with modification of the same mask

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H01L2224/03906

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/03906with modification of the same mask

Industries

Patents Grantslast 30 patents

Information Patent Grant
Collars for under-bump metal structures and associated systems and...
- Patent number 10,886,244
- Issue date Jan 5, 2021
- Micron Technology, Inc.
- Giorgio Mariottini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device packages having bumps and methods of manufacturin...
- Patent number 9,209,146
- Issue date Dec 8, 2015
- SK Hynix Inc.
- Seung Jee Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method of manufacturing the same, and method...
- Patent number 9,066,457
- Issue date Jun 23, 2015
- Sony Corporation
- Naoto Sasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device packages having bumps and methods of manufacturin...
- Patent number 8,907,487
- Issue date Dec 9, 2014
- SK Hynix Inc.
- Seung Jee Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COLLARS FOR UNDER-BUMP METAL STRUCTURES AND ASSOCIATED SYSTEMS AND...
- Publication number 20210151400
- Publication date May 20, 2021
- Micron Technology, Inc.
- Giorgio Mariottini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGES HAVING BUMPS AND METHODS OF MANUFACTURIN...
- Publication number 20130334683
- Publication date Dec 19, 2013
- SK HYNIX INC.
- Seung Jee KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND METHOD...
- Publication number 20120241949
- Publication date Sep 27, 2012
- SONY CORPORATION
- Naoto Sasaki
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE, METHOD OF MANUFACTURING TH...
- Publication number 20120235278
- Publication date Sep 20, 2012
- Renesas Electronics Corporation
- Hisao Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20120193793
- Publication date Aug 2, 2012
- Kabushiki Kaisha Toshiba
- Teppei TSUKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS