with multiple bonds on the same bonding area

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CPC
H01L2224/4046

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/4046with multiple bonds on the same bonding area

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Patents Grantslast 30 patents

Information Patent Grant
Clips for semiconductor packages
- Patent number 11,211,353
- Issue date Dec 28, 2021
- Infineon Technologies AG
- Mohd Kahar Bajuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module and method of manufacturing power module
- Patent number 9,673,118
- Issue date Jun 6, 2017
- Mitsubishi Electric Corporation
- Masaki Taya
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METAL PCB FOR TOPSIDE POWER DELIVERY
- Publication number 20230317706
- Publication date Oct 5, 2023
- Intel Corporation
- Kyle ARRINGTON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLIPS FOR SEMICONDUCTOR PACKAGES
- Publication number 20210013171
- Publication date Jan 14, 2021
- INFINEON TECHNOLOGIES AG
- Mohd Kahar Bajuri
- H01 - BASIC ELECTRIC ELEMENTS