with gripping and holding devices using a vacuum; Bernoulli devices

Industry

CPC
H01L21/6838

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/6838with gripping and holding devices using a vacuum; Bernoulli devices

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of processing substrate
- Patent number 12,322,598
- Issue date Jun 3, 2025
- Samsung Electronics Co., Ltd.
- Hwayoung Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor wafer storage device
- Patent number 12,322,621
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu Ju- Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for transferring electronic component from flexible carri...
- Patent number 12,322,630
- Issue date Jun 3, 2025
- MICRAFT SYSTEM PLUS CO., LTD.
- Chingju Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing apparatus
- Patent number 12,315,744
- Issue date May 27, 2025
- Disco Corporation
- Yuta Takemura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Universal ring wafer support apparatus
- Patent number 12,308,278
- Issue date May 20, 2025
- GREEN TECHNOLOGY INVESTMENTS, LLC
- Tal Levin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor package
- Patent number 12,308,334
- Issue date May 20, 2025
- Advanced Semiconductor Engineering, Inc.
- Hsin He Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrasonically activated water ejector
- Patent number 12,303,946
- Issue date May 20, 2025
- Disco Corporation
- Xiaoming Qiu
- B08 - CLEANING
Information Patent Grant
Processing apparatus
- Patent number 12,308,262
- Issue date May 20, 2025
- Disco Corporation
- Takashi Uchiho
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tape pressure bonding apparatus
- Patent number 12,308,276
- Issue date May 20, 2025
- Disco Corporation
- Takashi Uchiho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing an electronic device
- Patent number 12,308,289
- Issue date May 20, 2025
- Innolux Corporation
- Cheng-Chi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous integration of components onto compact devices using...
- Patent number 12,308,275
- Issue date May 20, 2025
- Board of Regents, The University of Texas System
- Sidlgata V. Sreenivasan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer processing apparatus and wafer processing method
- Patent number 12,293,938
- Issue date May 6, 2025
- ZEUS CO., LTD.
- Woon Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Securing a wafer to a chuck
- Patent number 12,293,936
- Issue date May 6, 2025
- Applied Materials Israel Ltd.
- Dekel Yadid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Using controlled gas pressure for backside wafer support
- Patent number 12,293,934
- Issue date May 6, 2025
- Applied Materials, Inc.
- Paul Steffas
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing apparatus
- Patent number 12,293,935
- Issue date May 6, 2025
- SCREEN Holdings Co., Ltd.
- Yosuke Yasutake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stage system, lithographic apparatus, method for positioning and de...
- Patent number 12,287,586
- Issue date Apr 29, 2025
- ASML Netherlands B.V.
- Stef Marten Johan Janssens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for processing wafer
- Patent number 12,283,514
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Sheng-Chun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic susceptor
- Patent number 12,283,513
- Issue date Apr 22, 2025
- MiCo Ceramics Ltd.
- Jusung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ejector pin device for chip packaging
- Patent number 12,272,589
- Issue date Apr 8, 2025
- CHIPMORE TECHNOLOGY CORPORATION LIMITED
- Chaochao Jin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Reduced footprint wafer handling platform
- Patent number 12,272,583
- Issue date Apr 8, 2025
- Lam Research Corporation
- Christopher W. Burkhart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of adjusting a tilt between a bonding tool assembly and a s...
- Patent number 12,266,556
- Issue date Apr 1, 2025
- Kulicke and Soffa Industries, Inc.
- Matthew Tarabulski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor package, method of handling w...
- Patent number 12,266,559
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Shiuan Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding system and bonding method
- Patent number 12,261,147
- Issue date Mar 25, 2025
- BONDTECH CO., LTD.
- Akira Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing apparatus and wafer processing method
- Patent number 12,261,076
- Issue date Mar 25, 2025
- ZEUS CO., LTD.
- Seung Dae Baek
- B08 - CLEANING
Information Patent Grant
Work stage and exposure apparatus
- Patent number 12,261,077
- Issue date Mar 25, 2025
- Ushio Denki Kabushiki Kaisha
- Shunta Sugisaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate handling device for a wafer
- Patent number 12,261,075
- Issue date Mar 25, 2025
- SEMSYSCO GMBH
- Andreas Gleissner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printing system assemblies and methods
- Patent number 12,251,946
- Issue date Mar 18, 2025
- Kateeva, Inc.
- Robert B. Lowrance
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Wafer bonding system and method of using the same
- Patent number 12,255,171
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Han-De Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Support device for supporting a substrate, method of processing a s...
- Patent number 12,255,088
- Issue date Mar 18, 2025
- Applied Materials Italia S.R.L.
- Daniele Andreola
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing semiconductor wafer with wafer chuck havin...
- Patent number 12,249,493
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sheng-Chun Yang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE WARPAGE REDUCTION
- Publication number 20250183091
- Publication date Jun 5, 2025
- Applied Materials, Inc.
- Jooho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CUP, SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE PROCESSING METHOD
- Publication number 20250183092
- Publication date Jun 5, 2025
- TOKYO ELECTRON LIMITED
- Kouichirou TANAKA
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20250174485
- Publication date May 29, 2025
- SCREEN Holdings Co., Ltd.
- Yuichi TAKAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND METHOD OF MAN...
- Publication number 20250167015
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Donguk KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIZONE COATED VACUUM CHUCK FOR IR MEASUREMENT
- Publication number 20250167036
- Publication date May 22, 2025
- Applied Materials, Inc.
- Sanjay BHAT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR REDUCING WAFER BACKSIDE DAMAGE
- Publication number 20250167025
- Publication date May 22, 2025
- LAM RESEARCH CORPORATION
- Sairam Sundaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STANDBY DEVICE, SUBSTRATE PROCESSING SYSTEM, AND SUBSTRAT...
- Publication number 20250167022
- Publication date May 22, 2025
- TOKYO ELECTRON LIMITED
- Keita Hirase
- B08 - CLEANING
Information Patent Application
SEMICONDUCTOR WAFER STORAGE DEVICE
- Publication number 20250157837
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu Ju- CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER HOLDING DEVICE HAVING FUNCTION OF POSITIONING WAFER
- Publication number 20250149366
- Publication date May 8, 2025
- SKY TECH INC.
- Jung-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC CHUCK UNIT, LAMINATION APPARATUS AND METHOD OF LAMINA...
- Publication number 20250149371
- Publication date May 8, 2025
- SAMSUNG DISPLAY CO., LTD.
- TAEYOUNG PARK
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CENTERING WAFER FOR PROCESSING CHAMBER
- Publication number 20250149367
- Publication date May 8, 2025
- Applied Materials, Inc.
- Muhannad Mustafa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPIN CHUCK AND WAFER CLEANING DEVICE INCLUDING THE SAME
- Publication number 20250140579
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- Sunghwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND PROCESS FOR SORTING DIE FROM WAFER USING ANGLED WAFER TA...
- Publication number 20250140586
- Publication date May 1, 2025
- MIT SEMICONDUCTOR (TIAN JIN) CO., LTD.
- Kim Mone KWONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE HOLDING APPARATUS, SUBSTRATE SUCTION DETERMINATION METHOD...
- Publication number 20250140594
- Publication date May 1, 2025
- EBARA CORPORATION
- Osamu Nabeya
- B24 - GRINDING POLISHING
Information Patent Application
SEMICONDUCTOR PROCESSING ASSEMBLY AND METHOD FOR TRANSFERRING WAFERS
- Publication number 20250132181
- Publication date Apr 24, 2025
- ASM IP HOLDING B.V.
- Theodorus G.M. Oosterlaken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN WAFER TRANSFER METHOD
- Publication number 20250128435
- Publication date Apr 24, 2025
- ACM RESEARCH (SHANGHAI), INC.
- Zhaoming Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SUSCEPTOR
- Publication number 20250125128
- Publication date Apr 17, 2025
- NGK Insulators, Ltd.
- Shingo AMANO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
APPARATUS AND METHODS FOR MAINTAINING VACUUM CHECKING FORCE ON SEMI...
- Publication number 20250118590
- Publication date Apr 10, 2025
- Axcelis Technologies, Inc.
- Michael F. Leahy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VACUUM WAFER CHUCK FOR MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20250112081
- Publication date Apr 3, 2025
- Taiwan Semiconductor Manufacturing Co., LTD
- Chien-Fa LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-MATERIAL CHUCK
- Publication number 20250112083
- Publication date Apr 3, 2025
- TOKYO ELECTRON LIMITED
- Christopher NETZBAND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANISM FOR FINE ADJUSTING AN ANGLE OF A SEMICONDUCTOR WAFER FIXTURE
- Publication number 20250112084
- Publication date Apr 3, 2025
- CHENG MEI INSTRUMENT TECHNOLOGY CO., LTD.
- Te-Chun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURAL SUPPORT LAYER TO PROTECT SELECTIVE TRANSFER LAYER DURING...
- Publication number 20250112092
- Publication date Apr 3, 2025
- Intel Corportation
- Thomas L. Sounart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT TRANSFER APPARATUS AND TRANSFER METHOD USING...
- Publication number 20250105047
- Publication date Mar 27, 2025
- Hyundai Motor Company
- Tae Woo KWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHUCK FOR ACQUIRING A WARPED WORKPIECE
- Publication number 20250096021
- Publication date Mar 20, 2025
- Core Flow Ltd.
- Boaz NISHRI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE TREATING APPARATUS AND HEATING UNIT
- Publication number 20250096028
- Publication date Mar 20, 2025
- SEMES CO., LTD.
- Ju Mi LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPANDABLE WAFER BONDER
- Publication number 20250087521
- Publication date Mar 13, 2025
- TOKYO ELECTRON LIMITED
- Christopher NETZBAND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTING SYSTEM ASSEMBLIES AND METHODS
- Publication number 20250083457
- Publication date Mar 13, 2025
- Kateeva, Inc.
- Robert B. Lowrance
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DETERMINING A CENTER POSITION OF A TRANSFERRED SEMICONDU...
- Publication number 20250087511
- Publication date Mar 13, 2025
- VM Inc.
- Tae Jin KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE FABRICATION METHOD USING A DEPOSITION APPARATU...
- Publication number 20250087525
- Publication date Mar 13, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Makoto TSUTSUE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE INSPECTION APPARATUS
- Publication number 20250076360
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Daesung JUNG
- H01 - BASIC ELECTRIC ELEMENTS

with gripping and holding devices using a vacuum; Bernoulli devices

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of processing substrate

Semiconductor wafer storage device

Apparatus for transferring electronic component from flexible carri...

Processing apparatus

Universal ring wafer support apparatus

Semiconductor device and semiconductor package

Ultrasonically activated water ejector

Processing apparatus

Tape pressure bonding apparatus

Method for manufacturing an electronic device

Heterogeneous integration of components onto compact devices using...

Wafer processing apparatus and wafer processing method

Securing a wafer to a chuck

Using controlled gas pressure for backside wafer support

Substrate processing apparatus

Stage system, lithographic apparatus, method for positioning and de...

Method and system for processing wafer

Ceramic susceptor

Ejector pin device for chip packaging

Reduced footprint wafer handling platform

Methods of adjusting a tilt between a bonding tool assembly and a s...

Method of manufacturing semiconductor package, method of handling w...

Bonding system and bonding method

Wafer processing apparatus and wafer processing method

Work stage and exposure apparatus

Substrate handling device for a wafer

Printing system assemblies and methods

Wafer bonding system and method of using the same

Support device for supporting a substrate, method of processing a s...

Method for manufacturing semiconductor wafer with wafer chuck havin...

Patents Applicationslast 30 patents

SUBSTRATE WARPAGE REDUCTION

CUP, SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE PROCESSING METHOD

SUBSTRATE PROCESSING APPARATUS

APPARATUS FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND METHOD OF MAN...

MULTIZONE COATED VACUUM CHUCK FOR IR MEASUREMENT

APPARATUS AND METHODS FOR REDUCING WAFER BACKSIDE DAMAGE

SUBSTRATE STANDBY DEVICE, SUBSTRATE PROCESSING SYSTEM, AND SUBSTRAT...

SEMICONDUCTOR WAFER STORAGE DEVICE

WAFER HOLDING DEVICE HAVING FUNCTION OF POSITIONING WAFER

ELECTROSTATIC CHUCK UNIT, LAMINATION APPARATUS AND METHOD OF LAMINA...

CENTERING WAFER FOR PROCESSING CHAMBER

SPIN CHUCK AND WAFER CLEANING DEVICE INCLUDING THE SAME

SYSTEM AND PROCESS FOR SORTING DIE FROM WAFER USING ANGLED WAFER TA...

SUBSTRATE HOLDING APPARATUS, SUBSTRATE SUCTION DETERMINATION METHOD...

SEMICONDUCTOR PROCESSING ASSEMBLY AND METHOD FOR TRANSFERRING WAFERS

THIN WAFER TRANSFER METHOD

CERAMIC SUSCEPTOR

APPARATUS AND METHODS FOR MAINTAINING VACUUM CHECKING FORCE ON SEMI...

VACUUM WAFER CHUCK FOR MANUFACTURING SEMICONDUCTOR DEVICES

MULTI-MATERIAL CHUCK

MECHANISM FOR FINE ADJUSTING AN ANGLE OF A SEMICONDUCTOR WAFER FIXTURE

STRUCTURAL SUPPORT LAYER TO PROTECT SELECTIVE TRANSFER LAYER DURING...

SEMICONDUCTOR ELEMENT TRANSFER APPARATUS AND TRANSFER METHOD USING...

CHUCK FOR ACQUIRING A WARPED WORKPIECE

SUBSTRATE TREATING APPARATUS AND HEATING UNIT

EXPANDABLE WAFER BONDER

PRINTING SYSTEM ASSEMBLIES AND METHODS

METHOD FOR DETERMINING A CENTER POSITION OF A TRANSFERRED SEMICONDU...

SEMICONDUCTOR DEVICE FABRICATION METHOD USING A DEPOSITION APPARATU...

SUBSTRATE INSPECTION APPARATUS