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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/8022with energy being in the form of electromagnetic radiation

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Substrate bonding apparatus and method of manufacturing a semicondu...
- Patent number 12,002,700
- Issue date Jun 4, 2024
- Kioxia Corporation
- Sho Kawadahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring electronic device
- Patent number 11,973,054
- Issue date Apr 30, 2024
- Stroke Precision Advanced Engineering Co., Ltd.
- Yu-Min Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display device and method for manufacturing the same
- Patent number 11,894,335
- Issue date Feb 6, 2024
- Japan Display Inc.
- Kazuyuki Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid interconnect for laser bonding using nanoporous metal tips
- Patent number 11,424,214
- Issue date Aug 23, 2022
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of transferring a plurality of micro light emitting diodes t...
- Patent number 11,387,212
- Issue date Jul 12, 2022
- BOE Technology Group Co., Ltd.
- Guan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Implementation module for stacked connection between isolated circu...
- Patent number 11,116,100
- Issue date Sep 7, 2021
- SHENZHEN XILONG TOY COMPANY LIMITED
- Yipu Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser-induced selective heating for microLED placement and bonding
- Patent number 10,998,286
- Issue date May 4, 2021
- Facebook Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Implementation method for stacked connection between isolated circu...
- Patent number 10,455,717
- Issue date Oct 22, 2019
- SHENZHEN XILONG TOY COMPANY LIMITED
- Yipu Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor-on-insulator with back side heat dissipation
- Patent number 10,217,822
- Issue date Feb 26, 2019
- QUALCOMM Incorporated
- Paul A. Nygaard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser assisted transfer welding process
- Patent number 10,181,483
- Issue date Jan 15, 2019
- Etienne Menard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor-on-insulator with back side strain inducing material
- Patent number 9,748,272
- Issue date Aug 29, 2017
- QUALCOMM Incorporated
- Paul A. Nygaard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor-on-insulator with back side strain topology
- Patent number 9,466,719
- Issue date Oct 11, 2016
- QUALCOMM Incorporated
- Paul A. Nygaard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of sealing and contacting substrates using laser light and e...
- Patent number 9,171,822
- Issue date Oct 27, 2015
- Corelase Oy
- Jarno Kangastupa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser assisted transfer welding process
- Patent number 9,161,448
- Issue date Oct 13, 2015
- Semprius, Inc.
- Etienne Menard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip-on-wafer bonding method and bonding device, and structure comp...
- Patent number 9,142,532
- Issue date Sep 22, 2015
- BONDTECH CO., LTD.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrically bonded arrays of transfer printed active components
- Patent number 9,049,797
- Issue date Jun 2, 2015
- Semprius, Inc.
- Etienne Menard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for joining a silicon plate to a second plate
- Patent number 6,955,975
- Issue date Oct 18, 2005
- Robert Bosch GmbH
- Frank Reichenbach
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240298444
- Publication date Sep 5, 2024
- KIOXIA Corporation
- Mitsuhiko NODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240234354
- Publication date Jul 11, 2024
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TRANSFERRING ELECTRONIC DEVICE
- Publication number 20240213209
- Publication date Jun 27, 2024
- Stroke Precision Advanced Engineering Co., Ltd.
- Yu-Min Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR BONDING ELECTRONIC COMPONENT, METHOD FOR BONDING ELEC...
- Publication number 20240203934
- Publication date Jun 20, 2024
- Stroke Precision Advanced Engineering Co., Ltd.
- Chingju Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING LAYER AND PROCESS
- Publication number 20240170444
- Publication date May 23, 2024
- TOKYO ELECTRON LIMITED
- Scott LEFEVRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240170445
- Publication date May 23, 2024
- Samsung Electronics Co., Ltd.
- Juno Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SYSTEM AND BONDING METHOD
- Publication number 20240079373
- Publication date Mar 7, 2024
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SYSTEM AND BONDING METHOD
- Publication number 20240079374
- Publication date Mar 7, 2024
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED NANOPARTICLES FOR ON-DIE THERMAL ENHANCEMENT OF HYBRID BON...
- Publication number 20240071987
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Bang-Ning Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING DISPLAY PANEL
- Publication number 20240072027
- Publication date Feb 29, 2024
- SAMSUNG DISPLAY CO., LTD.
- Jeong Won HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID INTERCONNECT FOR LASER BONDING USING NANOPOROUS METAL TIPS
- Publication number 20230352437
- Publication date Nov 2, 2023
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20230178511
- Publication date Jun 8, 2023
- Samsung Electronics Co., Ltd.
- Young Chul SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TRANSFERRING ELECTRONIC DEVICE
- Publication number 20220359455
- Publication date Nov 10, 2022
- Stroke Precision Advanced Engineering Co., Ltd.
- Yu-Min Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210398939
- Publication date Dec 23, 2021
- Japan Display Inc.
- Kazuyuki YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF TRANSFERRING A PLURALITY OF MICRO LIGHT EMITTING DIODES T...
- Publication number 20210335752
- Publication date Oct 28, 2021
- BOE TECHNOLOGY GROUP CO., LTD.
- Guan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SYSTEM AND BONDING METHOD
- Publication number 20210265300
- Publication date Aug 26, 2021
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPLEMENTATION MODULE FOR STACKED CONNECTION BETWEEN ISOLATED CIRCU...
- Publication number 20190350100
- Publication date Nov 14, 2019
- SHENZHEN XILONG TOY COMPANY LIMITED
- YIPU ZHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPLEMENTATION METHOD FOR STACKED CONNECTION BETWEEN ISOLATED CIRCU...
- Publication number 20180124941
- Publication date May 3, 2018
- SHENZHEN XILONG TOY COMPANY LIMITED
- YIPU ZHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY BONDED ARRAYS OF TRANSFER PRINTED ACTIVE COMPONENTS
- Publication number 20130153277
- Publication date Jun 20, 2013
- Etienne Menard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SEALING AND CONTACTING SUBSTRATES USING LASER LIGHT AND E...
- Publication number 20130070428
- Publication date Mar 21, 2013
- CORELASE OY
- Jarno Kangastupa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of Fabricating a Semiconductor Device with a Strain Inducing...
- Publication number 20120205725
- Publication date Aug 16, 2012
- IO SEMICONDUCTOR, INC.
- Paul A. Nygaard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER ASSISTED TRANSFER WELDING PROCESS
- Publication number 20120115262
- Publication date May 10, 2012
- Semprius, Inc.
- Etienne Menard
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR-ON-INSULATOR WITH BACK SIDE HEAT DISSIPATION
- Publication number 20110012199
- Publication date Jan 20, 2011
- IO SEMICONDUCTOR, INC.
- Paul A. Nygaard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for joining a silicon plate to a second plate
- Publication number 20040082145
- Publication date Apr 29, 2004
- Frank Reichenbach
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

with energy being in the form of electromagnetic radiation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Substrate bonding apparatus and method of manufacturing a semicondu...

Method for transferring electronic device

Display device and method for manufacturing the same

Hybrid interconnect for laser bonding using nanoporous metal tips

Method of transferring a plurality of micro light emitting diodes t...

Implementation module for stacked connection between isolated circu...

Laser-induced selective heating for microLED placement and bonding

Implementation method for stacked connection between isolated circu...

Semiconductor-on-insulator with back side heat dissipation

Laser assisted transfer welding process

Semiconductor-on-insulator with back side strain inducing material

Semiconductor-on-insulator with back side strain topology

Method of sealing and contacting substrates using laser light and e...

Laser assisted transfer welding process

Chip-on-wafer bonding method and bonding device, and structure comp...

Electrically bonded arrays of transfer printed active components

Method for joining a silicon plate to a second plate

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR TRANSFERRING ELECTRONIC DEVICE

APPARATUS FOR BONDING ELECTRONIC COMPONENT, METHOD FOR BONDING ELEC...

BONDING LAYER AND PROCESS

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

BONDING SYSTEM AND BONDING METHOD

BONDING SYSTEM AND BONDING METHOD

EMBEDDED NANOPARTICLES FOR ON-DIE THERMAL ENHANCEMENT OF HYBRID BON...

METHOD OF FABRICATING DISPLAY PANEL

HYBRID INTERCONNECT FOR LASER BONDING USING NANOPOROUS METAL TIPS

METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE

METHOD FOR TRANSFERRING ELECTRONIC DEVICE

DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME

METHOD OF TRANSFERRING A PLURALITY OF MICRO LIGHT EMITTING DIODES T...

BONDING SYSTEM AND BONDING METHOD

IMPLEMENTATION MODULE FOR STACKED CONNECTION BETWEEN ISOLATED CIRCU...

IMPLEMENTATION METHOD FOR STACKED CONNECTION BETWEEN ISOLATED CIRCU...

ELECTRICALLY BONDED ARRAYS OF TRANSFER PRINTED ACTIVE COMPONENTS

METHOD OF SEALING AND CONTACTING SUBSTRATES USING LASER LIGHT AND E...

Method of Fabricating a Semiconductor Device with a Strain Inducing...

LASER ASSISTED TRANSFER WELDING PROCESS

SEMICONDUCTOR-ON-INSULATOR WITH BACK SIDE HEAT DISSIPATION

Method for joining a silicon plate to a second plate