The present invention relates to a boiling cooler, and more particularly, it relates to a boiling cooler that circulates a refrigerant between a boiling part that boils the refrigerant and a condensing part that condenses the vaporized refrigerant.
Conventionally, a boiling cooler that circulates a refrigerant between a boiling part and a condensing part is known. Such a boiling cooler is disclosed in Japanese Patent Laid-Open No. 8-204075 and Japanese Patent Laid-Open No. 2005-101190, for example.
Japanese Patent Laid-Open No. 8-204075 discloses an element cooler including an evaporation part (boiling part) including a hollow faceplate to which an element (heating element) is mounted, and a condensing part having a refrigerant passage that communicates with an upper end opening of the evaporation part. The condensing part has an air passage to cool a refrigerant gas in the refrigerant passage. In the element cooler, a cycle is repeated in which the element mounted to the evaporation part is cooled by the vaporization of the refrigerant, and the vaporized refrigerant gas is cooled by air in the upper condensing part, becomes liquefied, and returns to the evaporation part.
Japanese Patent Laid-Open No. 2005-101190 discloses a boiling cooler including a plate tube in which a first refrigerant passage extending in an upward-downward direction is formed, tubes extending in the upward-downward direction parallel to the first refrigerant passage, a first header tank that allows the upper end of the plate tube to communicate with the upper ends of the tubes, and a second header tank that allows the lower end of the plate tube to communicate with the lower ends of the tubes. A liquid-phase refrigerant present in the first refrigerant passage is heated by a central processing unit mounted to the plate tube, boils, and becomes a gas-phase refrigerant, the first header tank is filled with the gas-phase refrigerant, and the gas-phase refrigerant flows from the upper side to the lower side in the tubes. The gas-phase refrigerant is cooled by cooling air in the tubes, is condensed, and flows to the second header tank under its own weight. The refrigerant circulates in the order of the first refrigerant passage, the first header tank, the tubes, the second header tank, and the first refrigerant passage.
In boiling coolers, when a refrigerant liquid on the inner surface of a boiling part (especially the inner surface of a location in which a heating element is installed) dries, the cooling performance of the heating element rapidly decreases because vaporization cooling cannot be performed. Therefore, it is important to reduce or prevent drying of the inner surface of the boiling part.
In Japanese Patent Laid-Open No. 8-204075, upward movement of the refrigerant gas to the condensing part and downward movement of a condensed refrigerant liquid to the evaporation part are carried out in the same path (an upper end opening of the evaporation part), and thus when the amount of vaporized refrigerant increases, the downward movement of the refrigerant liquid is inhibited by the rising refrigerant gas such that the dry cooling performance of the evaporation part tends to decrease.
On the other hand, in Japanese Patent Laid-Open No. 2005-101190, a movement path of a refrigerant gas and a movement path of a refrigerant liquid are different, and thus the phenomenon in which movement of the refrigerant liquid is inhibited by the refrigerant gas hardly occurs. However, especially when an external fluid is at a low temperature, a refrigerant pressure in a condensing part decreases, and the amount of vaporized refrigerant with respect to the amount of heat input tends to increase. Also in Japanese Patent Laid-Open No. 2005-101190, when the amount of heat input from a heating element increases and the external fluid is at a low temperature at which the amount of vaporized refrigerant tends to increase, the inner surface of a boiling part dries due to the insufficient amount of refrigerant liquid that is condensed and returned compared to the amount of vaporized refrigerant, and the cooling performance rapidly decreases.
In response to the aforementioned problems, and one aspect of the present invention is directed to provide a boiling cooler capable of reducing or preventing a rapid decrease in cooling performance due to an increase in the amount of heat input even when an external fluid is at a low temperature.
A boiling cooler according to the aspect of the present invention includes a boiling part being operable to boil a refrigerant by heat exchange with a heating element, and a condensing part being operable to condense a refrigerant gas by heat exchange with an external fluid. The boiling part includes an accommodation space to accommodate the refrigerant, a refrigerant gas outlet connected to the accommodation space, a refrigerant liquid inlet connected to the accommodation space, a first wall to which the heating element is mounted, a second wall facing the first wall via the accommodation space and adjacent to an external passage, and a heat conductive portion to connect the first wall to the second wall through the accommodation space. The condensing part includes a refrigerant passage communicating with the refrigerant gas outlet and the refrigerant liquid inlet, and the external passage provided between the refrigerant passage and the boiling part to allow the external fluid to flow therethrough, and the condensing part is configured to receive the refrigerant gas through the refrigerant gas outlet, and send a condensed refrigerant liquid to the refrigerant liquid inlet.
The foregoing and other objects, features, aspects and advantages of the present invention will become more apparent from the following detailed description of the present invention when taken in conjunction with the accompanying drawings.
Embodiments of the present invention are hereinafter described with reference to the drawings. The same reference numerals are used for the same or similar configurations.
Referring to
The heating elements HS are not particularly limited. Each of the heating elements HS is a device including an electronic circuit, for example. Specifically, the heating element HS is a power module that constitutes a power conversion circuit such as an inverter device. A power module is a circuit component that includes one or more power conversion switching elements. The power conversion switching elements are IGBT (insulated gate bipolar transistor) elements, for example.
As shown in
The refrigerant 1 is not particularly limited as long as it changes its phase between a gas phase and a liquid phase. As the refrigerant 1, fluorocarbon, hydrocarbon, or water is used, for example. The internal space of the cooler 100 is filled with a single refrigerant 1, and is in a saturated vapor state due to the gas-phase refrigerant 1. When the states of the refrigerant 1 are distinguished, the gas-phase refrigerant 1 is referred to as a refrigerant gas 1a (see
In the following, two directions perpendicular to each other in a horizontal plane are defined as an X direction and a Y direction. An upward-downward direction perpendicular to the horizontal plane (X-Y plane) is defined as a Z direction. The Z direction is parallel to the direction of gravity, and gravity acts in a downward direction.
The boiling part 10 and the condensing part 20 extend along the upward-downward direction (Z direction). A first side (Y1 direction side) of the boiling part 10 in the thickness direction (Y direction) is a mounting surface for the heating elements HS, and the condensing part 20 is provided on a second side (Y2 direction side) of the boiling part 10 in the thickness direction.
As shown in
As shown in
As shown in
The second wall 15 faces the first wall 14 in the Y direction through the accommodation space 11. The second wall 15 has an outer surface 15a that is a surface on the Y2 direction side, and an inner surface 15b that is a surface on the Y1 direction side. The condensing part 20 is provided on the outer surface 15a of the second wall 15. The second wall 15 is adjacent to the external passage 22 of the condensing part 20. In an example of
The refrigerant gas outlets 12 are provided in the vicinity of the upper end of the second wall 15. The refrigerant gas outlets 12 are through-holes (see
The refrigerant liquid inlets 13 are provided in the vicinity of the lower end of the second wall 15. The refrigerant liquid inlets 13 are through-holes (see
Due to the action of gravity, the liquid-phase refrigerant liquid 1b is stored in the lower portion of the accommodation space 11, and the gas-phase refrigerant gas 1a is accommodated in the upper portion of the accommodation space 11. The refrigerant 1 is introduced into the accommodation space 11 through a tube 35 provided on the upper wall 17, and the tube 35 is sealed after the refrigerant 1 is injected into the accommodation space 11. In the accommodation space 11, the refrigerant 1 is accommodated such that the liquid level 1c of the refrigerant liquid 1b is located at a height between the refrigerant gas outlets 12 and the refrigerant liquid inlets 13 in a non-operating state at room temperature with no heat input from the heating elements HS. In the example of
The outer surface 14a of the first wall 14 is a mounting surface for the heating elements HS, and six mounts are provided along the Z direction. Specifically, on the outer surface (outer surface 14a) of the first wall 14, first mounts 31 located below the liquid level 1c in the non-operating state and to which the heating elements HS are mounted, and second mounts 32 located above the liquid level 1c in the non-operating state and to which the heating elements HS are mounted are provided. In the first embodiment, three first mounts 31 and three second mounts 32 are provided on the first wall 14.
As shown in
As shown in
The heat conductive portions 19 are provided from the refrigerant gas outlets 12 to the refrigerant liquid inlets 13 in the accommodation space 11. Specifically, in the Z direction, the upper ends 19c of the heat conductive portions 19 extend to positions at which the refrigerant gas outlets 12 are provided, and the lower ends 19d of the heat conductive portions 19 extend to positions at which the refrigerant liquid inlets 13 are provided. In an example of
Therefore, the heat conductive portions 19 are provided across both a region below the liquid level 1c of the refrigerant 1 and a region above the liquid level 1c. The heat conductive portions 19 are provided across positions at which the six mounts (the three first mounts 31 and the three second mounts 32) are provided in the Z direction. The heat conductive portions 19 can cool the refrigerant liquid 1b in a portion below the liquid level 1c by heat exchange with the external fluid 2 via the second wall 15, and cool the refrigerant gas 1a in a portion above the liquid level 1c by heat exchange with the external fluid 2 via the second wall 15.
Mounting holes 33 are provided in the pair of side walls 16 of the boiling part 10 to mount the heating elements HS. The mounting holes 33 are provided at positions corresponding to the four corners of one heating element HS. The mounting holes 33 are screw holes, for example, and fastening members such as bolts are mounted thereto.
In the first embodiment, the first wall 14, the pair of side walls 16, and the three partition walls (heat conductive portions 19) of the boiling part 10 are integrally provided as a single member by extrusion molding or cutting. As shown in
As shown in
The condensing part 20 includes a plurality of refrigerant passages 21. The condensing part 20 further includes a refrigerant gas distribution passage 23 that connects the refrigerant gas outlets 12 of the boiling part 10 to the refrigerant passages 21, and a refrigerant liquid collection passage 24 that connects each refrigerant passage 21 to the refrigerant liquid inlets 13 of the boiling part 10.
The condensing part 20 has a structure in which flat plate-shaped first layers 40 that include the refrigerant passages 21 and flat plate-shaped second layers 50 that include connection passages 51 allowing the refrigerant passages 21 to communicate with the boiling part 10 and the external passages 22 are stacked.
In the example of
As shown in
The partition plates 43 are rectangular flat plates extending in the Z direction, and partition the first layer 40 from the second layers 50 adjacent to the first layer 40. A pair of partition plates 43 are provided on the Y1 direction side and the Y2 direction side with respect to the refrigerant passage 21. The peripheral wall 44 is provided in an annular shape along the peripheral edges of the partition plates 43 between the pair of partition plates 43. The peripheral wall 44 is formed into a rectangular ring shape along the peripheral edges of the partition plates 43 by combining two L-shaped members corresponding to the two sides of each partition plate 43. Thus, the first layer 40 has a flat plate-shaped internal space defined by the pair of partition plates 43 and the annular peripheral wall 44.
The refrigerant passage 21 is a flat plate-shaped passage defined by the pair of partition plates 43 and the annular peripheral wall 44 and extending along the Z direction. The refrigerant passage 21 is adjacent to the external passages 22 of the second layers 50 via the partition plates 43, and heat exchange between the refrigerant gas 1a inside the refrigerant passage 21 and the external fluid 2 in the external passages 22 is performed via the partition plates 43. The refrigerant passage 21 has an upper end in the Z direction that is open to the refrigerant gas inlet portion 41 (see
The refrigerant passage 21 includes a corrugated fin 45 (see
As shown in
The refrigerant liquid outlet portion 42 is arranged at the lower end of the refrigerant passage 21. The refrigerant liquid outlet portion 42 is connected to the connection passages 52 of the adjacent second layers 50 via the through-holes 43b of the partition plates 43. The refrigerant liquid outlet portion 42 forms a portion of the refrigerant liquid collection passage 24.
As shown in
The external passage 22 is a passage that is open to the outside of the condensing part 20. Both sides of the external passage 22 in the Y direction are defined by the partition plates 43 that partition the first layer 40 from the second layers 50. The external passage 22 has an upper surface in the Z direction defined by an annular wall 53 (see
A corrugated fin 55 is provided inside the external passage 22. The corrugated fin 55 is formed into a wave shape along the Z direction and extends along the X direction. Both ends of the corrugated fin 55 in the Y direction contact the pair of partition plates 43, respectively, the upper end of the corrugated fin 55 in the Z direction contacts the outer peripheral surface of the annular wall 53, and the lower end of the corrugated fin 55 in the Z direction contacts the outer peripheral surface of the annular wall 54. The corrugated fin 55, the pair of partition plates 43, and the annular walls 53 and 54 are joined to each other at contact points and integrated.
The connection passage 51 is an internal space of the upper annular wall 53. The annular wall 53 is provided so as to surround the through-holes 43a (refrigerant gas inlet portion 41) formed in the partition plates 43. Both ends of the annular wall 53 in the Y direction are joined to surfaces of the partition plates 43, respectively, such that the connection passage 51, which is the internal space of the annular wall 53, and the refrigerant gas inlet portion 41 of the refrigerant passage 21 communicate with each other. Similarly, the connection passage 52 is an internal space of the lower annular wall 54. The annular wall 54 is provided so as to surround the through-holes 43b (refrigerant liquid outlet portion 42) formed in the partition plates 43. Both ends of the annular wall 54 in the Y direction are joined to surfaces of the partition plates 43, respectively, such that the connection passage 52, which is the internal space of the annular wall 54, and the refrigerant liquid outlet portion 42 of the refrigerant passage 21 communicate with each other.
With this configuration, as shown in
Furthermore, seven (seven-layer) connection passages 52 and six (six-layer) refrigerant liquid outlet portions 42 are alternately connected to the refrigerant liquid inlets 13 of the boiling part 10 to configure one refrigerant liquid collection passage 24 extending in the Y direction. The refrigerant liquid 1b condensed in the refrigerant passage 21 of each of the six first layers 40 moves downward to the corresponding refrigerant liquid outlet portion 42 due to the action of gravity, and flows into the refrigerant liquid inlets 13 of the boiling part 10 through the refrigerant liquid collection passage 24.
As shown in
As described above, the cooler 100 according to this embodiment has a structure in which the flat plate-shaped boiling part 10, the flat plate-shaped first layers 40 of the condensing part 20, and the flat plate-shaped second layers 50 of the condensing part 20 are stacked in the Y direction. The cooler 100 is configured by integrating, by vacuum brazing, a stacked body in which the boiling part 10 and the condensing part 20 are stacked. Inside the first layer 40, the partition plates 43, the peripheral wall 44, and the corrugated fin 45 are integrated with each other by vacuum brazing. In the second layer 50, the annular wall 53, the annular wall 54, the corrugated fin 55, and the partition plates 43 (or the second wall 15) are integrated with each other.
The operation of the cooler 100 is now described. As the heating elements HS that are power modules operate, the heating elements HS generate heat. When the heating elements HS are cooled, air as the external fluid 2 is sent into the external passage 22 by a blower (not shown) installed outside the cooler 100.
In
Concurrently with heat absorption by the refrigerant 1, the heat transferred to the first wall 14 is transferred to the second wall 15 via the heat conductive portions 19 and is absorbed by the external fluid 2 flowing through the external passage 22 adjacent to the second wall 15, as shown in
Returning to
The refrigerant gas 1a that has reached the refrigerant gas outlets 12 passes through the refrigerant gas outlets 12 and flows into the refrigerant gas distribution passage 23 of the condensing part 20. Then, the refrigerant gas 1a flows (is distributed) into the refrigerant passages 21 via the refrigerant gas inlet portions 41 of the first layers 40.
The refrigerant gas 1a that has flowed into each refrigerant passage 21 exchanges heat with the external fluid 2 flowing through the external passages 22 adjacent to the refrigerant passage 21 via the partition plates 43 and is cooled. Consequently, the refrigerant gas 1a in the refrigerant passage 21 is condensed into a refrigerant liquid 1b, and moves downward toward the refrigerant liquid outlet portion 42 due to the action of gravity.
The liquid level 1c of the refrigerant 1 is set in the vicinity of the intermediate position between the refrigerant gas outlets 12 and the refrigerant liquid inlets 13 of the boiling part 10, and thus also in the refrigerant passage 21, the liquid level 1c is located in the vicinity of an intermediate position between the refrigerant gas inlet portion 41 and the refrigerant liquid outlet portion 42. When the condensed refrigerant liquid 1b reaches the liquid level 1c in the refrigerant passage 21, it merges with the stored refrigerant liquid 1b. In a lower portion of the refrigerant passage 21 from the liquid level 1c to the refrigerant liquid outlet portion 42, the refrigerant liquid 1b is cooled by heat exchange with the external fluid 2 flowing through the external passage 22, and enters a subcooled state.
As the refrigerant liquid 1b vaporizes in the boiling part 10, the liquid level 1c of the refrigerant liquid 1b in the accommodation space 11 tends to lower, but in each refrigerant passage 21 in the condensing part 20, the condensed refrigerant liquid 1b is added and the liquid level 1c tends to rise. Thus, the refrigerant liquid 1b flows from the condensing part 20 into the refrigerant liquid inlets 13 of the boiling part 10 through the refrigerant liquid collection passage 24 so as to eliminate a water level difference between the liquid level 1c of the refrigerant liquid 1b in the accommodation space 11 and the liquid level 1c of the refrigerant liquid 1b in the refrigerant passage 21. Therefore, the refrigerant 1 circulates in the order of the boiling part 10 (accommodation space 11), the refrigerant gas distribution passage 23, each refrigerant passage 21, the refrigerant liquid collection passage 24, and the boiling part 10 (accommodation space 11) while undergoing a phase change.
As a result of the above operation, the heating elements HS are cooled by vaporization of the refrigerant liquid 1b in the accommodation space 11, and are also cooled by direct heat exchange with the external fluid 2 (not via the refrigerant 1) by heat conduction via the first wall 14, the heat conductive portions 19, and the second wall 15.
According to the first embodiment, the following advantageous effects are achieved.
According to the first embodiment, as described above, the boiling part 10 includes the accommodation space 11 to accommodate the refrigerant 1, the refrigerant gas outlets 12 connected to the accommodation space 11, and the refrigerant liquid inlets 13 connected to the accommodation space 11, and thus a movement path of the refrigerant gas 1a going from the boiling part 10 to the condensing part 20 and a movement path of the refrigerant liquid 1b returning from the condensing part 20 to the boiling part 10 can be made different. Therefore, inhibition of movement of the refrigerant liquid 1b by the refrigerant gas 1a can be reduced or prevented. Furthermore, the boiling part 10 includes the first wall 14 to which the heating elements HS are mounted, the second wall 15 facing the first wall 14 via the accommodation space 11 and adjacent to the external passage 22, and the heat conductive portions 19 to connect the first wall 14 to the second wall 15 through the accommodation space 11, and thus the heat applied to the first wall 14 from the heating elements HS can be transferred to the second wall 15 by heat conduction through the heat conductive portions 19 to be directly released (not via the refrigerant 1) to the external fluid 2 flowing through the external passage 22 adjacent to the second wall 15. Therefore, even when the amount of heat input increases and the refrigerant 1 dries on the inner surface of the boiling part 10, the heat from the heating elements HS can be directly released to the external fluid 2 via the heat conductive portions 19, and thus a rapid decrease in cooling performance can be reduced or prevented. The amount of heat released directly to the external fluid 2 increases as the temperature of the external fluid 2 decreases, and thus it is particularly effective when the external fluid 2 is at a low temperature. Furthermore, the second wall 15, the heat conductive portions 19, and the first wall 14 are cooled by heat exchange with the external fluid 2, and thus a portion of the refrigerant gas 1a in the accommodation space 11 is condensed by contacting the second wall 15 and the heat conductive portions 19. Thus, the effect of reducing or preventing drying of the refrigerant 1 on the inner surface of the boiling part 10 can be obtained. Consequently, even when the external fluid 2 is at a low temperature, a rapid decrease in cooling performance due to an increase in the amount of heat input can be reduced or prevented.
According to the first embodiment, as described above, the heat conductive portions 19 extend in the direction from the refrigerant liquid inlets 13 toward the refrigerant gas outlets 12 in the accommodation space 11, and the plurality of heat conductive portions 19 are provided in the accommodation space 11. Accordingly, movement of the refrigerant gas 1a toward the refrigerant gas outlets 12 is not hindered by the heat conductive portions 19, and the amount of heat transferred by the heat conductive portions 19 can be effectively increased. Furthermore, the surface area of the heat conductive portions 19 in the accommodation space 11 can be increased, and thus the effect of condensing a portion of the refrigerant gas 1a due to contact between the heat conductive portions 19 and the refrigerant gas 1a can be improved.
According to the first embodiment, as described above, the heat conductive portions 19 include the partition walls in the accommodation space 11. Accordingly, the heat conductive portions 19 can be provided in the accommodation space 11 with a simple structure, and the heat conductive portions 19 can also function as reinforcing structures to ensure the mechanical strength of the boiling part 10.
According to the first embodiment, as described above, the heat conductive portions 19 are provided from the refrigerant gas outlets 12 to the refrigerant liquid inlets 13 in the accommodation space 11. Accordingly, the heat conductive portions 19 can be provided over a wide range in the accommodation space 11, and thus the amount of heat transferred by the heat conductive portions 19 can be effectively increased. Furthermore, portions of the heat conductive portions 19 that are immersed in the refrigerant liquid 1b can cool the refrigerant liquid 1b to a subcooled state, and thus the effect of reducing the amount of generated refrigerant gas 1a can be obtained. Portions of the heat conductive portions 19 that contact the refrigerant gas 1a have the effect of condensing a portion of the refrigerant gas 1a to reduce or prevent drying of the refrigerant 1, as described above.
According to the first embodiment, as described above, the first mounts 31 located below the liquid level 1c in the non-operating state and to which the heating elements HS are mounted, and the second mounts 32 located above the liquid level 1c in the non-operating state and to which the heating elements HS are mounted are provided on the outer surface of the first wall 14. Accordingly, the heating elements HS can be cooled not only on the first mounts 31 arranged on the outer surface at a position immersed in the refrigerant liquid 1b, but also on the second mounts 32 arranged on the outer surface at a position away from the refrigerant liquid 1b. Generally, at a position above the liquid level 1c, the inner surface 14b of the first wall 14 is in a dry state, and thus the cooling performance is decreased. However, in the first embodiment, the above-described effect of the heat conductive portions 19 can be obtained, and as the boiled refrigerant gas 1a rises, a portion of the refrigerant liquid 1b is lifted upward from the liquid level 1c, and thus the effect that the refrigerant liquid 1b adheres to the inner surface of the accommodation space 11 at the position above the liquid level 1c can be obtained. Consequently, sufficient cooling performance can be obtained even at the second mounts 32 located above the liquid level 1c.
According to the first embodiment, as described above, the refrigerant passage 21 includes the partition plates 43 to partition the refrigerant passage 21 from the external passages 22, the peripheral wall 44 to define the outer periphery of the refrigerant passage 21, and the corrugated fin 45 integrated with the partition plates 43 and the peripheral wall 44 inside the refrigerant passage 21. Accordingly, the heat exchange efficiency between the refrigerant gas 1a passing through the refrigerant passage 21 and the external fluid 2 passing through the external passage 22 can be improved.
According to the first embodiment, as described above, the condensing part 20 has a structure in which the flat plate-shaped first layer 40 including the refrigerant passage 21 and the flat plate-shaped second layer 50 including the connection passage 51 to allow the refrigerant passage 21 and the boiling part 10 to communicate with each other and the external passage 22 are stacked, and the condensing part 20 is stacked on the second wall 15 of the boiling part 10 and integrated with the boiling part 10. Accordingly, the second layer 50 and the first layer 40 are stacked in this order on the boiling part 10, and the stacked body is integrated by a joining method such as brazing such that the boiling cooler 100 can be configured. The boiling cooler 100 has a simple stacked structure, and thus the boiling cooler 100 can be easily obtained.
Referring to
In the second embodiment, configurations other than a boiling part 110 are the same as those of the first embodiment. Only the configuration of the boiling part 110 of the second embodiment is described below.
As shown in
As shown in
Thus, the heat conductive portion 19 including the corrugated fin 160 is connected to the inner surface of the first wall 14 at the first portions 161 and is connected to the inner surface of the second wall 15 at the second portions 162. As shown in
The entire outer surface of the corrugated fin 160 excluding contact points with the first wall 14 and contact points with the second wall 15 becomes a heat transfer surface that exchanges heat with a refrigerant 1 in the accommodation space 11. Therefore, in the second embodiment, as compared with the first embodiment in which three heat conductive portions 19 (partition walls) are provided, the heat transfer area of the heat conductive portion 19 in the accommodation space 11 can be increased, and thus the effect of cooling a refrigerant liquid 1b and condensing a refrigerant gas 1a is improved.
As shown in
The boiling part 110 according to the second embodiment is formed by cutting a flat plate member. That is, the accommodation space 11 is formed by a recess formed on the second wall 15 side of the flat plate member. Therefore, in the boiling part 110, an upper wall portion 17, a lower wall portion 18, a pair of side wall portions 16, and the first wall 14 are integrally formed. After the corrugated fin 160 is housed in the accommodation space 11 of the flat plate member, the accommodation space 11 is closed with the second wall 15, and the flat plate member, the corrugated fin 160, and the second wall 15 are integrated together with the condensing part 20 by vacuum brazing such that the boiling part 110 is configured.
The remaining configurations of the second embodiment are similar to those of the first embodiment.
According to the second embodiment, similarly to the first embodiment, the boiling part 10 includes the accommodation space 11 to accommodate the refrigerant 1, the refrigerant gas outlets 12 connected to the accommodation space 11, and the refrigerant liquid inlets 13 connected to the accommodation space 11, and thus inhibition of movement of the refrigerant liquid 1b by the refrigerant gas 1a can be reduced or prevented. Furthermore, the boiling part 10 includes the first wall 14 to which heating elements HS are mounted, the second wall 15 facing the first wall 14 via the accommodation space 11 and adjacent to an external passage 22, and the heat conductive portion 19 to connect the first wall 14 to the second wall 15 through the accommodation space 11, and thus the heat applied to the first wall 14 from the heating elements HS can be transferred to the second wall 15 by heat conduction through the heat conductive portion 19 to be directly released (not via the refrigerant 1) to an external fluid 2 flowing through the external passage 22 adjacent to the second wall 15. Moreover, a portion of the refrigerant gas 1a in the accommodation space 11 is condensed, and thus the effect of reducing or preventing drying of the refrigerant 1 on the inner surface of the boiling part 10 can be obtained. Consequently, even when the external fluid 2 is at a low temperature, a rapid decrease in cooling performance due to an increase in the amount of heat input can be reduced or prevented.
According to the second embodiment, as described above, the heat conductive portion 19 includes the corrugated fin 160 in the accommodation space 11. Accordingly, the amount of heat transferred by the heat conductive portion 19 can be further increased by the corrugated fin 160.
The remaining advantageous effects of the second embodiment are similar to those of the first embodiment.
Referring to
In the third embodiment, configurations other than a range in which the condensing part 220 is provided are the same as those of the first embodiment.
As shown in
As shown in
Refrigerant passages 21 of the condensing part 220 are provided above the liquid level 1c of a refrigerant liquid 1b in a non-operating state at room temperature with no heat input from heating elements HS. That is, the lower ends of the refrigerant passages 21 are located at a height equal to or higher than the liquid level 1c. In an example of
The remaining configurations of the third embodiment are similar to those of the first embodiment.
According to the third embodiment, similarly to the first embodiment, the boiling part 10 includes the accommodation space 11 to accommodate a refrigerant 1, refrigerant gas outlets 12 connected to the accommodation space 11, and refrigerant liquid inlets 13 connected to the accommodation space 11, and thus inhibition of movement of the refrigerant liquid 1b by a refrigerant gas 1a can be reduced or prevented. Furthermore, the boiling part 10 includes a first wall 14 to which the heating elements HS are mounted, a second wall 15 facing the first wall 14 via the accommodation space 11 and adjacent to an external passage 22, and heat conductive portions 19 to connect the first wall 14 to the second wall 15 through the accommodation space 11, and thus heat applied to the first wall 14 from the heating elements HS can be transferred to the second wall 15 by heat conduction through the heat conductive portions 19 to be directly released (not via the refrigerant 1) to an external fluid 2 flowing through the external passage 22 adjacent to the second wall 15. Moreover, a portion of the refrigerant gas 1a in the accommodation space 11 is condensed, and thus the effect of reducing or preventing drying of the refrigerant 1 on the inner surface of the boiling part 10 can be obtained. Consequently, even when the external fluid 2 is at a low temperature, a rapid decrease in cooling performance due to an increase in the amount of heat input can be reduced or prevented.
The remaining advantageous effects of the third embodiment are similar to those of the first embodiment.
EXAMPLES
Experimental results for confirming the effects of the coolers according to the first to third embodiments are now described.
The cooling performance of each of the cooler 100 according to the first embodiment, the cooler 200 according to the second embodiment, and the cooler 300 according to the third embodiment was measured in a state in which heating elements HS for testing were mounted and heated. At that time, air was sent to the external passages 22 of the condensing part 20 at a predetermined amount. The surface temperature of the mounting surfaces (the outer surface 14a of the first wall 14) of the heating elements HS and the refrigerant temperature in the accommodation space 11 of the boiling part 10 were measured, and a temperature difference ΔT between the measured surface temperature and refrigerant temperature was obtained as an index of cooling performance. The measurement results show that as the temperature difference ΔT decreases, the cooling performance of the boiling part 10 increases.
The six mounts shown in each embodiment are distinguished as P1 to P6 (see
Heating was performed under the following two types of conditions.
(Condition 1) Heating is performed by the six heating elements HS at the mounts P1 to P6.
(Condition 2) Heating is performed by only the three heating elements HS at the upper mounts P4 to P6, and not performed at the lower mounts P1 to P3.
Then, under the condition 1, the temperature difference ΔT at the top mount P6 farthest from the liquid level 1c of the refrigerant 1 and the highest value of the temperature differences ΔT at the lower three mounts P1 to P3 were acquired. Under the condition 2, the temperature difference ΔT at the top mount P6 farthest from the liquid level 1c of the refrigerant 1 was acquired. During temperature measurement, the amount of heat (heat generation density [W/cm2]) generated by each heating element HS was changed in a stepwise manner, and the temperature difference ΔT in each amount of heat generated was acquired.
The horizontal axis of each graph in
From the graphs in
Regarding two measurement results under the “condition 1”, it has been confirmed that a difference between the measurement result (solid line legend 80) at the mount P6 above the liquid level 1c and the measurement result (one-dot chain line legend 82) at the mount P1, P2, or P3 below the liquid level 1c is sufficiently small as compared with a difference between the measurement result (solid line legend 80) at the mount P6 above the liquid level 1c and the measurement result under the condition 2 shown by the broken line legend 81.
From these results, it has been confirmed that in the coolers 100 to 300 according to the first to third embodiments, the cooling performance close to that at the first mounts 31 can be obtained not only for the heating elements HS at the first mounts 31 but also for the heating elements HS mounted to the second mounts 32 above the liquid level 1c when the heating elements HS are mounted to both the first mounts 31 below the liquid level 1c of the refrigerant 1 and the second mounts 32 above the liquid level 1c, and cooled.
From this, in the coolers 100 to 300 according to the first to third embodiments, heat is input to the first mounts 31 below the liquid level 1c, in a situation (condition 1) in which a sufficient amount of vaporization is ensured, a portion of the refrigerant gas 1a rising from the liquid level 1c comes into contact with the second wall 15 and the heat conductive portion(s) 19, which are cooled by heat exchange with the external fluid 2, and is condensed to adhere to the inner surface of the accommodation space 11 at the position above the liquid level 1c, and as the boiled refrigerant gas 1a rises, a portion of the refrigerant liquid 1b is lifted upward from the liquid level 1c to adhere to the inner surface of the accommodation space 11 at the position above the liquid level 1c. Therefore, drying of the inner surface of the accommodation space 11 is reduced or prevented even at the position above the liquid level 1c, and thus the effect of maintaining the cooling performance at the second mount 32 has been suggested.
Referring to
In the fourth embodiment, configurations other than the boiling part 410 are the same as those of the third embodiment.
As shown in
In the Z direction, the upper end 19c of each heat conductive portion 19 extends to the vicinity of the upper end of an arrangement region 440 of a heating element HS, and the lower end 19d of each heat conductive portion 19 extends to the vicinity of the lower end of an arrangement region 440 of a heating element HS. There is a gap between the upper end 19c of each heat conductive portion 19 and an upper wall 17, and upper portions of the five passage portions 411 communicate with each other. Furthermore, between the lower end 19d of each heat conductive portion 19 and a lower wall 18, there is a connection path 412 that allows lower portions of the five passage portions 411 to communicate with each other. The upper end 19c of each heat conductive portion 19 may contact the upper wall 17, and the upper portions of the five passage portions 411 may not communicate with each other.
The plurality of passage portions 411 include first passage portions 411a and second passage portions 411b. In
The two first passage portions 411a have the same shape. The first passage portions 411a are arranged at positions overlapping with the arrangement regions 440 of the heating elements HS via a first wall 14. In an example of
The three second passage portions 411b are arranged at positions (positions shifted from the arrangement regions 440) not overlapping with the arrangement regions 440 of the heating elements HS via the first wall 14. Therefore, the first passage portions 411a and the heat conductive portions 19 are interposed in a heat transfer path from the heating elements HS to the second passage portions 411b. Unlike the first passage portions 411a, the second passage portions 411b are not provided with uneven portions 413. The second passage portions 411b are adjacent to the first passage portions 411a and communicate with the refrigerant liquid inlets 13 (see
As shown in
One second passage portion 411b at the center in the X direction has a width W42a. Each of the two second passage portions 411b on both sides in the X direction has a width W42b. Although the width W42a is larger than the width W42b, the width W42a and the width W42b may be the same, or the width W42a may be smaller.
As shown in
As shown in
The refrigerant liquid inlets 13 are provided at positions not opening to the first passage portions 411a but opening to the second passage portions 411b. A total of three refrigerant liquid inlets 13 are provided, one for each of the three second passage portions 411b. Each refrigerant liquid inlet 13 is provided at a position overlapping with the corresponding second passage portion 411b in the Y direction. In
With such a configuration, in the fourth embodiment, the first passage portions 411a are configured as passages dedicated for a refrigerant gas 1a going from the boiling part 410 to the condensing part 220, and the second passage portions 411b are configured as passages dedicated for a refrigerant liquid 1b returning from the condensing part 220 to the boiling part 410.
In the first passage portions 411a provided directly below the arrangement regions 440, the refrigerant liquid 1b boils and becomes a refrigerant gas 1a due to heat input from the heating elements HS. The refrigerant gas 1a in the first passage portions 411a moves upward in the Z direction, flows into the condensing part 220 through the refrigerant gas outlets 12, and is cooled and condensed in the condensing part 220. A portion of the heat from the heating elements HS is also transferred to the second passage portions 411b, but most of the heat is transferred from the first wall 14 to the second wall 15 in the heat conductive portions 19 between the first passage portions 411a and the second passage portions 411b and is absorbed by an external fluid 2 (see
The refrigerant liquid 1b condensed in the condensing part 220 flows into each refrigerant liquid inlet 13 due to the action of gravity. Therefore, the refrigerant liquid 1bflows to the second passage portions 411b of the boiling part 410 through the refrigerant liquid inlets 13 without directly flowing into the first passage portions 411a. The refrigerant liquid 1b that has flowed into the second passage portions 411b merges with the refrigerant liquid 1b stored in the lower portions of the second passage portions 411b. In an example of
Thus, in the fourth embodiment, a movement path of the refrigerant gas 1a going from the boiling part 410 to the condensing part 220 and a movement path of the refrigerant liquid 1b returning from the condensing part 220 to the boiling part 410 are connected to each other without overlapping. Therefore, especially at the refrigerant liquid inlets 13, the flow of the refrigerant gas 1a flowing upward in the Z direction and the flow of the refrigerant liquid 1bflowing downward in the Z direction do not collide with each other.
The remaining configurations of the fourth embodiment are similar to those of the third embodiment.
According to the fourth embodiment, similarly to the first embodiment, the boiling part 410 includes the accommodation space 11 to accommodate the refrigerant 1, the refrigerant gas outlets 12 connected to the accommodation space 11, and the refrigerant liquid inlets 13 connected to the accommodation space 11, and thus inhibition of movement of the refrigerant liquid 1b by the refrigerant gas 1a can be reduced or prevented. Furthermore, the boiling part 410 includes the first wall 14 to which the heating elements HS are mounted, the second wall 15 facing the first wall 14 via the accommodation space 11 and adjacent to the external passage 22, and the heat conductive portions 19 to connect the first wall 14 to the second wall 15 through the accommodation space 11, and thus even when the external fluid 2 is at a low temperature, a rapid decrease in cooling performance due to an increase in the amount of heat input can be reduced or prevented.
According to the fourth embodiment, as described above, the heat conductive portions 19 extend in the Z direction from the refrigerant liquid inlets 13 toward the refrigerant gas outlets 12 in the accommodation space 11, and are operable to partition the accommodation space 11 into the plurality of passage portions 411. The plurality of passage portions 411 include the first passage portions 411a arranged at the positions overlapping with the arrangement regions 440 of the heating elements HS via the first wall 14 and communicating with the refrigerant gas outlets 12, and the second passage portions 411b adjacent to the first passage portions 411a and communicating with the refrigerant liquid inlets 13, and the lower portions of the first passage portions 411a and the lower portions of the second passage portions 411b communicate with each other. Accordingly, the first passage portions 411athrough which the refrigerant gas 1a going to the condensing part 220 flows and the second passage portions 411b through which the refrigerant liquid 1b returning from the condensing part 220 to the boiling part 410 flows can be separately provided in the accommodation space 11. When the refrigerant liquid 1b is returned to the middle of the movement path of the refrigerant gas 1a, the circulation of the refrigerant 1 may be hindered by collision between the flow of the refrigerant gas 1a and the flow of the refrigerant liquid 1b. In this regard, according to the above configuration, the movement path (first passage portions 411a) of the refrigerant gas 1a and the movement path (second passage portions 411b) of the refrigerant liquid 1b can be made separate, and thus the refrigerant 1 can be circulated smoothly. Consequently, the heat exchange efficiency can be improved.
According to the fourth embodiment, as described above, the refrigerant liquid inlets 13 are provided at the positions not opening to the first passage portions 411a but opening to the second passage portions 411b. Accordingly, the second passage portions 411b can be configured as passages dedicated for the refrigerant liquid 1b returning from the condensing part 220. The movement path (first passage portions 411a) of the refrigerant gas 1a and the movement path (second passage portions 411b) of the refrigerant liquid 1b in the boiling part 410 can be separated, and thus collision between the flow of the refrigerant gas 1a and the flow of the refrigerant liquid 1b can be prevented.
The remaining advantageous effects of the fourth embodiment are similar to those of the third embodiment.
Referring to
As shown in
Along with this, each refrigerant passage 521 of the condensing part 520 is provided along the Y-Z plane, receives a refrigerant gas 1a from an upper portion of the end face in a Y1 direction, and sends a refrigerant liquid 1b obtained by condensing the refrigerant gas 1a from a lower portion of the end face in the Y1 direction to the boiling part 510. The external passages 522 (second layers 50) and the refrigerant passages 521 (first layers 40) are stacked in the X direction. In the first to fourth embodiments, each refrigerant passage communicates with the boiling part via the refrigerant gas distribution passage 23 (see
As shown in
In the fifth embodiment, a refrigerant gas distribution passage 23 (see
As shown in
Similarly, the second wall 15 of the boiling part 510 includes the refrigerant liquid inlets 13 connected to the plurality of refrigerant passages 521. In the example of
As shown in
In the Z direction, the upper end 19c of each heat conductive portion 19 contacts an upper wall 17, and the lower end 19d of each heat conductive portion 19 extends to the vicinity of a lower wall 18. A space between the lower end 19d of each heat conductive portion 19 and the lower wall 18 serves as a connection path 512 that allows lower portions of the four passage portions 511 to communicate with each other. A plurality of linear uneven portions 513 extending in the Z direction are provided on the inner surface of a first wall 14 in each passage portion 511. As shown in
As shown in
The distribution portion 560a is provided adjacent to the refrigerant gas outlets 12 (see
The distribution portion 560b is provided adjacent to the refrigerant liquid inlets 13 (see
With such a configuration, in the fifth embodiment, the refrigerant passages 521 are directly connected to the refrigerant gas outlets 12 and the refrigerant liquid inlets 13 of the boiling part 510, and the distribution portions 560a and 560b are provided in the accommodation space 11 of the boiling part 510 to allow the refrigerant passages 521 and the passage portions 511 to communicate with each other.
In the passage portions 511, the refrigerant liquid 1b boils and becomes a refrigerant gas 1a due to heat input from the heating elements HS. The refrigerant gas 1a in the passage portions 511 moves upward in the Z direction and merges at the distribution portion 560a. The refrigerant gas 1a that has merged at the distribution portion 560a flows into the refrigerant passages 521 of the condensing part 520 through the refrigerant gas outlets 12 (see
The refrigerant gas 1a is cooled and condensed in each refrigerant passage 521. Due to the action of gravity, the condensed refrigerant liquid 1b flows from one of the refrigerant liquid inlets 13 (see
The refrigerant liquid 1b that has been vaporized and decreased in each passage portion 511 can be replenished from another passage portion 511 through the distribution portion 560b or the lower connection path 512, and thus the amount of refrigerant liquid 1b stored in each passage portion 511 is made uniform. In this manner, the refrigerant 1 is circulated in the cooler 500.
The remaining configurations of the fifth embodiment are similar to those of the third embodiment.
According to the fifth embodiment, similarly to the first embodiment, the boiling part 510 includes the accommodation space 11 to accommodate the refrigerant 1, the refrigerant gas outlets 12 connected to the accommodation space 11, and the refrigerant liquid inlets 13 connected to the accommodation space 11, and thus inhibition of movement of the refrigerant liquid 1b by the refrigerant gas 1a can be reduced or prevented. Furthermore, the boiling part 510 includes the first wall 14 to which the heating elements HS are mounted, the second wall 15 facing the first wall 14 via the accommodation space 11 and adjacent to the external passage 22, and the heat conductive portions 19 to connect the first wall 14 to the second wall 15 through the accommodation space 11, and thus even when the external fluid 2 is at a low temperature, a rapid decrease in cooling performance due to an increase in the amount of heat input can be reduced or prevented.
According to the fifth embodiment, as described above, the condensing part 520 includes the plurality of refrigerant passages 521, the heat conductive portions 19 extend in the Z direction from the refrigerant liquid inlets 13 toward the refrigerant gas outlets 12 in the accommodation space 11, and are operable to partition the accommodation space 11 into the plurality of passage portions 511, and the boiling cooler 500 further includes, in the portion of the accommodation space 11 of the boiling part 510, the distribution portion 560a to allow the plurality of refrigerant passages 521 and the plurality of passage portions 511 to communicate with each other. Accordingly, even when the accommodation space 11 is partitioned into the plurality of passage portions 511, the refrigerant gas 1a can flow between each of the plurality of passage portions 511 and each of the plurality of refrigerant passages 521 in the condensing part 520 by providing the distribution portion 560a. Consequently, even when there is a difference in the flow rate of the refrigerant gas 1a between the plurality of passage portions 511, for example, variations in the flow rate of the refrigerant gas 1a to the plurality of refrigerant passages 521 can be reduced or prevented by interposing the distribution portion 560. Therefore, variations in heat exchange performance during operation of the boiling cooler 500 can be effectively reduced or prevented.
According to the fifth embodiment, the distribution portion 560b is provided. Accordingly, a wide space (distribution portion 560b) can be provided at a location at which the flow of the refrigerant gas 1a and the flow of the refrigerant liquid 1b collide with each other to allow the plurality of passage portions 511 to communicate with each other. Therefore, even when the refrigerant liquid 1b flows into the passage portions 511 through the refrigerant liquid inlets 13, a sufficient volume is ensured, and thus obstruction of the flow of the refrigerant gas 1a by the flow of the refrigerant liquid 1b can be reduced or prevented. Consequently, the refrigerant 1 can be circulated smoothly, and thus the heat exchange efficiency can be improved.
According to the fifth embodiment, the distribution portion 560a and the distribution portion 560b are provided. Accordingly, a refrigerant gas distribution passage 23 (see
The remaining advantageous effects of the fifth embodiment are similar to those of the third embodiment.
Referring to
As shown in
The condensing part 620 has the same configuration as that of the fifth embodiment. External passages 622 pass through the condensing part 620 in a Z direction and allow an external fluid 2 to flow therethrough in the Z direction. Refrigerant passages 621 of the condensing part 620 are provided along a Y-Z plane, receive a refrigerant gas 1a from upper portions of the end faces in a Y1 direction, and send a refrigerant liquid 1b obtained by condensing the refrigerant gas 1a from lower portions of the end faces in the Y1 direction to the boiling part 610.
The boiling part 610 has a similar configuration as that of the fourth embodiment. That is, as shown in
The first passage portions 611a are arranged at positions overlapping with arrangement regions 640 of heating elements HS via a first wall 14, and communicate with the refrigerant gas outlets 12 (see
As shown in
The cooler 600 according to the sixth embodiment further includes distribution portions 660a and 660b that are provided in the second wall 15 of the boiling part 610 and allow a plurality of refrigerant passages 621 and the plurality of passage portions 611 to communicate with each other. That is, in the fifth embodiment, the distribution portions 560a and 560b are provided in the accommodation space 11 of the boiling part 510, but in this sixth embodiment, the distribution portions 660a and 660b are provided in the second wall 15.
Specifically, the second wall 15 includes a stacked body of a first plate 616 in which the refrigerant gas outlets 12 and the refrigerant liquid inlets 13 are provided, and a second plate 617 in which the distribution portions 660a and 660b are provided.
The distribution portion 660a is formed into a rectangular shape extending in the X direction so as to encompass the two refrigerant gas outlets 12, and passes through the second plate 617 in the thickness direction. Therefore, as shown in
Therefore, in
The distribution portion 660b is formed into a rectangular shape extending in the X direction so as to encompass the three refrigerant liquid inlets 13, and passes through the second plate 617 in the thickness direction. Therefore, as shown in
Therefore, in
The thickness of the second plate 617 provided with the distribution portions 660a and 660b is larger than the thickness of the first plate 616. Therefore, the distribution portions 660a and 660b are spaces having a volume corresponding to the thickness of the second plate 617. The volume of the distribution portion 660a is increased such that even when the flow rate (amount of generation) of the refrigerant gas 1a in the two first passage portions 611a varies, variations in the flow rate of the refrigerant gas 1a flowing to the refrigerant passages 621 can be reduced or prevented by merging the refrigerant gas 1a from the two first passage portions 611a at the distribution portion 660a and temporarily storing the refrigerant gas 1a corresponding to the volume.
In
The refrigerant liquid 1b condensed in each refrigerant passage 621 flows from each refrigerant passage 621 into the distribution portion 660b due to the action of gravity. The refrigerant liquid 1b flows to the second passage portions 611b of the boiling part 610 through the refrigerant liquid inlets 13 after merging at the distribution portion 660b. Consequently, the refrigerant liquid 1b that has flowed into the second passage portions 611b merges with the refrigerant liquid 1b stored in the lower portions of the second passage portions 611b. The liquid level 1c of a refrigerant 1 is set at a height in the vicinity of intermediate positions of the refrigerant liquid inlets 13. The refrigerant liquid 1b that has been vaporized and decreased in the first passage portions 611a is replenished from the second passage portions 611b through the lower connection path 612 (see
The remaining configurations of the sixth embodiment are similar to those of the fifth embodiment.
According to the sixth embodiment, similarly to the first embodiment, the boiling part 610 includes the accommodation space 11 to accommodate the refrigerant 1, the refrigerant gas outlets 12 connected to the accommodation space 11, and the refrigerant liquid inlets 13 connected to the accommodation space 11, and thus inhibition of movement of the refrigerant liquid 1b by the refrigerant gas 1a can be reduced or prevented. Furthermore, the boiling part 610 includes the first wall 14 to which the heating elements HS are mounted, the second wall 15 facing the first wall 14 via the accommodation space 11 and adjacent to the external passage 622, and the heat conductive portions 19 to connect the first wall 14 to the second wall 15 through the accommodation space 11, and thus even when the external fluid 2 is at a low temperature, a rapid decrease in cooling performance due to an increase in the amount of heat input can be reduced or prevented.
According to the sixth embodiment, similarly to the fourth embodiment, the heat conductive portions 19 partition the accommodation space 11 into the first passage portions 611a that communicate with the refrigerant gas outlets 12 and the second passage portions 611b that communicate with the refrigerant liquid inlets 13, and thus the circulation of the refrigerant 1 is not hindered by collision between the flow of the refrigerant gas 1a and the flow of the refrigerant liquid 1b, and the refrigerant 1 can be circulated smoothly. Consequently, the heat exchange efficiency can be improved.
According to the sixth embodiment, as described above, the boiling cooler 600 includes, in the second wall 15 of the boiling part 610, the distribution portion 660a to allow the plurality of refrigerant passages 621 and the plurality of passage portions 611 to communicate with each other. Accordingly, even when there is a difference in the flow rate of the refrigerant gas 1a between the first passage portions 611a, variations in the flow rate of the refrigerant gas 1a to the plurality of refrigerant passages 621 can be reduced or prevented by interposing the distribution portion 660a. Consequently, variations in heat exchange performance during operation of the boiling cooler 600 can be effectively reduced or prevented.
The remaining advantageous effects of the sixth embodiment are similar to those of the fifth embodiment.
Referring to
As shown in
Although the overall cooler 700 according to the seventh embodiment has a horizontally elongated shape extending in an X direction, it may have a vertically elongated shape extending in the Z direction, similarly to the first to sixth embodiments.
The refrigerant passages 721 of the condensing part 720 are provided along an X-Z plane, and as shown in
The boiling part 710 includes an accommodation space 11 extending in the X direction. As shown in
Heat conductive portions 19 extend in the Z direction in the accommodation space 11 and partition the accommodation space 11 into a plurality of passage portions 711. Specifically, in the accommodation space 11, five heat conductive portions 19 are arranged side by side in the X direction between the outlet-side accommodation portion 771 and the inlet-side accommodation portion 772, and partition the accommodation space 11 into six passage portions 711.
In the Z direction, the upper ends 19c of the heat conductive portions 19 extend to the vicinity of an upper wall 17, and the lower ends 19d of the heat conductive portions 19 extend to the vicinity of a lower wall 18. An upper connection path 712 extending in the X direction and allowing the six passage portions 711 to communicate with the outlet-side accommodation portion 771 is provided between the upper ends 19c of the heat conductive portions 19 and the upper wall 17. A lower connection path 713 extending in the X direction and allowing the six passage portions 711 to communicate with the inlet-side accommodation portion 772 is provided between the lower ends 19d of the heat conductive portions 19 and the lower wall 18. The liquid level 1c of a refrigerant 1 is set in the vicinity of intermediate positions of the passage portions 711, for example.
The Z-direction dimension H71 of the outlet-side accommodation portion 771 is larger than the Z-direction width W71 of the upper connection path 712. The Z-direction dimension H72 of the inlet-side accommodation portion 772 is larger than the width W72 of the lower connection path 713. The Z-direction dimension H71 may be equal to or less than the width W71, and the Z-direction dimension H72 may be equal to or less than the width W72.
A plurality of linear uneven portions 714 extending in the Z direction are provided on the inner surface of a first wall 14 in the passage portions 711. The uneven portions 714 increase the heat transfer areas of the passage portions 711.
As shown in
The refrigerant liquid inlet 13 is arranged at an end in the X2 direction in a lower portion of the second wall 15 in the Z direction, overlapping with the inlet-side accommodation portion 772 in the Y direction. The refrigerant liquid inlet 13 communicates with the refrigerant passages 721 via a refrigerant liquid collection passage 24 arranged at a second end of the condensing part 720 in the X2 direction.
In the passage portions 711 shown in
The refrigerant liquid 1b that has been vaporized and decreased in the passage portions 711 is replenished from the lower end sides of the passage portions 711 through the refrigerant liquid collection passage 24, the inlet-side accommodation portion 772, and the lower connection path 713. In this manner, the refrigerant 1 is circulated in the cooler 700.
The remaining configurations of the seventh embodiment are similar to those of the fifth embodiment.
According to the seventh embodiment, similarly to the first embodiment, the boiling part 710 includes the accommodation space 11 to accommodate the refrigerant 1, the refrigerant gas outlet 12 connected to the accommodation space 11, and the refrigerant liquid inlet 13 connected to the accommodation space 11, and thus inhibition of movement of the refrigerant liquid 1b by the refrigerant gas 1a can be reduced or prevented. Furthermore, the boiling part 710 includes the first wall 14 to which the heating elements HS are mounted, the second wall 15 facing the first wall 14 via the accommodation space 11 and adjacent to the external passage 722, and the heat conductive portions 19 to connect the first wall 14 to the second wall 15 through the accommodation space 11, and thus even when the external fluid 2 is at a low temperature, a rapid decrease in cooling performance due to an increase in the amount of heat input can be reduced or prevented.
The cooler 700 according to the seventh embodiment includes the condensing part 720 having a structure in which the flat plate-shaped first layers 40 including the refrigerant passages 721 and the flat plate-shaped second layers 50 including the external passages 722 are stacked, the external passages 722 pass through the condensing part 720 in the Z direction, and the boiling part 710 and the first layers 40 (refrigerant passages 721) and the second layers 50 (external passages 722) constituting the condensing part 720 are stacked in the single direction (Y direction). Accordingly, the components of the condensing part 720 can be joined together by brazing the assembly in which the boiling part 710 and the components of the condensing part 720 are stacked when the cooler 700 is manufactured. Therefore, the cooler 700 can be manufactured in a single brazing step.
The remaining advantageous effects of the seventh embodiment are similar to those of the first embodiment.
In the present invention, the heating element may be a semiconductor chip such as a CPU or an electronic circuit mounted on an electronic device such as a server.
In the present invention, the heat conductive portion(s) 19 may have a columnar shape (such as a cylindrical shape or a prismatic shape) extending in the Y direction or have a shape extending obliquely in the Z direction and the X direction, for example. Such a heat conductive portion 19 may correspond to neither a partition wall nor a corrugated fin in the accommodation space 11.
The upper end(s) of the heat conductive portion(s) 19 may 19 may be located below the refrigerant gas outlets 12, or the lower end(s) of the heat conductive portion(s) 19 may be located above the refrigerant liquid inlets 13. Alternatively, the heat conductive portion(s) 19 may be divided into a plurality of portions.
In the present invention, only the first mounts 31 may be provided on the outer surface of the first wall 14.
In the present invention, the refrigerant passage 21 may 21 may be a simple hollow passage or a multi-hole tube having a plurality of independent conduits.
In the present invention, the annular peripheral wall 44 may be provided integrally with one or both of the pair of partition plates 43. For example, one partition plate and an annular peripheral wall may be integrated to configure a concave member, the other partition plate may be formed into a flat plate shape, and the concave member and the other partition plate may be integrated by brazing to configure the refrigerant passage 21. Similarly, half of an annular peripheral wall may be formed integrally with one partition plate and the other partition plate to form a concave shape, and peripheral wall portions of both the partition plates may be integrated by brazing to configure the refrigerant passage 21.
The condensing part 20 only needs to have at least one refrigerant passage 21 and at least one external passage 22.
In the present invention, for example, the boiling part 10 and the condensing part 20 may be integrally formed by a so-called additive manufacturing method using a 3D printer, or portions constituting the boiling part 10 and the condensing part 20 may be joined by a method other than brazing such as welding.
For example, when a cylindrical heating element such as a motor is cooled, the outer shape of the cooler may be circular to match the heating element (motor), and the circular axial end face of the motor may be mounted to a circular (or annular) first wall.
The refrigerant gas outlets 12 may open to both the first passage portions 411a (611a) and the second passage portions 411b (611b).
For example, in
In each of the aforementioned first to fourth embodiments, the external passages passing through the condensing part in the Z direction may be provided. In each of the aforementioned fifth to seventh embodiments, the external passages passing through the condensing part in the X direction may be provided.
In the present invention, the heat conductive portions 19 in each of the aforementioned fourth to seventh embodiments may include a corrugated fin 160 shown in the aforementioned second embodiment (
Number | Date | Country | Kind |
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2021-152161 | Sep 2021 | JP | national |
This application is a continuation of PCT application PCT/JP2022/034557, filed on Sep. 15, 2022, claiming a priority of Japanese Patent Application No. 2021-152161 filed on Sep. 17, 2021, the disclosure of which is incorporated herein.
Number | Date | Country | |
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Parent | PCT/JP23/34557 | Sep 2022 | WO |
Child | 18605961 | US |