with encapsulating, e.g., potting, etc.

Industry

CPC
Y10T29/49146

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Parent Industries

YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION Y10T29/00Metal working

Current Industry

Y10T29/49146with encapsulating, e.g., potting, etc.

Industries

Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method of package structure
- Patent number 11,895,780
- Issue date Feb 6, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Managed electrical connectivity systems
- Patent number 11,862,912
- Issue date Jan 2, 2024
- CommScope Technologies LLC
- Christopher Charles Taylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of mounting structure, and sheet therefor
- Patent number 11,848,659
- Issue date Dec 19, 2023
- Nagase Chemtex Corporation
- Takayuki Hashimoto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of manufacturing a lead for an active implantable medical de...
- Patent number 11,564,605
- Issue date Jan 31, 2023
- Sorin CRM SAS
- Jean-François Ollivier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Managed electrical connectivity systems
- Patent number 11,469,560
- Issue date Oct 11, 2022
- CommScope Technologies LLC
- Christopher Charles Taylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Potted electronic module with improved adhesion of potting compound
- Patent number 11,470,736
- Issue date Oct 11, 2022
- Continental Automotive GmbH
- Henryk Frenzel
- G01 - MEASURING TESTING
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,445,617
- Issue date Sep 13, 2022
- Unimicron Technology Corp.
- Kai-Ming Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,417,581
- Issue date Aug 16, 2022
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a printed circuit board
- Patent number 11,357,105
- Issue date Jun 7, 2022
- NextGin Technology BV
- J. A. A. M. Tourne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Panel molded electronic assemblies with multi-surface conductive co...
- Patent number 11,324,107
- Issue date May 3, 2022
- Vicor Corporation
- Patrizio Vinciarelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for spatial and temporal control of temperature on a subs...
- Patent number 11,302,556
- Issue date Apr 12, 2022
- Lam Research Corporation
- Anthony J. Ricci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for semiconductor package with cantilever pads
- Patent number 11,270,894
- Issue date Mar 8, 2022
- STMicroelectronics, Inc.
- Jefferson Talledo
- G01 - MEASURING TESTING
Information Patent Grant
Multi-layer thin-film coatings for system-in-package assemblies in...
- Patent number 11,266,010
- Issue date Mar 1, 2022
- Apple Inc.
- Yanfeng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit package, an electronic circuit package, and methods for enc...
- Patent number 11,189,537
- Issue date Nov 30, 2021
- Infineon Technologies AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a printed circuit board
- Patent number 11,184,977
- Issue date Nov 23, 2021
- NextGin Technology BV
- J. A. A. M. Tourne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Managed electrical connectivity systems
- Patent number 10,958,024
- Issue date Mar 23, 2021
- CommScope Technologies LLC
- Christopher Charles Taylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board incorporating electronic component and manufacturing...
- Patent number 10,917,974
- Issue date Feb 9, 2021
- TDK Corporation
- Kazutoshi Tsuyutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making single reflow power pin connections
- Patent number 10,897,821
- Issue date Jan 19, 2021
- Semiconductor Components Industries, LLC
- Yushuang Yao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component package for electromagnetic interference shiel...
- Patent number 10,849,258
- Issue date Nov 24, 2020
- NTRIUM INC.
- Se Young Jeong
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for packaging circuits
- Patent number 10,811,278
- Issue date Oct 20, 2020
- Micron Technology, Inc.
- Chia Y. Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device component exposure protection
- Patent number 10,802,546
- Issue date Oct 13, 2020
- Motorola Mobility LLC
- Richard W. Brotzman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Sealed circuit card assembly
- Patent number 10,737,410
- Issue date Aug 11, 2020
- Goodrich Corporation
- Michael A. Metzger
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Method for fabricating piezoelectric quartz resonator
- Patent number 10,727,801
- Issue date Jul 28, 2020
- INTERQUIP ELECTRONICS (SHENZHEN) CO., LTD.
- William Dean Beaver
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Apparatus for spatial and temporal control of temperature on a subs...
- Patent number 10,636,689
- Issue date Apr 28, 2020
- Lam Research Corporation
- Anthony J. Ricci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EMI shielding structure and manufacturing method therefor
- Patent number 10,624,248
- Issue date Apr 14, 2020
- Samsung Electronics Co., Ltd.
- Kyong-il Kim
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Decal electronics for printed high performance CMOS electronic systems
- Patent number 10,580,664
- Issue date Mar 3, 2020
- King Abdullah University of Science and Technology
- Muhammad Mustafa Hussain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrangement with a component on a carrier substrate, an arrangement...
- Patent number 10,580,912
- Issue date Mar 3, 2020
- MSG Lithoglas AG
- Simon Maus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Managed electrical connectivity systems
- Patent number 10,574,008
- Issue date Feb 25, 2020
- CommScope Technologies LLC
- Christopher Charles Taylor
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Methods of forming modular assemblies
- Patent number 10,537,015
- Issue date Jan 14, 2020
- VLT, Inc.
- Patrizio Vinciarelli
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a housing having shielding against electric an...
- Patent number 10,492,347
- Issue date Nov 26, 2019
- Bayerische Motoren Werke Aktiengesellschaft
- Matthias Wagner
- B60 - VEHICLES IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
MANAGED ELECTRICAL CONNECTIVITY SYSTEMS
- Publication number 20230223726
- Publication date Jul 13, 2023
- CommScope Technologies LLC
- Christopher Charles Taylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANAGED ELECTRICAL CONNECTIVITY SYSTEMS
- Publication number 20210305760
- Publication date Sep 30, 2021
- CommScope Technologies LLC
- Christopher Charles Taylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE STRUCTURE
- Publication number 20210195761
- Publication date Jun 24, 2021
- Unimicron Technology Corp.
- Kai-Ming YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR SPATIAL AND TEMPORAL CONTROL OF TEMPERATURE ON A SUBS...
- Publication number 20200251370
- Publication date Aug 6, 2020
- LAM RESEARCH CORPORATION
- Anthony J. Ricci
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER THIN-FILM COATINGS FOR SYSTEM-IN-PACKAGE ASSEMBLIES IN...
- Publication number 20200154561
- Publication date May 14, 2020
- Apple Inc.
- Yanfeng CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200068721
- Publication date Feb 27, 2020
- Unimicron Technology Corp.
- Kai-Ming YANG
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
METHOD FOR PACKAGING CIRCUITS
- Publication number 20190362988
- Publication date Nov 28, 2019
- Micron Technology, Inc.
- Chia Y. Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20190239362
- Publication date Aug 1, 2019
- Unimicron Technology Corp.
- Kai-Ming YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE REFLOW POWER PIN CONNECTIONS
- Publication number 20190116669
- Publication date Apr 18, 2019
- Semiconductor Components Industries, LLC
- Yushuang YAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20180315678
- Publication date Nov 1, 2018
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE ELECTRONIC ASSEMBLY METHOD
- Publication number 20180263117
- Publication date Sep 13, 2018
- Intel Corporation
- Sasha N. Oster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER THIN-FILM COATINGS FOR SYSTEM-IN-PACKAGE ASSEMBLIES IN...
- Publication number 20180220525
- Publication date Aug 2, 2018
- Apple Inc.
- Yanfeng CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Compact Media Player
- Publication number 20180220542
- Publication date Aug 2, 2018
- Apple Inc.
- Christopher D. Prest
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Electronic Gaming Die
- Publication number 20180140941
- Publication date May 24, 2018
- Board of Regents, The University of Texas System
- Danny W. Muse
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
METHOD FOR MANUFACTURING A SWALLOWABLE SENSOR DEVICE
- Publication number 20180092221
- Publication date Mar 29, 2018
- Innurvation, Inc.
- Michael R. ARNESON
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20170374748
- Publication date Dec 28, 2017
- Unimicron Technology Corp.
- Kai-Ming YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PART EMBEDDED SUBSTRATE AND METHOD OF PRODUCING AN ELECT...
- Publication number 20170365559
- Publication date Dec 21, 2017
- Shinko Electric Industries Co., Ltd.
- Takaharu YAMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Assemblies without Solder and Methods for their manufacture
- Publication number 20170290215
- Publication date Oct 5, 2017
- Joseph C. Fjelstad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE, LIGHTING DEVICE AND MANUFACTURING METHOD OF THE...
- Publication number 20140362590
- Publication date Dec 11, 2014
- OSRAM GMBH
- Peng Chen
- F21 - LIGHTING
Information Patent Application
ELECTRONIC MODULES HAVING GROUNDED ELECTROMAGNETIC SHIELDS
- Publication number 20140355222
- Publication date Dec 4, 2014
- Thong Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING PACKAGING SUBSTRATE HAVING A PASSIVE ELEMENT...
- Publication number 20140345125
- Publication date Nov 27, 2014
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE HAVING A PASSIVE ELEMENT EMBEDDED THEREIN
- Publication number 20140345930
- Publication date Nov 27, 2014
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING PACKAGING SUBSTRATE HAVING A PASSIVE ELEMENT...
- Publication number 20140345126
- Publication date Nov 27, 2014
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS RELATED TO DETECTION, SENSING, AND/OR MITIGA...
- Publication number 20140342113
- Publication date Nov 20, 2014
- United States of America as represented by the Secretary of the Navy
- Nishkamraj U. Deshpande
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR SPATIAL AND TEMPORAL CONTROL OF TEMPERATURE ON A SUBS...
- Publication number 20140332161
- Publication date Nov 13, 2014
- Anthony J. Ricci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHTING PANEL
- Publication number 20140328082
- Publication date Nov 6, 2014
- James Gourlay
- G02 - OPTICS
Information Patent Application
ELECTRONIC CONTROL APPARATUS FOR VEHICLE USING OVERMOLDING AND MANU...
- Publication number 20140313675
- Publication date Oct 23, 2014
- HYUNDAI AUTRON CO., LTD.
- Yeon Chul Choo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHIP EMBEDDED SUBSTRATE AND METHOD OF PRODUCING THE SAME
- Publication number 20140313681
- Publication date Oct 23, 2014
- Takaharu YAMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT PACKAGE
- Publication number 20140313676
- Publication date Oct 23, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Joon-Seok KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR INTEGRATING AN ELECTRONIC COMPONENT INTO A PRINTED CIRCU...
- Publication number 20140307403
- Publication date Oct 16, 2014
- Günther Weichslberger
- H01 - BASIC ELECTRIC ELEMENTS

with encapsulating, e.g., potting, etc.

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Manufacturing method of package structure

Managed electrical connectivity systems

Manufacturing method of mounting structure, and sheet therefor

Method of manufacturing a lead for an active implantable medical de...

Managed electrical connectivity systems

Potted electronic module with improved adhesion of potting compound

Package structure and manufacturing method thereof

Package structure

Method for producing a printed circuit board

Panel molded electronic assemblies with multi-surface conductive co...

Apparatus for spatial and temporal control of temperature on a subs...

Manufacturing method for semiconductor package with cantilever pads

Multi-layer thin-film coatings for system-in-package assemblies in...

Circuit package, an electronic circuit package, and methods for enc...

Method for producing a printed circuit board

Managed electrical connectivity systems

Circuit board incorporating electronic component and manufacturing...

Method of making single reflow power pin connections

Electronic component package for electromagnetic interference shiel...

Method for packaging circuits

Device component exposure protection

Sealed circuit card assembly

Method for fabricating piezoelectric quartz resonator

Apparatus for spatial and temporal control of temperature on a subs...

EMI shielding structure and manufacturing method therefor

Decal electronics for printed high performance CMOS electronic systems

Arrangement with a component on a carrier substrate, an arrangement...

Managed electrical connectivity systems

Methods of forming modular assemblies

Method for producing a housing having shielding against electric an...

Patents Applicationslast 30 patents

MANAGED ELECTRICAL CONNECTIVITY SYSTEMS

MANAGED ELECTRICAL CONNECTIVITY SYSTEMS

MANUFACTURING METHOD OF PACKAGE STRUCTURE

APPARATUS FOR SPATIAL AND TEMPORAL CONTROL OF TEMPERATURE ON A SUBS...

MULTI-LAYER THIN-FILM COATINGS FOR SYSTEM-IN-PACKAGE ASSEMBLIES IN...

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD FOR PACKAGING CIRCUITS

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SINGLE REFLOW POWER PIN CONNECTIONS

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

FLEXIBLE ELECTRONIC ASSEMBLY METHOD

MULTI-LAYER THIN-FILM COATINGS FOR SYSTEM-IN-PACKAGE ASSEMBLIES IN...

Compact Media Player

Electronic Gaming Die

METHOD FOR MANUFACTURING A SWALLOWABLE SENSOR DEVICE

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PART EMBEDDED SUBSTRATE AND METHOD OF PRODUCING AN ELECT...

Electronic Assemblies without Solder and Methods for their manufacture

ELECTRONIC MODULE, LIGHTING DEVICE AND MANUFACTURING METHOD OF THE...

ELECTRONIC MODULES HAVING GROUNDED ELECTROMAGNETIC SHIELDS

METHOD OF FABRICATING PACKAGING SUBSTRATE HAVING A PASSIVE ELEMENT...

PACKAGING SUBSTRATE HAVING A PASSIVE ELEMENT EMBEDDED THEREIN

METHOD OF FABRICATING PACKAGING SUBSTRATE HAVING A PASSIVE ELEMENT...

STRUCTURES AND METHODS RELATED TO DETECTION, SENSING, AND/OR MITIGA...

APPARATUS FOR SPATIAL AND TEMPORAL CONTROL OF TEMPERATURE ON A SUBS...

LIGHTING PANEL

ELECTRONIC CONTROL APPARATUS FOR VEHICLE USING OVERMOLDING AND MANU...

CHIP EMBEDDED SUBSTRATE AND METHOD OF PRODUCING THE SAME

ELECTRONIC COMPONENT PACKAGE

METHOD FOR INTEGRATING AN ELECTRONIC COMPONENT INTO A PRINTED CIRCU...