CONVERTER AND POWER CONVERSION DEVICE

    • Publication number 20240029930
    • Publication date Jan 25, 2024
    • AUTONETWORKS TECHNOLOGIES, LTD.
    • Takehito KOBAYASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL COMPONENT

    • Publication number 20240029944
    • Publication date Jan 25, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Sang Jin KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC COMPONENT

    • Publication number 20240013970
    • Publication date Jan 11, 2024
    • Murata Manufacturing Co., Ltd.
    • Ryuichiro TOMINAGA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INDUCTOR ARRAY COMPONENT AND INDUCTOR ARRAY COMPONENT BUILT-IN SUBS...

    • Publication number 20230420180
    • Publication date Dec 28, 2023
    • Murata Manufacturing Co., Ltd.
    • Yoshimasa YOSHIOKA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL COMPONENT AND ADHESIVE FOR COIL COMPONENT

    • Publication number 20230386725
    • Publication date Nov 30, 2023
    • Murata Manufacturing Co., Ltd.
    • Hiroshi Marusawa
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF MAKING A SHIELDED INDUCTOR

    • Publication number 20230343502
    • Publication date Oct 26, 2023
    • Vishay Dale Electronics, LLC
    • Darek Blow
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INDUCTOR COMPONENT

    • Publication number 20230260696
    • Publication date Aug 17, 2023
    • MURATA MANUFACTURING CO., LTD.
    • Yoshimasa Yoshioka
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Method For Manufacturing Electronic Component With Coil

    • Publication number 20230253151
    • Publication date Aug 10, 2023
    • Sumida Corporation
    • Shinichi SAKAMOTO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL COMPONENT AND MANUFACTURING METHOD THEREFOR

    • Publication number 20230238170
    • Publication date Jul 27, 2023
    • TDK Corporation
    • Yuuichi KAWAGUCHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC COMPONENT AND METHODS RELATING TO SAME

    • Publication number 20230230753
    • Publication date Jul 20, 2023
    • COILCRAFT, INCORPORATED
    • Andrew Klesyk
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC COMPONENT AND COIL COMPONENT

    • Publication number 20230215617
    • Publication date Jul 6, 2023
    • TDK Corporation
    • Takahiro KAWAHARA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC COMPONENT AND COIL COMPONENT

    • Publication number 20230215618
    • Publication date Jul 6, 2023
    • TDK Corporation
    • Takahiro KAWAHARA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Ferromagnetic Metal-Ferrite Composites for High Frequency Inductor...

    • Publication number 20230207169
    • Publication date Jun 29, 2023
    • Northeastern University
    • Parisa ANDALIB
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL COMPONENT

    • Publication number 20230197332
    • Publication date Jun 22, 2023
    • Samsung Electro-Mechanics Co., Ltd.
    • So Young Jun
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL COMPONENT AND METHOD OF MANUFACTURING THE COIL COMPONENT

    • Publication number 20230191484
    • Publication date Jun 22, 2023
    • Murata Manufacturing Co., Ltd.
    • Takashi TOMOHIRO
    • B22 - CASTING POWDER METALLURGY
  • Information Patent Application

    Coil Component

    • Publication number 20230187129
    • Publication date Jun 15, 2023
    • Samsung Electro-Mechanics Co., Ltd.
    • Byung Soo KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL COMPONENT

    • Publication number 20230170123
    • Publication date Jun 1, 2023
    • Samsung Electro-Mechanics Co., Ltd.
    • Jae Wook LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INDUCTANCE VALUE INCREASING STRUCTURE

    • Publication number 20230170124
    • Publication date Jun 1, 2023
    • TAI-TECH ADVANCED ELECTRONICS CO., LTD.
    • Hsiang Chung Yang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FE-BASED NANOCRYSTALLINE ALLOY AND ELECTRONIC COMPONENT USING THE SAME

    • Publication number 20230160047
    • Publication date May 25, 2023
    • Samsung Electro-Mechanics Co., Ltd.
    • Sang Kyun KWON
    • C21 - METALLURGY OF IRON
  • Information Patent Application

    COIL COMPONENT

    • Publication number 20230154668
    • Publication date May 18, 2023
    • Samsung Electro-Mechanics Co., Ltd.
    • Jun Seok OH
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC COMPONENT, AND METHOD OF MANUFACTURING THEREOF

    • Publication number 20230128594
    • Publication date Apr 27, 2023
    • Samsung Electro-Mechanics Co., Ltd.
    • Min Sung CHOI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL COMPONENT

    • Publication number 20230119250
    • Publication date Apr 20, 2023
    • Samsung Electro-Mechanics Co., Ltd.
    • Sung Kwon OH
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL COMPONENT

    • Publication number 20230114664
    • Publication date Apr 13, 2023
    • Samsung Electro-Mechanics Co., Ltd.
    • Chan YOON
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL DEVICE

    • Publication number 20230075338
    • Publication date Mar 9, 2023
    • TDK Corporation
    • Keigo HIGASHIDA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL COMPONENT

    • Publication number 20230054091
    • Publication date Feb 23, 2023
    • Samsung Electro-Mechanics Co., Ltd.
    • Hyung Ho Kim
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL COMPONENT

    • Publication number 20230023322
    • Publication date Jan 26, 2023
    • Samsung Electro-Mechanics Co., Ltd.
    • Dong Seob LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL COMPONENT AND ELECTRONIC DEVICE

    • Publication number 20230020764
    • Publication date Jan 19, 2023
    • Taiyo Yuden Co., Ltd.
    • Hirotaka WAKABAYASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC COMPONENT AND MANUFACTURING METHOD FOR THE SAME

    • Publication number 20230015749
    • Publication date Jan 19, 2023
    • Murata Manufacturing Co., Ltd.
    • Eiji ISO
    • H01 - BASIC ELECTRIC ELEMENTS