with repetition of the same manufacturing step

Industry

CPC
H01L2224/27901

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/27901with repetition of the same manufacturing step

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Ag underlayer-attached metallic member, Ag underlayer-attached insu...
- Patent number 10,734,297
- Issue date Aug 4, 2020
- Mitsubishi Materials Corporation
- Shuji Nishimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, manufacturing program...
- Patent number 8,691,628
- Issue date Apr 8, 2014
- Kabushiki Kaisha Toshiba
- Yasuo Tane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device and semiconductor man...
- Patent number 8,276,537
- Issue date Oct 2, 2012
- Kabushiki Kaisha Toshiba
- Yukio Katamura
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for mounting electronic components
- Patent number 8,230,590
- Issue date Jul 31, 2012
- Fujitsu Semiconductor Limited
- Takao Nishimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip underfill process
- Patent number 6,861,285
- Issue date Mar 1, 2005
- Intel Corporation
- Rajen C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip device with multi-layered underfill having graded coeffic...
- Patent number 6,815,831
- Issue date Nov 9, 2004
- Intel Corporation
- Rajen C. Dias
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OPTICAL SENSOR PACKAGE
- Publication number 20240304639
- Publication date Sep 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yu-Te Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CONDUCTIVE SHEET, METHOD FOR MANUFACTURING THE SAME, AND...
- Publication number 20220098462
- Publication date Mar 31, 2022
- DEXERIALS CORPORATION
- Marina TOBATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR PACKAGE DEVICE
- Publication number 20180204818
- Publication date Jul 19, 2018
- Disco Corporation
- Kazuma Sekiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MAN...
- Publication number 20120318431
- Publication date Dec 20, 2012
- Kabushiki Kaisha Toshiba
- Yukio KATAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, MANUFACTURING PROGRAM...
- Publication number 20120149151
- Publication date Jun 14, 2012
- Kabushiki Kaisha Toshiba
- Yasuo TANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MAN...
- Publication number 20110263131
- Publication date Oct 27, 2011
- Kabushiki Kaisha Toshiba
- Yukio KATAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP WAFER, FLIP CHIP DIE AND MANUFACTURING PROCESSES THEREOF
- Publication number 20090127718
- Publication date May 21, 2009
- Singjang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MOUNTING ELECTRONIC COMPONENTS
- Publication number 20080196245
- Publication date Aug 21, 2008
- Fujitsu Limited
- Takao Nishimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flip chip underfill process
- Publication number 20030203536
- Publication date Oct 30, 2003
- Rajen C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip chip underfill process
- Publication number 20030109080
- Publication date Jun 12, 2003
- Rajen C. Dias
- H01 - BASIC ELECTRIC ELEMENTS

with repetition of the same manufacturing step

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Ag underlayer-attached metallic member, Ag underlayer-attached insu...

Method of manufacturing semiconductor device, manufacturing program...

Method for manufacturing semiconductor device and semiconductor man...

Method for mounting electronic components

Flip chip underfill process

Flip-chip device with multi-layered underfill having graded coeffic...

Patents Applicationslast 30 patents

OPTICAL SENSOR PACKAGE

THERMALLY CONDUCTIVE SHEET, METHOD FOR MANUFACTURING THE SAME, AND...

MANUFACTURING METHOD FOR PACKAGE DEVICE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MAN...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, MANUFACTURING PROGRAM...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MAN...

FLIP CHIP WAFER, FLIP CHIP DIE AND MANUFACTURING PROCESSES THEREOF

METHOD FOR MOUNTING ELECTRONIC COMPONENTS

Flip chip underfill process

Flip chip underfill process