TREA

with repetition of the same manufacturing step

Follow

Industry

  • CPC
  • H01L2224/43986
This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/43986with repetition of the same manufacturing step
Industries

Patents Grantslast 30 patents

  • Information Patent Grant

    Al bonding wire
    • Patent number 12,090,578
    • Issue date Sep 17, 2024
    • Nippon Micrometal Corporation
    • Takashi Yamada
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding wire for semiconductor device
    • Patent number 10,737,356
    • Issue date Aug 11, 2020
    • Nippon Micrometal Corporation
    • Takashi Yamada
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding wire for semiconductor device
    • Patent number 10,610,976
    • Issue date Apr 7, 2020
    • Nippon Micrometal Corporation
    • Takashi Yamada
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding wire for semiconductor device
    • Patent number 10,525,555
    • Issue date Jan 7, 2020
    • Nippon Micrometal Corporation
    • Takashi Yamada
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding wire for semiconductor device
    • Patent number 10,468,370
    • Issue date Nov 5, 2019
    • Nippon Micrometal Corporation
    • Takashi Yamada
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding wire for semiconductor device
    • Patent number 10,414,002
    • Issue date Sep 17, 2019
    • Nippon Micrometal Corporation
    • Takashi Yamada
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Silver bonding wire for semiconductor device containing indium, gal...
    • Patent number 10,381,320
    • Issue date Aug 13, 2019
    • NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
    • Tetsuya Oyamada
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Bonding wire for semiconductor device
    • Patent number 10,137,534
    • Issue date Nov 27, 2018
    • Nippon Micrometal Corporation
    • Takashi Yamada
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Grant

    Bonding wire for semiconductor device
    • Patent number 10,121,758
    • Issue date Nov 6, 2018
    • Nippon Micrometal Corporation
    • Daizo Oda
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Grant

    Copper-based alloy wire and methods for manufaturing the same
    • Patent number 9,997,488
    • Issue date Jun 12, 2018
    • Tung-Han Chuang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Bonding wire for semiconductor device
    • Patent number 9,887,172
    • Issue date Feb 6, 2018
    • Nippon Micrometal Corporation
    • Daizo Oda
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Grant

    Bonding wire and method for manufacturing same
    • Patent number 9,434,027
    • Issue date Sep 6, 2016
    • NIPPON MICROMETAL CORPORATION
    • Ryo Togashi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding wire for semiconductor device
    • Patent number 9,112,059
    • Issue date Aug 18, 2015
    • Nippon Steel & Sumikin Materials Co., Ltd.
    • Tomohiro Uno
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Bonding wire for semiconductor
    • Patent number 8,815,019
    • Issue date Aug 26, 2014
    • Nippon Steel & Sumikin Materials., Ltd.
    • Tomohiro Uno
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Grant

    Bonding wire for semiconductor devices
    • Patent number 8,389,860
    • Issue date Mar 5, 2013
    • Nippon Steel Materials Co., Ltd.
    • Tomohiro Uno
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Semiconductor device bonding wire and wire bonding method
    • Patent number 8,102,061
    • Issue date Jan 24, 2012
    • Nippon Steel Materials Co., Ltd.
    • Tomohiro Uno
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Bonding wire for semiconductor device
    • Patent number 7,952,028
    • Issue date May 31, 2011
    • Nippon Steel Materials Co., Ltd.
    • Tomohiro Uno
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents