with energy being in the form of electromagnetic radiation

Industry

CPC
H01L2224/8221

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/8221with energy being in the form of electromagnetic radiation

Industries

Patents Grantslast 30 patents

Information Patent Grant
Substrate bonding apparatus and method of manufacturing a semicondu...
- Patent number 12,002,700
- Issue date Jun 4, 2024
- Kioxia Corporation
- Sho Kawadahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure including two joint structures including differen...
- Patent number 11,276,661
- Issue date Mar 15, 2022
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method for fabricating the same
- Patent number 10,522,524
- Issue date Dec 31, 2019
- LG Display Co., Ltd.
- Seungchul Lee
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Remapped packaged extracted die with 3D printed bond connections
- Patent number 10,147,660
- Issue date Dec 4, 2018
- Global Circuits Innovations, Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D printed hermetic package assembly and method
- Patent number 10,128,161
- Issue date Nov 13, 2018
- Global Circuit Innovations, Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for printing integrated circuit bond connections
- Patent number 9,935,028
- Issue date Apr 3, 2018
- Global Circuit Innovations Incorporated
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Discrete device mounted on substrate
- Patent number 9,899,339
- Issue date Feb 20, 2018
- Texas Instruments Incorporated
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with printed bond connections
- Patent number 9,824,948
- Issue date Nov 21, 2017
- Global Circuit Innovations Incorporated
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210366864
- Publication date Nov 25, 2021
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20190006335
- Publication date Jan 3, 2019
- LG Display Co., Ltd.
- Seungchul LEE
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
3D Printed Hermetic Package Assembly and Method
- Publication number 20180053702
- Publication date Feb 22, 2018
- Global Circuit Innovations Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Remapped Packaged Extracted Die with 3D Printed Bond Connections
- Publication number 20180040529
- Publication date Feb 8, 2018
- Global Circuit Innovations Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for printing integrated circuit bond connections
- Publication number 20140252584
- Publication date Sep 11, 2014
- GLOBAL CIRCUIT INNOVATIONS INCORPORATED
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCRETE DEVICE MOUNTED ON SUBSTRATE
- Publication number 20140124939
- Publication date May 8, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIXING TECHNOLOGY FOR COMPONENT ATTACH
- Publication number 20140000804
- Publication date Jan 2, 2014
- STMicroelectronics Pte Ltd
- Han Kong Looi
- H01 - BASIC ELECTRIC ELEMENTS

with energy being in the form of electromagnetic radiation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Substrate bonding apparatus and method of manufacturing a semicondu...

Package structure including two joint structures including differen...

Display device and method for fabricating the same

Remapped packaged extracted die with 3D printed bond connections

3D printed hermetic package assembly and method

Method and apparatus for printing integrated circuit bond connections

Discrete device mounted on substrate

Integrated circuit with printed bond connections

Patents Applicationslast 30 patents

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

DISPLAY DEVICE AND METHOD FOR FABRICATING THE SAME

3D Printed Hermetic Package Assembly and Method

Remapped Packaged Extracted Die with 3D Printed Bond Connections

Method and apparatus for printing integrated circuit bond connections

DISCRETE DEVICE MOUNTED ON SUBSTRATE

FIXING TECHNOLOGY FOR COMPONENT ATTACH