With simultaneous mechanical treatment

Industry

CPC
H01L21/30625

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/30625With simultaneous mechanical treatment

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Slurry composition for chemical mechanical polishing
- Patent number 12,319,841
- Issue date Jun 3, 2025
- Samsung Electronics Co., Ltd.
- Inkwon Kim
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Wafer processing laminate, temporary adhesive material for wafer pr...
- Patent number 12,322,637
- Issue date Jun 3, 2025
- Shin-Etsu Chemical Co., Ltd.
- Mitsuo Muto
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Pixel classification of film non-uniformity based on processing of...
- Patent number 12,322,659
- Issue date Jun 3, 2025
- Applied Materials, Inc.
- Dominic J. Benvegnu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Monolithic platen
- Patent number 12,311,498
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Lung Lai
- B24 - GRINDING POLISHING
Information Patent Grant
Method for chemical mechanical polishing of a SiC wafer based on a...
- Patent number 12,311,497
- Issue date May 27, 2025
- GUANGDONG UNIVERSITY OF TECHNOLOGY
- Jiabin Lu
- B24 - GRINDING POLISHING
Information Patent Grant
Structure and method for preventing silicide contamination during t...
- Patent number 12,317,488
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High throughput polishing modules and modular polishing systems
- Patent number 12,308,272
- Issue date May 20, 2025
- Applied Materials, Inc.
- Jagan Rangarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing composition
- Patent number 12,305,081
- Issue date May 20, 2025
- Japan Vam & Poval Co., Ltd.
- Takashi Murakami
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Polishing solution, polishing apparatus, and polishing method
- Patent number 12,300,499
- Issue date May 13, 2025
- Kioxia Corporation
- Mikiya Sakashita
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
System and method for removing impurities during chemical mechanica...
- Patent number 12,293,917
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Te-Chien Hou
- B24 - GRINDING POLISHING
Information Patent Grant
Methods for thinning substrates for semiconductor devices
- Patent number 12,290,900
- Issue date May 6, 2025
- Qorvo US, Inc.
- Krishna Chetry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing head, polishing apparatus, and method of manufacturing se...
- Patent number 12,285,840
- Issue date Apr 29, 2025
- Sumco Corporation
- Yuki Nakano
- B24 - GRINDING POLISHING
Information Patent Grant
Region classification of film non-uniformity based on processing of...
- Patent number 12,288,724
- Issue date Apr 29, 2025
- Applied Materials, Inc.
- Dominic J. Benvegnu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Gate-all-around integrated circuit structures having embedded GeSnB...
- Patent number 12,272,727
- Issue date Apr 8, 2025
- Intel Corporation
- Cory Bomberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing an optoelectronic device
- Patent number 12,261,249
- Issue date Mar 25, 2025
- Aledia
- Maxime Boistard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field stop IGBT with grown injection region
- Patent number 12,262,553
- Issue date Mar 25, 2025
- iPower Semiconductor
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical-mechanical polishing composition, rinse composition, chemi...
- Patent number 12,252,632
- Issue date Mar 18, 2025
- Entegris, Inc.
- Hiroshi Kitamura
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Chemical mechanical planarization equipment, wafer transfer method,...
- Patent number 12,251,785
- Issue date Mar 18, 2025
- HANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC.
- EdwardLiCang Lee
- B24 - GRINDING POLISHING
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 12,250,812
- Issue date Mar 11, 2025
- Micron Technology, Inc.
- Jordan D. Greenlee
- G11 - INFORMATION STORAGE
Information Patent Grant
Surface treatment method, method for producing semiconductor substr...
- Patent number 12,249,513
- Issue date Mar 11, 2025
- Fujimi Incorporated
- Tsutomu Yoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a grid
- Patent number 12,249,630
- Issue date Mar 11, 2025
- II-VI DELAWARE, INC.
- Adolf Schöner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Local gate height tuning by CMP and dummy gate design
- Patent number 12,243,782
- Issue date Mar 4, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING C0., LTD.
- Ming-Chang Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for stripping gallium nitride substrate
- Patent number 12,243,746
- Issue date Mar 4, 2025
- SUZHOU METABRAIN INTELLIGENT TECHNOLOGY CO., LTD.
- Fen Guo
- C30 - CRYSTAL GROWTH
Information Patent Grant
Method for wafer bonding including edge trimming
- Patent number 12,237,165
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yung-Lung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional field effect device
- Patent number 12,237,325
- Issue date Feb 25, 2025
- International Business Machines Corporation
- Huimei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing SiC substrate
- Patent number 12,237,378
- Issue date Feb 25, 2025
- Kwansei Gakuin Educational Foundation
- Masatake Nagaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate holding apparatus, substrate suction determination method...
- Patent number 12,230,529
- Issue date Feb 18, 2025
- Ebara Corporation
- Osamu Nabeya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing composition comprising polishing particles having high wa...
- Patent number 12,227,674
- Issue date Feb 18, 2025
- NISSAN CHEMICAL CORPORATION
- Shigeru Mitsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing pad and preparation thereof
- Patent number 12,220,784
- Issue date Feb 11, 2025
- Rohm and Haas Electronic Materials CMP Holdings, Inc.
- Bainian Qian
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing composition and polishing method
- Patent number 12,221,557
- Issue date Feb 11, 2025
- FUJIMI INCORPORATED
- Daiki Ito
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF OBTAINING NANOSCALE LINE BY USING LASER
- Publication number 20250157816
- Publication date May 15, 2025
- Institute of Microelectronics, Chinese Academy of Sciences
- Jinbiao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING PAD WITH IMPROVED SLURRY FLOWABILITY AND PROCESS FOR PREP...
- Publication number 20250144764
- Publication date May 8, 2025
- SK enpulse Co., Ltd.
- Yujin SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING COMPOSITION FOR A SEMICONDUCTOR PROCESS AND MANUFACTURING...
- Publication number 20250145861
- Publication date May 8, 2025
- SK enpulse Co., Ltd.
- Deok Su HAN
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
POLISHING COMPOSITION COMPRISING POLISHING PARTICLES HAVING HIGH WA...
- Publication number 20250136843
- Publication date May 1, 2025
- NISSAN CHEMICAL CORPORATION
- Shigeru MITSUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE HOLDING APPARATUS, SUBSTRATE SUCTION DETERMINATION METHOD...
- Publication number 20250140594
- Publication date May 1, 2025
- EBARA CORPORATION
- Osamu Nabeya
- B24 - GRINDING POLISHING
Information Patent Application
SLURRY COMPOSITION FOR FINAL POLISHING OF SILICON WAFER FOR REDUCIN...
- Publication number 20250129266
- Publication date Apr 24, 2025
- Jun Han KIM
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
MICROELECTRONIC ASSEMBLY FROM PROCESSED SUBSTRATE
- Publication number 20250125196
- Publication date Apr 17, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
TRENCH ISOLATION PROCESS
- Publication number 20250125186
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Lei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICA PARTICLES, PRODUCTION METHOD THEREFOR, SILICA SOL, POLISHING...
- Publication number 20250122408
- Publication date Apr 17, 2025
- MITSUBISHI CHEMICAL CORPORATION
- Yuta SHIMADA
- C01 - INORGANIC CHEMISTRY
Information Patent Application
POLISHING APPARATUS AND POLISHING METHOD USING THE SAME
- Publication number 20250108475
- Publication date Apr 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jin-Hao JHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING APPARATUS HAVING BEAM FOR SURFACE TREATMENT AND POLISHING...
- Publication number 20250112050
- Publication date Apr 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jin-Hao JHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING COMPOSITION, POLISHING METHOD, AND METHOD OF MANUFACTURIN...
- Publication number 20250109318
- Publication date Apr 3, 2025
- FUJIMI INCORPORATED
- Daiki ITO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING REMOVED SUBSTRATE
- Publication number 20250107181
- Publication date Mar 27, 2025
- Intel Corporation
- Biswajeet GUHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POST-CHEMICAL MECHANICAL POLISHING CLEANING COMPOSITION, POST-CHEMI...
- Publication number 20250101346
- Publication date Mar 27, 2025
- FUJIMI INCORPORATED
- Masafumi NISHIUMI
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
CHEMICAL MECHANICAL PLANARIZATION SLURRY PROCESSING TECHNIQUES AND...
- Publication number 20250101261
- Publication date Mar 27, 2025
- ARACA, INC.
- Jason A. KELEHER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING A SUBSTRATE
- Publication number 20250096001
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Junsang KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING COMPOSITION AND SURFACE TREATMENT METHOD
- Publication number 20250092284
- Publication date Mar 20, 2025
- FUJIMI INCORPORATED
- Toshio SHINODA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SURFACE PROCESSING METHOD
- Publication number 20250096002
- Publication date Mar 20, 2025
- DENSON CORPORATION
- Kazufumi AOKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING PROCESS USING STEAM FOR POLISHING FLU...
- Publication number 20250083282
- Publication date Mar 13, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Yohei YAMADA
- B24 - GRINDING POLISHING
Information Patent Application
METHODS FOR PROTECTING TO REUSE SILICON CARRIER WAFER BASED ON IR L...
- Publication number 20250079166
- Publication date Mar 6, 2025
- TOKYO ELECTRON LIMITED
- Panupong JAIPAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAS AMPLIFIER FOR CMP COOLING
- Publication number 20250073850
- Publication date Mar 6, 2025
- Applied Materials, Inc.
- Haosheng WU
- B24 - GRINDING POLISHING
Information Patent Application
ACOUSTIC MONITORING FOR PROCESS RELIABILITY DURING POLISHING
- Publication number 20250062163
- Publication date Feb 20, 2025
- Applied Materials, Inc.
- Nicholas A. Wiswell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN WAFER, METHOD OF MANUFACTURING THE THIN WAFER, STACK TYPE SEMI...
- Publication number 20250062284
- Publication date Feb 20, 2025
- SK HYNIX INC.
- Hee Sun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND WAFER-ATTACHED STRUCTURE
- Publication number 20250046657
- Publication date Feb 6, 2025
- ROHM CO., LTD.
- Masatoshi AKETA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250046747
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Junyun KWEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING PAD WITH REDUCED DEFECT AND METHOD OF PREPARING A SEMICON...
- Publication number 20250033160
- Publication date Jan 30, 2025
- SK enpulse Co., Ltd.
- Yujin SHIN
- B24 - GRINDING POLISHING
Information Patent Application
COMPOSITION, MANUFACTURING METHOD FOR SEMICONDUCTOR ELEMENT, AND CL...
- Publication number 20250017209
- Publication date Jan 16, 2025
- FUJIFILM CORPORATION
- Tadashi INABA
- B24 - GRINDING POLISHING
Information Patent Application
SACRIFICIAL PROTECTION LAYER FOR ENVIRONMENTALLY SENSITIVE SURFACES...
- Publication number 20240429040
- Publication date Dec 26, 2024
- LAM RESEARCH CORPORATION
- Stephen M. Sirard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING A SEMICONDUCTOR DEVICE INCLUDING ACTIVE PATTERNS...
- Publication number 20240429057
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Sungmin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RETAINING RING FOR CHEMICAL-MECHANICAL POLISHING
- Publication number 20240420978
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jeng-Chi LIN
- H01 - BASIC ELECTRIC ELEMENTS

With simultaneous mechanical treatment

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Slurry composition for chemical mechanical polishing

Wafer processing laminate, temporary adhesive material for wafer pr...

Pixel classification of film non-uniformity based on processing of...

Monolithic platen

Method for chemical mechanical polishing of a SiC wafer based on a...

Structure and method for preventing silicide contamination during t...

High throughput polishing modules and modular polishing systems

Polishing composition

Polishing solution, polishing apparatus, and polishing method

System and method for removing impurities during chemical mechanica...

Methods for thinning substrates for semiconductor devices

Polishing head, polishing apparatus, and method of manufacturing se...

Region classification of film non-uniformity based on processing of...

Gate-all-around integrated circuit structures having embedded GeSnB...

Method for producing an optoelectronic device

Field stop IGBT with grown injection region

Chemical-mechanical polishing composition, rinse composition, chemi...

Chemical mechanical planarization equipment, wafer transfer method,...

Integrated assemblies and methods of forming integrated assemblies

Surface treatment method, method for producing semiconductor substr...

Method for manufacturing a grid

Local gate height tuning by CMP and dummy gate design

Method for stripping gallium nitride substrate

Method for wafer bonding including edge trimming

Three-dimensional field effect device

Method for manufacturing SiC substrate

Substrate holding apparatus, substrate suction determination method...

Polishing composition comprising polishing particles having high wa...

Chemical mechanical polishing pad and preparation thereof

Polishing composition and polishing method

Patents Applicationslast 30 patents

METHOD OF OBTAINING NANOSCALE LINE BY USING LASER

POLISHING PAD WITH IMPROVED SLURRY FLOWABILITY AND PROCESS FOR PREP...

POLISHING COMPOSITION FOR A SEMICONDUCTOR PROCESS AND MANUFACTURING...

POLISHING COMPOSITION COMPRISING POLISHING PARTICLES HAVING HIGH WA...

SUBSTRATE HOLDING APPARATUS, SUBSTRATE SUCTION DETERMINATION METHOD...

SLURRY COMPOSITION FOR FINAL POLISHING OF SILICON WAFER FOR REDUCIN...

MICROELECTRONIC ASSEMBLY FROM PROCESSED SUBSTRATE

TRENCH ISOLATION PROCESS

SILICA PARTICLES, PRODUCTION METHOD THEREFOR, SILICA SOL, POLISHING...

POLISHING APPARATUS AND POLISHING METHOD USING THE SAME

POLISHING APPARATUS HAVING BEAM FOR SURFACE TREATMENT AND POLISHING...

POLISHING COMPOSITION, POLISHING METHOD, AND METHOD OF MANUFACTURIN...

GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING REMOVED SUBSTRATE

POST-CHEMICAL MECHANICAL POLISHING CLEANING COMPOSITION, POST-CHEMI...

CHEMICAL MECHANICAL PLANARIZATION SLURRY PROCESSING TECHNIQUES AND...

METHOD OF PROCESSING A SUBSTRATE

POLISHING COMPOSITION AND SURFACE TREATMENT METHOD

SURFACE PROCESSING METHOD

CHEMICAL MECHANICAL POLISHING PROCESS USING STEAM FOR POLISHING FLU...

METHODS FOR PROTECTING TO REUSE SILICON CARRIER WAFER BASED ON IR L...

GAS AMPLIFIER FOR CMP COOLING

ACOUSTIC MONITORING FOR PROCESS RELIABILITY DURING POLISHING

THIN WAFER, METHOD OF MANUFACTURING THE THIN WAFER, STACK TYPE SEMI...

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND WAFER-ATTACHED STRUCTURE

SEMICONDUCTOR PACKAGE

POLISHING PAD WITH REDUCED DEFECT AND METHOD OF PREPARING A SEMICON...

COMPOSITION, MANUFACTURING METHOD FOR SEMICONDUCTOR ELEMENT, AND CL...

SACRIFICIAL PROTECTION LAYER FOR ENVIRONMENTALLY SENSITIVE SURFACES...

METHODS OF FORMING A SEMICONDUCTOR DEVICE INCLUDING ACTIVE PATTERNS...

RETAINING RING FOR CHEMICAL-MECHANICAL POLISHING