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CPC
H01L2224/79316
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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/79316
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Patent Grant
Apparatus for the material-bonded connection of connection partners...
Patent number
10,603,741
Issue date
Mar 31, 2020
Semikron Elektronik GmbH & Co., KG
Ingo Bogen
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR