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SUBSTRATE FOR CARRYING WAFER
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Publication number 20240096675
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Publication date Mar 21, 2024
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Nippon Telegraph and Telephone Corporation
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Shoko Tatsumi
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H01 - BASIC ELECTRIC ELEMENTS
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SUBSTRATE PROCESSING APPARATUS
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Publication number 20240094645
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Publication date Mar 21, 2024
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TOKYO ELECTRON LIMITED
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Kouichi Mizunaga
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H01 - BASIC ELECTRIC ELEMENTS
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CARRIER POSITIONING DEVICE
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Publication number 20240071798
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Publication date Feb 29, 2024
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NEXPERIA B.V.
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Alessandro Mazza
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H01 - BASIC ELECTRIC ELEMENTS
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BONDING SYSTEM
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Publication number 20240047257
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Publication date Feb 8, 2024
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TOKYO ELECTRON LIMITED
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Yoshitaka Otsuka
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H01 - BASIC ELECTRIC ELEMENTS
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CENTERING WAFER FOR PROCESSING CHAMBER
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Publication number 20240047256
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Publication date Feb 8, 2024
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Applied Materials, Inc.
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Muhannad Mustafa
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B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
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VACUUM CHUCK
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Publication number 20240038571
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Publication date Feb 1, 2024
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Taiwan Semiconductor Manufacturing Co., Ltd.
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Po-Yo SU
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H01 - BASIC ELECTRIC ELEMENTS
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LIFT-OFF METHOD
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Publication number 20240038591
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Publication date Feb 1, 2024
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Disco Corporation
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Masato TERAJIMA
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H01 - BASIC ELECTRIC ELEMENTS
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DIE PROCESSING
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Publication number 20240021572
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Publication date Jan 18, 2024
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ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
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Cyprian Emeka Uzoh
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H01 - BASIC ELECTRIC ELEMENTS
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