with retaining mechanisms

Industry

CPC
H01L2224/75316

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/75316with retaining mechanisms

Industries

Patents Grantslast 30 patents

Information Patent Grant
Sintering tool and method for sintering an electronic subassembly
- Patent number 11,400,514
- Issue date Aug 2, 2022
- Danfoss Silicon Power GmbH
- Frank Osterwald
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Sintering materials and attachment methods using same
- Patent number 11,389,865
- Issue date Jul 19, 2022
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Sintering tool and method for sintering an electronic subassembly
- Patent number 10,814,396
- Issue date Oct 27, 2020
- Danfoss Silicon Power GmbH
- Frank Osterwald
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Apparatus for the material-bonded connection of connection partners...
- Patent number 10,603,741
- Issue date Mar 31, 2020
- Semikron Elektronik GmbH & Co., KG
- Ingo Bogen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sintering device
- Patent number 10,483,229
- Issue date Nov 19, 2019
- Danfoss Silicon Power GmbH
- Frank Osterwald
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Press fitting head and semiconductor manufacturing apparatus using...
- Patent number 10,388,625
- Issue date Aug 20, 2019
- J-DEVICES CORPORATION
- Minoru Kai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for simultaneously bonding multiple chips of different heigh...
- Patent number 10,147,702
- Issue date Dec 4, 2018
- Palo Alto Research Center Incorporated
- Brent S. Krusor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip attach frame
- Patent number 10,056,346
- Issue date Aug 21, 2018
- International Business Machines Corporation
- Martin Eckert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip attach frame
- Patent number 9,686,895
- Issue date Jun 20, 2017
- International Business Machines Corporation
- Martin Eckert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vacuum thermal bonding apparatus
- Patent number 9,451,708
- Issue date Sep 20, 2016
- MIKADO TECHNOS CO., LTD.
- Takashi Ito
- B32 - LAYERED PRODUCTS
Information Patent Grant
Pressure transmitting device for bonding chips onto a substrate
- Patent number 9,305,813
- Issue date Apr 5, 2016
- EV GROUP E. THALLNER GMBH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epoxy resin composition, method for producing composite unit using...
- Patent number 8,802,776
- Issue date Aug 12, 2014
- Dexerials Corporation
- Taichi Koyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip attach frame
- Patent number 8,535,956
- Issue date Sep 17, 2013
- International Business Machines Corporation
- Martin Eckert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for mounting electric component
- Patent number 8,486,212
- Issue date Jul 16, 2013
- Dexerials Corporation
- Kazunori Hamazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing an electric component-mounted substrate
- Patent number 8,402,645
- Issue date Mar 26, 2013
- Sony Chemical & Information Device Corporation
- Masaki Taniguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting method using thermocompression head
- Patent number 8,114,243
- Issue date Feb 14, 2012
- Sony Corporation
- Kazutaka Furuta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device mounted structure and semiconductor device mou...
- Patent number 8,110,933
- Issue date Feb 7, 2012
- Panasonic Corporation
- Yoshihiro Tomura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SINTERING TOOL AND METHOD FOR SINTERING AN ELECTRONIC SUBASSEMBLY
- Publication number 20210016353
- Publication date Jan 21, 2021
- DANFOSS SILICON POWER GMBH
- Frank Osterwald
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SINTERING DEVICE
- Publication number 20170229418
- Publication date Aug 10, 2017
- DANFOSS SILICON POWER GMBH
- Frank Osterwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ATTACH FRAME
- Publication number 20170162534
- Publication date Jun 8, 2017
- International Business Machines Corporation
- Martin Eckert
- G01 - MEASURING TESTING
Information Patent Application
VACUUM THERMAL BONDING APPARATUS AND VACUUM THERMAL BONDING METHOD
- Publication number 20140033518
- Publication date Feb 6, 2014
- MIKADO TECHNOS CO., LTD.
- Takashi Ito
- B32 - LAYERED PRODUCTS
Information Patent Application
CHIP ATTACH FRAME
- Publication number 20130207250
- Publication date Aug 15, 2013
- International Business Machines Corporation
- Martin Eckert
- G01 - MEASURING TESTING
Information Patent Application
EPOXY RESIN COMPOSITION, METHOD FOR PRODUCING COMPOSITE UNIT USING...
- Publication number 20120281376
- Publication date Nov 8, 2012
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Taichi Koyama
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD AND APPARATUS FOR MOUNTING ELECTRIC COMPONENT
- Publication number 20100288416
- Publication date Nov 18, 2010
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Kazunori Hamazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE MOUNTED STRUCTURE AND SEMICONDUCTOR DEVICE MOU...
- Publication number 20100025847
- Publication date Feb 4, 2010
- Yoshihiro Tomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING METHOD USING THERMOCOMPRESSION HEAD
- Publication number 20090261149
- Publication date Oct 22, 2009
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Kazutaka Furuta
- B30 - PRESSES
Information Patent Application
METHOD FOR PRODUCING AN ELECTRIC COMPONENT-MOUNTED SUBSTRATE
- Publication number 20090090001
- Publication date Apr 9, 2009
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Masaki Taniguchi
- B30 - PRESSES

with retaining mechanisms

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Sintering tool and method for sintering an electronic subassembly

Sintering materials and attachment methods using same

Sintering tool and method for sintering an electronic subassembly

Apparatus for the material-bonded connection of connection partners...

Sintering device

Press fitting head and semiconductor manufacturing apparatus using...

Method for simultaneously bonding multiple chips of different heigh...

Chip attach frame

Chip attach frame

Vacuum thermal bonding apparatus

Pressure transmitting device for bonding chips onto a substrate

Epoxy resin composition, method for producing composite unit using...

Chip attach frame

Method and apparatus for mounting electric component

Method for producing an electric component-mounted substrate

Mounting method using thermocompression head

Semiconductor device mounted structure and semiconductor device mou...

Patents Applicationslast 30 patents

SINTERING TOOL AND METHOD FOR SINTERING AN ELECTRONIC SUBASSEMBLY

SINTERING DEVICE

CHIP ATTACH FRAME

VACUUM THERMAL BONDING APPARATUS AND VACUUM THERMAL BONDING METHOD

CHIP ATTACH FRAME

EPOXY RESIN COMPOSITION, METHOD FOR PRODUCING COMPOSITE UNIT USING...

METHOD AND APPARATUS FOR MOUNTING ELECTRIC COMPONENT

SEMICONDUCTOR DEVICE MOUNTED STRUCTURE AND SEMICONDUCTOR DEVICE MOU...

MOUNTING METHOD USING THERMOCOMPRESSION HEAD

METHOD FOR PRODUCING AN ELECTRIC COMPONENT-MOUNTED SUBSTRATE