with gripping and holding devices using a vacuum; Bernoulli devices

Industry

CPC
H01L21/6838

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/6838with gripping and holding devices using a vacuum; Bernoulli devices

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Substrate processing system and method for controlling substrate pr...
- Patent number 12,224,194
- Issue date Feb 11, 2025
- Tokyo Electron Limited
- Atsushi Kubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Centering wafer for processing chamber
- Patent number 12,224,195
- Issue date Feb 11, 2025
- Applied Materials, Inc.
- Muhannad Mustafa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling sheet attachment apparatus to focusing ring for semiconduct...
- Patent number 12,224,188
- Issue date Feb 11, 2025
- CM TECH Co., Ltd.
- Man Soo Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus and method for manufacturing...
- Patent number 12,224,199
- Issue date Feb 11, 2025
- Mitsubishi Electric Corporation
- Takafumi Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus
- Patent number 12,217,998
- Issue date Feb 4, 2025
- Tokyo Electron Limited
- Junnosuke Taguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conveying device
- Patent number 12,217,996
- Issue date Feb 4, 2025
- Shinkawa Ltd.
- Jin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vacuum transfer device, substrate processing system, and substrate...
- Patent number 12,211,720
- Issue date Jan 28, 2025
- Tokyo Electron Limited
- Tatsuo Hatano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dynamic release tapes for assembly of discrete components
- Patent number 12,211,730
- Issue date Jan 28, 2025
- KULICKE & SOFFA NETHERLANDS B.V.
- Val Marinov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus
- Patent number 12,204,256
- Issue date Jan 21, 2025
- Tokyo Electron Limited
- Kouichi Mizunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding system
- Patent number 12,198,963
- Issue date Jan 14, 2025
- Tokyo Electron Limited
- Yoshitaka Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Suction clamp, object handler, stage apparatus and lithographic app...
- Patent number 12,197,141
- Issue date Jan 14, 2025
- ASML Netherlands B.V.
- Gijs Kramer
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Actively clamped carrier assembly for processing tools
- Patent number 12,191,186
- Issue date Jan 7, 2025
- Applied Materials, Inc.
- Benjamin B. Riordon
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Vacuum wafer chuck for manufacturing semiconductor devices
- Patent number 12,191,185
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Fa Lee
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Transfer device, transfer system, and end effector
- Patent number 12,191,188
- Issue date Jan 7, 2025
- Tokyo Electron Limited
- Norihiko Amikura
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Substrate transfer apparatus, substrate transfer method, and substr...
- Patent number 12,183,612
- Issue date Dec 31, 2024
- Tokyo Electron Limited
- Tatsuo Hatano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device testing apparatus and electronic device testing m...
- Patent number 12,180,018
- Issue date Dec 31, 2024
- CHROMA ATE INC.
- Chin-Yi Ouyang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for positioning center of V-type notch of wafer,...
- Patent number 12,183,616
- Issue date Dec 31, 2024
- XI'AN ESWIN MATERIAL TECHNOLOGY CO., LTD.
- Leilei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for manufacturing a semiconductor package structure
- Patent number 12,183,712
- Issue date Dec 31, 2024
- Advanced Semiconductor Engineering, Inc.
- Che-Ting Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for pressure force inspection
- Patent number 12,181,362
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yung Chang Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for manufacturing display apparatus while minimizing damage...
- Patent number 12,178,110
- Issue date Dec 24, 2024
- Samsung Display Co., Ltd.
- Kyongho Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for bonding
- Patent number 12,165,888
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding apparatus and substrate bonding method
- Patent number 12,165,902
- Issue date Dec 10, 2024
- Nikon Corporation
- Hajime Mitsuishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chuck assembly, planarization process, apparatus and method of manu...
- Patent number 12,165,903
- Issue date Dec 10, 2024
- Canon Kabushiki Kaisha
- Seth J. Bamesberger
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor substrate processing apparatus and semiconductor subs...
- Patent number 12,165,933
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Inkeun Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing system and transfer method
- Patent number 12,165,893
- Issue date Dec 10, 2024
- Tokyo Electron Limited
- Norihiko Amikura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer cleaning apparatus and method of controlling the same
- Patent number 12,154,819
- Issue date Nov 26, 2024
- ZEUS CO., LTD.
- Seung Dae Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cleave systems having spring members for cleaving a semiconductor s...
- Patent number 12,148,635
- Issue date Nov 19, 2024
- GlobalWafers Co., Ltd.
- Justin Scott Kayser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing apparatus and workpiece processing method
- Patent number 12,148,649
- Issue date Nov 19, 2024
- Disco Corporation
- Yukiyasu Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chuck design and method for wafer
- Patent number 12,148,651
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing an electronic device
- Patent number 12,148,658
- Issue date Nov 19, 2024
- Innolux Corporation
- Cheng-Chi Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIE BONDING TOOL WITH MOVABLE COMPONENT FOR IMPROVED DIE PROTRUSION...
- Publication number 20250054786
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chih-Yuan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE SUPPORT LEVELING APPARATUS
- Publication number 20250054797
- Publication date Feb 13, 2025
- Applied Materials, Inc.
- Katherine Woo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPERATURE CONTROL DEVICE AND WAFER PROCESSING SYSTEM
- Publication number 20250054784
- Publication date Feb 13, 2025
- KELK LTD.
- Atsushi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING SYSTEM AND TRANSFER METHOD
- Publication number 20250054793
- Publication date Feb 13, 2025
- TOKYO ELECTRON LIMITED
- Norihiko AMIKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP TURRET SORTING APPARATUS AND FORMATION METHOD THEREOF
- Publication number 20250051104
- Publication date Feb 13, 2025
- SEMIGHT INSTRUMENTS CO., LTD
- Renwei TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFIGURABLE CHUCK AND RING APPARATUS
- Publication number 20250046642
- Publication date Feb 6, 2025
- Core Flow Ltd.
- Alon SEGAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BACKSIDE CLEANING METHOD
- Publication number 20250046598
- Publication date Feb 6, 2025
- ACM RESEARCH (SHANGHAI), INC.
- Hui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR INTERCONNECTION UNIT, SEMICONDUCTOR PACKAGE AND METHOD FOR...
- Publication number 20250038059
- Publication date Jan 30, 2025
- JCET STATS ChipPAC Korea Limited
- HyeonChul LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250038042
- Publication date Jan 30, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHUCK TABLE AND SEMICONDUCTOR PACKAGE MANUFACTURING METHOD USING TH...
- Publication number 20250029864
- Publication date Jan 23, 2025
- Samsung Electronics Co., Ltd.
- KANG GYUNE LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING CHUCK WITH DISCRETE ACTUATORS
- Publication number 20250029866
- Publication date Jan 23, 2025
- Micron Technology, Inc.
- Craig A. Hickman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD OF THINNING WAFER SUBSTRATE
- Publication number 20250018486
- Publication date Jan 16, 2025
- COMPTAKE TECHNOLOGY INC.
- YAO-GUANG YANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER BALL ATTACHMENT SYSTEM AND METHOD FOR PREVENTING WARPAGE
- Publication number 20250022826
- Publication date Jan 16, 2025
- PEP INNOVATION PTE LTD.
- Hwee Seng CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COLLET STRUCTURE AND SEMICONDUCTOR FABRICATING APPARATUS INCLUDING...
- Publication number 20250022743
- Publication date Jan 16, 2025
- SK HYNIX INC.
- Taek Sang NAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...
- Publication number 20250022703
- Publication date Jan 16, 2025
- Kokusai Electric Corporation
- Yukinori ABURATANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR SEPARATING SINGULATED DIE FROM SUBSTRATE DICING TAPE...
- Publication number 20250006520
- Publication date Jan 2, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHUCK TABLE AND EDGE TRIMMING APPARATUS
- Publication number 20240429087
- Publication date Dec 26, 2024
- Disco Corporation
- Kokichi MINATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING APPARATUS
- Publication number 20240429076
- Publication date Dec 26, 2024
- Disco Corporation
- Kensuke FURUTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM REMOVAL APPARATUS AND UNCOVERING MECHANISM
- Publication number 20240429072
- Publication date Dec 26, 2024
- WISTRON CORP.
- ZESHAN YAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR SELF-ALIGNING BATCH PICK AND PLACE DIE BO...
- Publication number 20240429199
- Publication date Dec 26, 2024
- Intel Corporation
- Yi Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS INCLUDING A BONDING HEAD AND A METHOD OF USING THE SAME
- Publication number 20240404867
- Publication date Dec 5, 2024
- Canon Kabushiki Kaisha
- Byung-Jin Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chuck Design and Method for Wafer
- Publication number 20240395595
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TRANSFER APPARATUS AND SUBSTRATE TRANSFER METHOD
- Publication number 20240391706
- Publication date Nov 28, 2024
- TOKYO ELECTRON LIMITED
- Hitoshi HASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR PRESSURE FORCE INSPECTION
- Publication number 20240393199
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yung Chang HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR CHUCKING A WAFER
- Publication number 20240395594
- Publication date Nov 28, 2024
- PROTEC
- Hungsuk YOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS
- Publication number 20240387201
- Publication date Nov 21, 2024
- Mitsubishi Electric Corporation
- Hirofumi OKI
- B24 - GRINDING POLISHING
Information Patent Application
SEMICONDUCTOR PROCESSING TOOL
- Publication number 20240384416
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Tsun LIU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COLLET FOR PICKUP A SEMICONDUCTOR CHIP
- Publication number 20240387231
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Jungho PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SYSTEM AND METHOD FOR USING THE SAME
- Publication number 20240387232
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD, BONDING DEVICE, AND HOLDING MEMBER
- Publication number 20240387177
- Publication date Nov 21, 2024
- Nikon Corporation
- Hajime MITSUISHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

with gripping and holding devices using a vacuum; Bernoulli devices

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Substrate processing system and method for controlling substrate pr...

Centering wafer for processing chamber

Cooling sheet attachment apparatus to focusing ring for semiconduct...

Semiconductor manufacturing apparatus and method for manufacturing...

Substrate processing apparatus

Conveying device

Vacuum transfer device, substrate processing system, and substrate...

Dynamic release tapes for assembly of discrete components

Substrate processing apparatus

Bonding system

Suction clamp, object handler, stage apparatus and lithographic app...

Actively clamped carrier assembly for processing tools

Vacuum wafer chuck for manufacturing semiconductor devices

Transfer device, transfer system, and end effector

Substrate transfer apparatus, substrate transfer method, and substr...

Electronic device testing apparatus and electronic device testing m...

Method and system for positioning center of V-type notch of wafer,...

Method and system for manufacturing a semiconductor package structure

Device and method for pressure force inspection

Method for manufacturing display apparatus while minimizing damage...

Method and system for bonding

Substrate bonding apparatus and substrate bonding method

Chuck assembly, planarization process, apparatus and method of manu...

Semiconductor substrate processing apparatus and semiconductor subs...

Substrate processing system and transfer method

Wafer cleaning apparatus and method of controlling the same

Cleave systems having spring members for cleaving a semiconductor s...

Processing apparatus and workpiece processing method

Chuck design and method for wafer

Method for manufacturing an electronic device

Patents Applicationslast 30 patents

DIE BONDING TOOL WITH MOVABLE COMPONENT FOR IMPROVED DIE PROTRUSION...

SEMICONDUCTOR SUBSTRATE SUPPORT LEVELING APPARATUS

TEMPERATURE CONTROL DEVICE AND WAFER PROCESSING SYSTEM

SUBSTRATE PROCESSING SYSTEM AND TRANSFER METHOD

CHIP TURRET SORTING APPARATUS AND FORMATION METHOD THEREOF

CONFIGURABLE CHUCK AND RING APPARATUS

WAFER BACKSIDE CLEANING METHOD

MODULAR INTERCONNECTION UNIT, SEMICONDUCTOR PACKAGE AND METHOD FOR...

SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF

CHUCK TABLE AND SEMICONDUCTOR PACKAGE MANUFACTURING METHOD USING TH...

WAFER BONDING CHUCK WITH DISCRETE ACTUATORS

SYSTEM AND METHOD OF THINNING WAFER SUBSTRATE

SOLDER BALL ATTACHMENT SYSTEM AND METHOD FOR PREVENTING WARPAGE

COLLET STRUCTURE AND SEMICONDUCTOR FABRICATING APPARATUS INCLUDING...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...

APPARATUS FOR SEPARATING SINGULATED DIE FROM SUBSTRATE DICING TAPE...

CHUCK TABLE AND EDGE TRIMMING APPARATUS

WAFER PROCESSING APPARATUS

FILM REMOVAL APPARATUS AND UNCOVERING MECHANISM

METHODS AND APPARATUS FOR SELF-ALIGNING BATCH PICK AND PLACE DIE BO...

APPARATUS INCLUDING A BONDING HEAD AND A METHOD OF USING THE SAME

Chuck Design and Method for Wafer

SUBSTRATE TRANSFER APPARATUS AND SUBSTRATE TRANSFER METHOD

DEVICE AND METHOD FOR PRESSURE FORCE INSPECTION

APPARATUS FOR CHUCKING A WAFER

SEMICONDUCTOR MANUFACTURING APPARATUS

SEMICONDUCTOR PROCESSING TOOL

COLLET FOR PICKUP A SEMICONDUCTOR CHIP

BONDING SYSTEM AND METHOD FOR USING THE SAME

BONDING METHOD, BONDING DEVICE, AND HOLDING MEMBER