with simultaneous manufacture of periphery and memory cells

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CPC
H01L27/10894

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

Current Industry

H01L27/10894with simultaneous manufacture of periphery and memory cells

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices
- Patent number 11,678,478
- Issue date Jun 13, 2023
- Samsung Electronics Co., Ltd.
- Youngjun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,670,700
- Issue date Jun 6, 2023
- Samsung Electronics Co., Ltd.
- Young-Kwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded semiconductor devices having processor and static random-acc...
- Patent number 11,659,702
- Issue date May 23, 2023
- Yangtze Memory Technologies Co., Ltd.
- Jun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming patterns using reverse patterns
- Patent number 11,651,962
- Issue date May 16, 2023
- SK Hynix Inc.
- Jung Hyung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded unified semiconductor chips and fabrication and operation me...
- Patent number 11,631,688
- Issue date Apr 18, 2023
- Yangtze Memory Technologies Co., Ltd.
- Jun Liu
- G11 - INFORMATION STORAGE
Information Patent Grant
Vertical contacts for semiconductor devices
- Patent number 11,631,681
- Issue date Apr 18, 2023
- Micron Technology, Inc.
- Byung Yoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor memory device and structure
- Patent number 11,615,977
- Issue date Mar 28, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
3D semiconductor device and structure with metal layers and a conne...
- Patent number 11,616,004
- Issue date Mar 28, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 11,616,059
- Issue date Mar 28, 2023
- Samsung Electronics Co., Ltd.
- Jong Sung Woo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor device using multipe photolitho...
- Patent number 11,610,898
- Issue date Mar 21, 2023
- Samsung Electronics Co., Ltd.
- Hyun-Chul Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a 3D semiconductor device and structure with s...
- Patent number 11,610,802
- Issue date Mar 21, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory cell, memory array and method for defining active area of me...
- Patent number 11,610,899
- Issue date Mar 21, 2023
- NANYA TECHNOLOGY CORPORATION
- Yuan-Yuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Landing pad structure
- Patent number 11,610,897
- Issue date Mar 21, 2023
- Winbond Electronics Corp.
- Keng-Ping Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D integrated circuit device and structure with hybrid bonding
- Patent number 11,605,630
- Issue date Mar 14, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Semiconductor memory device and method of fabricating the same
- Patent number 11,600,570
- Issue date Mar 7, 2023
- Samsung Electronics Co., Ltd.
- Hyo-Sub Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers and a conne...
- Patent number 11,594,473
- Issue date Feb 28, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of preparing semiconductor device with crystalline overlayer
- Patent number 11,594,605
- Issue date Feb 28, 2023
- NANYA TECHNOLOGY CORPORATION
- Te-Yin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing semiconductor device with composite landing pad
- Patent number 11,587,876
- Issue date Feb 21, 2023
- NANYA TECHNOLOGY CORPORATION
- Chun-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing semiconductor devices
- Patent number 11,581,318
- Issue date Feb 14, 2023
- Samsung Electronics Co., Ltd.
- Hye Sung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including insulating patterns and method for f...
- Patent number 11,574,915
- Issue date Feb 7, 2023
- Samsung Electronics Co., Ltd.
- Wooyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device including wiring contact plugs
- Patent number 11,569,171
- Issue date Jan 31, 2023
- Samsung Electronics Co., Ltd.
- Yonghyeok Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with single-crystal layers
- Patent number 11,569,117
- Issue date Jan 31, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 11,521,977
- Issue date Dec 6, 2022
- Samsung Electronics Co., Ltd.
- Kiseok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with high-k metal gate transi...
- Patent number 11,521,888
- Issue date Dec 6, 2022
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
3D semiconductor memory device and structure
- Patent number 11,508,605
- Issue date Nov 22, 2022
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with peripheral gate structures
- Patent number 11,502,082
- Issue date Nov 15, 2022
- Samsung Electronics Co., Ltd.
- Ho-In Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 11,502,181
- Issue date Nov 15, 2022
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor devices and structures with at least two single-cr...
- Patent number 11,495,484
- Issue date Nov 8, 2022
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,495,605
- Issue date Nov 8, 2022
- Winbond Electronics Corp.
- Chi-An Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing a 3D semiconductor memory device comprising c...
- Patent number 11,482,439
- Issue date Oct 25, 2022
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240188277
- Publication date Jun 6, 2024
- WINBOND ELECTRONICS CORP.
- Shih-Han Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH PERIPHERAL GATE STRUCTURE AND METHOD FOR...
- Publication number 20240130102
- Publication date Apr 18, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID MANUFACTURING OF ACCESS TRANSISTORS FOR MEMORY
- Publication number 20240098965
- Publication date Mar 21, 2024
- Intel Corporation
- Abhishek A. Sharma
- G11 - INFORMATION STORAGE
Information Patent Application
APPARATUS COMPRISING A METAL PORTION IN THE TOP PORTION OF CAPACITO...
- Publication number 20240090197
- Publication date Mar 14, 2024
- Micron Technology, Inc.
- Harutaka Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES, AND RELATED MEMORY DEVICES, ELECTRONIC SYS...
- Publication number 20240081048
- Publication date Mar 7, 2024
- Micron Technology, Inc.
- Yuri Ishizaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE INCLUDING STRUCTURES IN MEMORY ARRAY REGION AND PERIP...
- Publication number 20240064972
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Si-Woo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20240049444
- Publication date Feb 8, 2024
- Changxin Memory Technologies, Inc.
- Kang YOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240032271
- Publication date Jan 25, 2024
- WINBOND ELECTRONICS CORP.
- Jiun-Sheng YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20230403848
- Publication date Dec 14, 2023
- Fujian Jinhua Integrated Circuit Co., Ltd.
- Yukihiro Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH PROGRAMABLE FEATURE
- Publication number 20230389302
- Publication date Nov 30, 2023
- NANYA TECHNOLOGY CORPORATION
- YIN-FA CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR DEVICE WITH PROGRAMMBLE FEATURE
- Publication number 20230389272
- Publication date Nov 30, 2023
- NANYA TECHNOLOGY CORPORATION
- YIN-FA CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING MEMORY DEVICE HAVING A PROTRUDING CHANNEL...
- Publication number 20230371232
- Publication date Nov 16, 2023
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20230363148
- Publication date Nov 9, 2023
- Micron Technology, Inc.
- Yuki Munetaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICES
- Publication number 20230363149
- Publication date Nov 9, 2023
- Samsung Electronics Co., Ltd.
- So Hyeon Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR MEMORY STRUCTURE
- Publication number 20230337417
- Publication date Oct 19, 2023
- WINBOND ELECTRONICS CORP.
- Ling-Chun TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230328956
- Publication date Oct 12, 2023
- Samsung Electronics Co., Ltd.
- Jihye Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREFOR, AND MEMORY
- Publication number 20230328954
- Publication date Oct 12, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Xingsong SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20230320082
- Publication date Oct 5, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Zhihao SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE HAVING DIODE CONNECTE...
- Publication number 20230320064
- Publication date Oct 5, 2023
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIRGAPS USED IN BACKEND MEMORY STRUCTURES
- Publication number 20230307352
- Publication date Sep 28, 2023
- Intel Corporation
- Miriam R. Reshotko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY, SEMICONDUCTOR STRUCTURE, AND MANUFACTURING METHOD THEREOF
- Publication number 20230301056
- Publication date Sep 21, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Runping WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Fabricating the Same
- Publication number 20230284436
- Publication date Sep 7, 2023
- Fujian Jinhua Integrated Circuit Co., Ltd.
- Yukihiro Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230284437
- Publication date Sep 7, 2023
- NANYA TECHNOLOGY CORPORATION
- Chiang-Lin SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING CELL ARRAY AND PERIPHERAL REGIONS THEREIN
- Publication number 20230276619
- Publication date Aug 31, 2023
- Samsung Electronics Co., Ltd.
- Jungmin Ju
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20230262966
- Publication date Aug 17, 2023
- Fujian Jinhua Integrated Circuit Co., Ltd.
- YAOGUANG XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR STRUCTURE AND SEMICONDUCTOR DEVICE INCLUDING THE SAME
- Publication number 20230255013
- Publication date Aug 10, 2023
- Samsung Electronics Co., Ltd.
- Beomjong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSE AMPLIFIER CIRCUIT, METHOD FOR OPERATING SAME, AND FABRICATION...
- Publication number 20230253030
- Publication date Aug 10, 2023
- Changxin Memory Technologies, Inc.
- Qinghua HAN
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20230230841
- Publication date Jul 20, 2023
- WINBOND ELECTRONICS CORP.
- Chang-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20230232619
- Publication date Jul 20, 2023
- Samsung Electronics Co., Ltd.
- Hosun JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20230225117
- Publication date Jul 13, 2023
- Samsung Electronics Co., Ltd.
- Jiseok HONG
- H01 - BASIC ELECTRIC ELEMENTS

with simultaneous manufacture of periphery and memory cells

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor devices

Semiconductor device

Bonded semiconductor devices having processor and static random-acc...

Method of forming patterns using reverse patterns

Bonded unified semiconductor chips and fabrication and operation me...

Vertical contacts for semiconductor devices

3D semiconductor memory device and structure

3D semiconductor device and structure with metal layers and a conne...

Semiconductor device and method of fabricating the same

Method of fabricating semiconductor device using multipe photolitho...

Method for producing a 3D semiconductor device and structure with s...

Memory cell, memory array and method for defining active area of me...

Landing pad structure

3D integrated circuit device and structure with hybrid bonding

Semiconductor memory device and method of fabricating the same

3D semiconductor device and structure with metal layers and a conne...

Method of preparing semiconductor device with crystalline overlayer

Method for preparing semiconductor device with composite landing pad

Methods of manufacturing semiconductor devices

Semiconductor device including insulating patterns and method for f...

Semiconductor memory device including wiring contact plugs

3D semiconductor device and structure with single-crystal layers

Semiconductor memory device

3D semiconductor device and structure with high-k metal gate transi...

3D semiconductor memory device and structure

Semiconductor devices with peripheral gate structures

Semiconductor device and method for fabricating the same

3D semiconductor devices and structures with at least two single-cr...

Semiconductor structure and manufacturing method thereof

Methods for producing a 3D semiconductor memory device comprising c...

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE WITH PERIPHERAL GATE STRUCTURE AND METHOD FOR...

HYBRID MANUFACTURING OF ACCESS TRANSISTORS FOR MEMORY

APPARATUS COMPRISING A METAL PORTION IN THE TOP PORTION OF CAPACITO...

MICROELECTRONIC DEVICES, AND RELATED MEMORY DEVICES, ELECTRONIC SYS...

MEMORY DEVICE INCLUDING STRUCTURES IN MEMORY ARRAY REGION AND PERIP...

SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE WITH PROGRAMABLE FEATURE

METHOD OF FABRICATING SEMICONDUCTOR DEVICE WITH PROGRAMMBLE FEATURE

METHOD FOR MANUFACTURING MEMORY DEVICE HAVING A PROTRUDING CHANNEL...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR MEMORY DEVICES

METHOD FOR FORMING SEMICONDUCTOR MEMORY STRUCTURE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREFOR, AND MEMORY

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE HAVING DIODE CONNECTE...

AIRGAPS USED IN BACKEND MEMORY STRUCTURES

MEMORY, SEMICONDUCTOR STRUCTURE, AND MANUFACTURING METHOD THEREOF

Semiconductor Device and Method of Fabricating the Same

SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICES HAVING CELL ARRAY AND PERIPHERAL REGIONS THEREIN

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

CAPACITOR STRUCTURE AND SEMICONDUCTOR DEVICE INCLUDING THE SAME

SENSE AMPLIFIER CIRCUIT, METHOD FOR OPERATING SAME, AND FABRICATION...

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR MEMORY DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME