with energy being in the form of electromagnetic radiation

Industry

CPC
H01L2224/8421

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/8421with energy being in the form of electromagnetic radiation

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and production method for semiconductor device
- Patent number 12,062,634
- Issue date Aug 13, 2024
- Rohm Co., Ltd.
- Kazunori Fuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,040,301
- Issue date Jul 16, 2024
- Rohm Co., Ltd.
- Katsuhiko Yoshihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding apparatus and method of manufacturing a semicondu...
- Patent number 12,002,700
- Issue date Jun 4, 2024
- Kioxia Corporation
- Sho Kawadahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density and durable semiconductor device interconnect
- Patent number 11,756,923
- Issue date Sep 12, 2023
- Infineon Technologies AG
- Marian Sebastian Broll
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module with laser-welded leadframe
- Patent number 11,749,633
- Issue date Sep 5, 2023
- Hitachi Energy Switzerland AG
- Niko Pavlicek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a laser-connected terminal
- Patent number 11,664,342
- Issue date May 30, 2023
- Fuji Electric Co., Ltd.
- Shinji Tada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module and fabrication method for the same
- Patent number 10,381,244
- Issue date Aug 13, 2019
- Rohm Co., Ltd.
- Katsuhiko Yoshihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 9,633,967
- Issue date Apr 25, 2017
- NSK Ltd.
- Takashi Sunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing semiconductor device
- Patent number 9,468,993
- Issue date Oct 18, 2016
- Fuji Electric Co., Ltd.
- Toshiyuki Miyasaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with specific lead frame for a power semicondu...
- Patent number 9,136,209
- Issue date Sep 15, 2015
- Fuji Electric Co., Ltd.
- Toshiyuki Miyasaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
HIGH DENSITY AND DURABLE SEMICONDUCTOR DEVICE INTERCONNECT
- Publication number 20230063259
- Publication date Mar 2, 2023
- INFINEON TECHNOLOGIES AG
- Marian Sebastian Broll
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Module with Laser-Welded Leadframe
- Publication number 20220406745
- Publication date Dec 22, 2022
- Hitachi Energy Switzerland AG
- Niko Pavlicek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20220302071
- Publication date Sep 22, 2022
- Rohm Co., Ltd.
- Kazunori FUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A LASER-CONNECTED TERMINAL
- Publication number 20210407955
- Publication date Dec 30, 2021
- Fuji Electric Co., Ltd.
- Shinji TADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210407954
- Publication date Dec 30, 2021
- Rohm Co., Ltd.
- Katsuhiko YOSHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE...
- Publication number 20140203420
- Publication date Jul 24, 2014
- Fuji Electric Co., Ltd.
- Toshiyuki Miyasaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20130285221
- Publication date Oct 31, 2013
- FUJI ELECTRIC CO., LTD.
- Toshiyuki Miyasaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

with energy being in the form of electromagnetic radiation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and production method for semiconductor device

Semiconductor device

Substrate bonding apparatus and method of manufacturing a semicondu...

High density and durable semiconductor device interconnect

Power semiconductor module with laser-welded leadframe

Semiconductor device with a laser-connected terminal

Power module and fabrication method for the same

Semiconductor module

Method for producing semiconductor device

Semiconductor device with specific lead frame for a power semicondu...

Patents Applicationslast 30 patents

HIGH DENSITY AND DURABLE SEMICONDUCTOR DEVICE INTERCONNECT

Power Semiconductor Module with Laser-Welded Leadframe

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH A LASER-CONNECTED TERMINAL

SEMICONDUCTOR DEVICE

METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME