with gripping and holding devices using a vacuum; Bernoulli devices

Industry

CPC
H01L21/6838

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/6838with gripping and holding devices using a vacuum; Bernoulli devices

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Computer-readable recording medium, substrate bonding system, and s...
- Patent number 12,362,212
- Issue date Jul 15, 2025
- Tokyo Electron Limited
- Keiichi Saiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for separating semiconductor chip and method for separati...
- Patent number 12,341,033
- Issue date Jun 24, 2025
- LG Chem, Ltd.
- Eun Bum Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin shaping device
- Patent number 12,341,036
- Issue date Jun 24, 2025
- BONDTECH CO., LTD.
- Akira Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer cleaning apparatus
- Patent number 12,341,052
- Issue date Jun 24, 2025
- ZEUS CO., LTD.
- Seung Dae Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting device
- Patent number 12,341,035
- Issue date Jun 24, 2025
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cleave systems having spring members for cleaving a semiconductor s...
- Patent number 12,334,369
- Issue date Jun 17, 2025
- GlobalWafers Co., Ltd.
- Justin Scott Kayser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Motion device with magnetic levitation for wafer loading and unloading
- Patent number 12,327,752
- Issue date Jun 10, 2025
- YinGuan Semiconductor Technology Co., LTD.
- Huoliang Wu
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Grip-based transport speeds for transporting objects at a manufactu...
- Patent number 12,325,140
- Issue date Jun 10, 2025
- Applied Materials, Inc.
- Khai T. Ngo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oscillating secondary stage for frame-mode overlay metrology
- Patent number 12,327,741
- Issue date Jun 10, 2025
- KLA Corporation
- Izhar Agam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Suction gripper for warped workpiece
- Patent number 12,327,753
- Issue date Jun 10, 2025
- Core Flow Ltd.
- Roie Taboch
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Method of processing substrate
- Patent number 12,322,598
- Issue date Jun 3, 2025
- Samsung Electronics Co., Ltd.
- Hwayoung Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor wafer storage device
- Patent number 12,322,621
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu Ju- Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for transferring electronic component from flexible carri...
- Patent number 12,322,630
- Issue date Jun 3, 2025
- MICRAFT SYSTEM PLUS CO., LTD.
- Chingju Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing apparatus
- Patent number 12,315,744
- Issue date May 27, 2025
- Disco Corporation
- Yuta Takemura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Universal ring wafer support apparatus
- Patent number 12,308,278
- Issue date May 20, 2025
- GREEN TECHNOLOGY INVESTMENTS, LLC
- Tal Levin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor package
- Patent number 12,308,334
- Issue date May 20, 2025
- Advanced Semiconductor Engineering, Inc.
- Hsin He Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrasonically activated water ejector
- Patent number 12,303,946
- Issue date May 20, 2025
- Disco Corporation
- Xiaoming Qiu
- B08 - CLEANING
Information Patent Grant
Processing apparatus
- Patent number 12,308,262
- Issue date May 20, 2025
- Disco Corporation
- Takashi Uchiho
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tape pressure bonding apparatus
- Patent number 12,308,276
- Issue date May 20, 2025
- Disco Corporation
- Takashi Uchiho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing an electronic device
- Patent number 12,308,289
- Issue date May 20, 2025
- Innolux Corporation
- Cheng-Chi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous integration of components onto compact devices using...
- Patent number 12,308,275
- Issue date May 20, 2025
- Board of Regents, The University of Texas System
- Sidlgata V. Sreenivasan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer processing apparatus and wafer processing method
- Patent number 12,293,938
- Issue date May 6, 2025
- ZEUS CO., LTD.
- Woon Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Securing a wafer to a chuck
- Patent number 12,293,936
- Issue date May 6, 2025
- Applied Materials Israel Ltd.
- Dekel Yadid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Using controlled gas pressure for backside wafer support
- Patent number 12,293,934
- Issue date May 6, 2025
- Applied Materials, Inc.
- Paul Steffas
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing apparatus
- Patent number 12,293,935
- Issue date May 6, 2025
- SCREEN Holdings Co., Ltd.
- Yosuke Yasutake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stage system, lithographic apparatus, method for positioning and de...
- Patent number 12,287,586
- Issue date Apr 29, 2025
- ASML Netherlands B.V.
- Stef Marten Johan Janssens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for processing wafer
- Patent number 12,283,514
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Sheng-Chun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic susceptor
- Patent number 12,283,513
- Issue date Apr 22, 2025
- MiCo Ceramics Ltd.
- Jusung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ejector pin device for chip packaging
- Patent number 12,272,589
- Issue date Apr 8, 2025
- CHIPMORE TECHNOLOGY CORPORATION LIMITED
- Chaochao Jin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Reduced footprint wafer handling platform
- Patent number 12,272,583
- Issue date Apr 8, 2025
- Lam Research Corporation
- Christopher W. Burkhart
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONVEYANCE APPARATUS, TRANSFER METHOD, CONVEYANCE METHOD, AND SEMIC...
- Publication number 20250239475
- Publication date Jul 24, 2025
- JSW Aktina System Co., Ltd.
- Takahiro FUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...
- Publication number 20250239478
- Publication date Jul 24, 2025
- Mitsubishi Electric Corporation
- Kota HASHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JIG AND DIE ATTACH APPARATUS FOR INCLUDING THE SAME
- Publication number 20250233003
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Sangyoung JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING APPARATUS AND WAFER PROCESSING METHOD
- Publication number 20250233011
- Publication date Jul 17, 2025
- ZEUS CO., LTD.
- Woon KONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER HOLDER DEVICE HAVING HEATING FUNCTION
- Publication number 20250232989
- Publication date Jul 17, 2025
- SKY TECH INC.
- Jung-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS, BONDING METHOD, AND ARTICLE MANUFACTURING METHOD
- Publication number 20250233004
- Publication date Jul 17, 2025
- Canon Kabushiki Kaisha
- MASAHIRO KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF ADJUSTING A TILT BETWEEN A BONDING TOOL ASSEMBLY AND A S...
- Publication number 20250218841
- Publication date Jul 3, 2025
- KULICKE AND SOFFA INDUSTRIES, INC.
- Matthew Tarabulski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP EJECTOR
- Publication number 20250218853
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Sangjin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPANDING DEVICE, SEMICONDUCTOR CHIP MANUFACTURING METHOD, AND SEMI...
- Publication number 20250218872
- Publication date Jul 3, 2025
- YAMAHA HATSUDOKI KABUSHIKI KAISHA
- Yoshikuni SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING APPARATUS
- Publication number 20250218817
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Eunyoung Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING APPARATUS
- Publication number 20250218849
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Sangjun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING APPARATUS
- Publication number 20250218852
- Publication date Jul 3, 2025
- Powerchip Semiconductor Manufacturing Corporation
- Chia Chung Hsieh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LIFTING HEAD AND LIFTING DEVICE
- Publication number 20250205907
- Publication date Jun 26, 2025
- TORAY ENGINEERING CO., LTD.
- Ken KITAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING DEVICE AND SEMICONDUCTOR DEVICE MANUFAC...
- Publication number 20250201616
- Publication date Jun 19, 2025
- KIOXIA Corporation
- Yuusuke TAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORKPIECE HOLDER, WAFER CHUCK, WAFER HOLDING METHOD
- Publication number 20250201621
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Shiuan Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORT STRUCTURES FOR SEMICONDUCTOR SUBSTRATES
- Publication number 20250201622
- Publication date Jun 19, 2025
- Intel Corporation
- Sonja Koller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SHUTTLE FOR ENHANCED PACKAGE HANDLING RELIABILITY AND METHO...
- Publication number 20250201607
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Shin-Han You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE WARPAGE REDUCTION
- Publication number 20250183091
- Publication date Jun 5, 2025
- Applied Materials, Inc.
- Jooho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CUP, SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE PROCESSING METHOD
- Publication number 20250183092
- Publication date Jun 5, 2025
- TOKYO ELECTRON LIMITED
- Kouichirou TANAKA
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20250174485
- Publication date May 29, 2025
- SCREEN Holdings Co., Ltd.
- Yuichi TAKAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND METHOD OF MAN...
- Publication number 20250167015
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Donguk KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIZONE COATED VACUUM CHUCK FOR IR MEASUREMENT
- Publication number 20250167036
- Publication date May 22, 2025
- Applied Materials, Inc.
- Sanjay BHAT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR REDUCING WAFER BACKSIDE DAMAGE
- Publication number 20250167025
- Publication date May 22, 2025
- LAM RESEARCH CORPORATION
- Sairam Sundaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STANDBY DEVICE, SUBSTRATE PROCESSING SYSTEM, AND SUBSTRAT...
- Publication number 20250167022
- Publication date May 22, 2025
- TOKYO ELECTRON LIMITED
- Keita Hirase
- B08 - CLEANING
Information Patent Application
SEMICONDUCTOR WAFER STORAGE DEVICE
- Publication number 20250157837
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu Ju- CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER HOLDING DEVICE HAVING FUNCTION OF POSITIONING WAFER
- Publication number 20250149366
- Publication date May 8, 2025
- SKY TECH INC.
- Jung-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC CHUCK UNIT, LAMINATION APPARATUS AND METHOD OF LAMINA...
- Publication number 20250149371
- Publication date May 8, 2025
- SAMSUNG DISPLAY CO., LTD.
- TAEYOUNG PARK
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CENTERING WAFER FOR PROCESSING CHAMBER
- Publication number 20250149367
- Publication date May 8, 2025
- Applied Materials, Inc.
- Muhannad Mustafa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPIN CHUCK AND WAFER CLEANING DEVICE INCLUDING THE SAME
- Publication number 20250140579
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- Sunghwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND PROCESS FOR SORTING DIE FROM WAFER USING ANGLED WAFER TA...
- Publication number 20250140586
- Publication date May 1, 2025
- MIT SEMICONDUCTOR (TIAN JIN) CO., LTD.
- Kim Mone KWONG
- H01 - BASIC ELECTRIC ELEMENTS

with gripping and holding devices using a vacuum; Bernoulli devices

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Computer-readable recording medium, substrate bonding system, and s...

Apparatus for separating semiconductor chip and method for separati...

Resin shaping device

Wafer cleaning apparatus

Mounting device

Cleave systems having spring members for cleaving a semiconductor s...

Motion device with magnetic levitation for wafer loading and unloading

Grip-based transport speeds for transporting objects at a manufactu...

Oscillating secondary stage for frame-mode overlay metrology

Suction gripper for warped workpiece

Method of processing substrate

Semiconductor wafer storage device

Apparatus for transferring electronic component from flexible carri...

Processing apparatus

Universal ring wafer support apparatus

Semiconductor device and semiconductor package

Ultrasonically activated water ejector

Processing apparatus

Tape pressure bonding apparatus

Method for manufacturing an electronic device

Heterogeneous integration of components onto compact devices using...

Wafer processing apparatus and wafer processing method

Securing a wafer to a chuck

Using controlled gas pressure for backside wafer support

Substrate processing apparatus

Stage system, lithographic apparatus, method for positioning and de...

Method and system for processing wafer

Ceramic susceptor

Ejector pin device for chip packaging

Reduced footprint wafer handling platform

Patents Applicationslast 30 patents

CONVEYANCE APPARATUS, TRANSFER METHOD, CONVEYANCE METHOD, AND SEMIC...

SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...

JIG AND DIE ATTACH APPARATUS FOR INCLUDING THE SAME

WAFER PROCESSING APPARATUS AND WAFER PROCESSING METHOD

WAFER HOLDER DEVICE HAVING HEATING FUNCTION

BONDING APPARATUS, BONDING METHOD, AND ARTICLE MANUFACTURING METHOD

METHODS OF ADJUSTING A TILT BETWEEN A BONDING TOOL ASSEMBLY AND A S...

CHIP EJECTOR

EXPANDING DEVICE, SEMICONDUCTOR CHIP MANUFACTURING METHOD, AND SEMI...

SUBSTRATE BONDING APPARATUS

WAFER BONDING APPARATUS

WAFER PROCESSING APPARATUS

LIFTING HEAD AND LIFTING DEVICE

SEMICONDUCTOR MANUFACTURING DEVICE AND SEMICONDUCTOR DEVICE MANUFAC...

WORKPIECE HOLDER, WAFER CHUCK, WAFER HOLDING METHOD

SUPPORT STRUCTURES FOR SEMICONDUCTOR SUBSTRATES

PACKAGE SHUTTLE FOR ENHANCED PACKAGE HANDLING RELIABILITY AND METHO...

SUBSTRATE WARPAGE REDUCTION

CUP, SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE PROCESSING METHOD

SUBSTRATE PROCESSING APPARATUS

APPARATUS FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND METHOD OF MAN...

MULTIZONE COATED VACUUM CHUCK FOR IR MEASUREMENT

APPARATUS AND METHODS FOR REDUCING WAFER BACKSIDE DAMAGE

SUBSTRATE STANDBY DEVICE, SUBSTRATE PROCESSING SYSTEM, AND SUBSTRAT...

SEMICONDUCTOR WAFER STORAGE DEVICE

WAFER HOLDING DEVICE HAVING FUNCTION OF POSITIONING WAFER

ELECTROSTATIC CHUCK UNIT, LAMINATION APPARATUS AND METHOD OF LAMINA...

CENTERING WAFER FOR PROCESSING CHAMBER

SPIN CHUCK AND WAFER CLEANING DEVICE INCLUDING THE SAME

SYSTEM AND PROCESS FOR SORTING DIE FROM WAFER USING ANGLED WAFER TA...