With simultaneous mechanical treatment

Industry

CPC
H01L21/30625

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/30625With simultaneous mechanical treatment

Industries

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit and method for manufacturing the same
- Patent number 12,183,628
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Kuan-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of transferring semiconductor wafer to polishing apparatus a...
- Patent number 12,179,308
- Issue date Dec 31, 2024
- Sumco Corporation
- Ryoya Terakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor using slurry
- Patent number 12,176,217
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Hung Liao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Post-CMP cleaning and apparatus
- Patent number 12,170,195
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fu-Ming Huang
- B08 - CLEANING
Information Patent Grant
Polishing pad, manufacturing method thereof and preparing method of...
- Patent number 12,162,114
- Issue date Dec 10, 2024
- SK ENPULSE CO., LTD.
- Jong Wook Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition and method for polysilicon CMP
- Patent number 12,157,834
- Issue date Dec 3, 2024
- CMC MATERIALS LLC
- Sarah Brosnan
- B24 - GRINDING POLISHING
Information Patent Grant
Training a machine learning system to detect an excursion of a CMP...
- Patent number 12,148,149
- Issue date Nov 19, 2024
- Applied Materials, Inc.
- Sidney P. Huey
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device manufacturing method and wafer-attached structure
- Patent number 12,148,667
- Issue date Nov 19, 2024
- Rohm Co., Ltd.
- Masatoshi Aketa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate polishing apparatus and polishing liquid discharge method...
- Patent number 12,138,734
- Issue date Nov 12, 2024
- Ebara Corporation
- Tetsuji Togawa
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad sheet, polishing pad, and method for manufacturing se...
- Patent number 12,138,736
- Issue date Nov 12, 2024
- SK ENPULSE CO., LTD.
- Sung Hoon Yun
- B24 - GRINDING POLISHING
Information Patent Grant
CMP process and methods thereof
- Patent number 12,131,911
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Che-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing apparatus and polishing method
- Patent number 12,131,923
- Issue date Oct 29, 2024
- Ebara Corporation
- Yuta Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for chemical mechanical polishing process
- Patent number 12,131,897
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-I Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for detecting end point
- Patent number 12,131,965
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Chao Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die on die bonding structure
- Patent number 12,125,819
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate structure and method with enhanced gate contact and threshold...
- Patent number 12,119,403
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Max Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sacrificial protection layer for environmentally sensitive surfaces...
- Patent number 12,119,218
- Issue date Oct 15, 2024
- Lam Research Corporation
- Stephen M. Sirard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modification method of polyurethane, polyurethane, polishing pad, a...
- Patent number 12,109,665
- Issue date Oct 8, 2024
- Kuraray Co., Ltd.
- Azusa Oshita
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Three-dimensional memory devices
- Patent number 12,114,498
- Issue date Oct 8, 2024
- Yangtze Memory Technologies Co., Ltd.
- Linchun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming a semiconductor device including active patterns...
- Patent number 12,112,952
- Issue date Oct 8, 2024
- Samsung Electronics Co., Ltd.
- Sungmin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recessed contacts at line end and methods forming same
- Patent number 12,107,007
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate thinning for a backside power distribution network
- Patent number 12,106,969
- Issue date Oct 1, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing vertical device
- Patent number 12,107,142
- Issue date Oct 1, 2024
- ENKRIS SEMICONDUCTOR, INC.
- Kai Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Steam-assisted single substrate cleaning process and apparatus
- Patent number 12,106,976
- Issue date Oct 1, 2024
- Applied Materials, Inc.
- Jianshe Tang
- B08 - CLEANING
Information Patent Grant
Platen rotation device
- Patent number 12,090,602
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bruce Cho
- B24 - GRINDING POLISHING
Information Patent Grant
Silicon carbide substrate
- Patent number 12,091,772
- Issue date Sep 17, 2024
- Sumitomo Electric Industries, Ltd.
- Kyoko Okita
- C30 - CRYSTAL GROWTH
Information Patent Grant
Automated dry-in dry-out dual side polishing of silicon substrates...
- Patent number 12,094,740
- Issue date Sep 17, 2024
- Applied Materials, Inc.
- Manoj A. Gajendra
- B08 - CLEANING
Information Patent Grant
Protective wafer grooving structure for wafer thinning and methods...
- Patent number 12,087,756
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for suction pad assemblies
- Patent number 12,087,646
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hsiang Chao
- B24 - GRINDING POLISHING
Information Patent Grant
Self-healing polishing pad
- Patent number 12,087,590
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Hao Kung
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
SACRIFICIAL PROTECTION LAYER FOR ENVIRONMENTALLY SENSITIVE SURFACES...
- Publication number 20240429040
- Publication date Dec 26, 2024
- LAM RESEARCH CORPORATION
- Stephen M. Sirard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING A SEMICONDUCTOR DEVICE INCLUDING ACTIVE PATTERNS...
- Publication number 20240429057
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Sungmin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RETAINING RING FOR CHEMICAL-MECHANICAL POLISHING
- Publication number 20240420978
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jeng-Chi LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES
- Publication number 20240422981
- Publication date Dec 19, 2024
- Yangtze Memory Technologies Co., Ltd.
- Linchun WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR REMOVING IMPURITIES DURING CHEMICAL MECHANICA...
- Publication number 20240412977
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Te-Chien HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICA PARTICLES, PRODUCTION METHOD THEREFOR, SILICA SOL, POLISHING...
- Publication number 20240400863
- Publication date Dec 5, 2024
- MITSUBISHI CHEMICAL CORPORATION
- Tomohiro KYOTANI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SYSTEM AND METHOD FOR CONTROLLING CHEMICAL MECHANICAL PLANARIZATION
- Publication number 20240404894
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Wei HSU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COMPOSITION AND MANUFACTURING METHOD OF SEMICONDUCTOR ELEMENT
- Publication number 20240392214
- Publication date Nov 28, 2024
- FUJIFILM CORPORATION
- Naotsugu MURO
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION
- Publication number 20240391049
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Cheng LIN
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISH SLURRY AND METHOD OF MANUFACTURE
- Publication number 20240395562
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hao Kung
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
DIE ON DIE BONDING STRUCTURE
- Publication number 20240387452
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECESSED CONTACTS AT LINE END AND METHODS FORMING SAME
- Publication number 20240387266
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VACUUM ASSEMBLY FOR CHEMICAL MECHANICAL POLISHING
- Publication number 20240383100
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chen Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL-MECHANICAL COMBINED MACHINING METHOD FOR SILICON CARBIDE S...
- Publication number 20240387183
- Publication date Nov 21, 2024
- HUAQIAO UNIVERSITY
- Hui HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DETECTING AN EXCURSION OF A CMP COMPONENT USING TIME-BASED SEQUENCE...
- Publication number 20240378718
- Publication date Nov 14, 2024
- Applied Materials, Inc.
- Sidney P. Huey
- B24 - GRINDING POLISHING
Information Patent Application
METHOD AND SYSTEM FOR SLURRY QUALITY MONITORING
- Publication number 20240375238
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIH-CHIANG TSENG
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL PLANARIZATION SLURRY PROCESSING TECHNIQUES AND...
- Publication number 20240379371
- Publication date Nov 14, 2024
- Ara PHILIPOSSIAN
- B24 - GRINDING POLISHING
Information Patent Application
CMP PROCESS AND METHODS THEREOF
- Publication number 20240371649
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co, LTD.
- Che-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATEN ROTATION DEVICE
- Publication number 20240367286
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bruce CHO
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING LIQUID AND POLISHING METHOD
- Publication number 20240368428
- Publication date Nov 7, 2024
- FUJIFILM CORPORATION
- Tetsuya KAMIMURA
- B24 - GRINDING POLISHING
Information Patent Application
SYSTEMS AND METHODS FOR SUCTION PAD ASSEMBLIES
- Publication number 20240371708
- Publication date Nov 7, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Yu-Hsiang CHAO
- B24 - GRINDING POLISHING
Information Patent Application
SELF-HEALING POLISHING PAD
- Publication number 20240371648
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hao Kung
- B24 - GRINDING POLISHING
Information Patent Application
PROTECTIVE WAFER GROOVING STRUCTURE FOR WAFER THINNING AND METHODS...
- Publication number 20240363613
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuo-Ming WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20240355669
- Publication date Oct 24, 2024
- TOKYO ELECTRON LIMITED
- Yasutaka MIZOMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODIFICATION METHOD OF POLYURETHANE, POLYURETHANE, POLISHING PAD, A...
- Publication number 20240342858
- Publication date Oct 17, 2024
- Kuraray Co., Ltd
- Azusa OSHITA
- B24 - GRINDING POLISHING
Information Patent Application
METHODS AND APPARATUS TO REDUCE STRESS IN INTEGRATED CIRCUIT PACKAGES
- Publication number 20240347590
- Publication date Oct 17, 2024
- Intel Corporation
- Bhaskar Jyoti Krishnatreya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING PAD WITH ADJUSTED CONTENT OF CHLORINE AND PROCESS FOR PRE...
- Publication number 20240342857
- Publication date Oct 17, 2024
- SK enpulse Co., Ltd.
- Jong Wook YUN
- B24 - GRINDING POLISHING
Information Patent Application
COMPOSITE SUBSTRATE FOR FABRICATION OF BETA GALLIUM OXIDE DEVICES
- Publication number 20240347339
- Publication date Oct 17, 2024
- Syrnatec, Inc.
- Yash Suresh Mirchandani
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20240332059
- Publication date Oct 3, 2024
- Samsung Electronics Co., Ltd.
- Youngin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND METHOD FOR FORMING THE SAME
- Publication number 20240332187
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Liang CHEN
- H01 - BASIC ELECTRIC ELEMENTS

With simultaneous mechanical treatment

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated circuit and method for manufacturing the same

Method of transferring semiconductor wafer to polishing apparatus a...

Method for manufacturing a semiconductor using slurry

Post-CMP cleaning and apparatus

Polishing pad, manufacturing method thereof and preparing method of...

Composition and method for polysilicon CMP

Training a machine learning system to detect an excursion of a CMP...

Semiconductor device manufacturing method and wafer-attached structure

Substrate polishing apparatus and polishing liquid discharge method...

Polishing pad sheet, polishing pad, and method for manufacturing se...

CMP process and methods thereof

Polishing apparatus and polishing method

Method and system for chemical mechanical polishing process

Apparatus for detecting end point

Die on die bonding structure

Gate structure and method with enhanced gate contact and threshold...

Sacrificial protection layer for environmentally sensitive surfaces...

Modification method of polyurethane, polyurethane, polishing pad, a...

Three-dimensional memory devices

Methods of forming a semiconductor device including active patterns...

Recessed contacts at line end and methods forming same

Substrate thinning for a backside power distribution network

Method for manufacturing vertical device

Steam-assisted single substrate cleaning process and apparatus

Platen rotation device

Silicon carbide substrate

Automated dry-in dry-out dual side polishing of silicon substrates...

Protective wafer grooving structure for wafer thinning and methods...

Systems and methods for suction pad assemblies

Self-healing polishing pad

Patents Applicationslast 30 patents

SACRIFICIAL PROTECTION LAYER FOR ENVIRONMENTALLY SENSITIVE SURFACES...

METHODS OF FORMING A SEMICONDUCTOR DEVICE INCLUDING ACTIVE PATTERNS...

RETAINING RING FOR CHEMICAL-MECHANICAL POLISHING

THREE-DIMENSIONAL MEMORY DEVICES

SYSTEM AND METHOD FOR REMOVING IMPURITIES DURING CHEMICAL MECHANICA...

SILICA PARTICLES, PRODUCTION METHOD THEREFOR, SILICA SOL, POLISHING...

SYSTEM AND METHOD FOR CONTROLLING CHEMICAL MECHANICAL PLANARIZATION

COMPOSITION AND MANUFACTURING METHOD OF SEMICONDUCTOR ELEMENT

SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION

CHEMICAL MECHANICAL POLISH SLURRY AND METHOD OF MANUFACTURE

DIE ON DIE BONDING STRUCTURE

RECESSED CONTACTS AT LINE END AND METHODS FORMING SAME

VACUUM ASSEMBLY FOR CHEMICAL MECHANICAL POLISHING

CHEMICAL-MECHANICAL COMBINED MACHINING METHOD FOR SILICON CARBIDE S...

DETECTING AN EXCURSION OF A CMP COMPONENT USING TIME-BASED SEQUENCE...

METHOD AND SYSTEM FOR SLURRY QUALITY MONITORING

CHEMICAL MECHANICAL PLANARIZATION SLURRY PROCESSING TECHNIQUES AND...

CMP PROCESS AND METHODS THEREOF

PLATEN ROTATION DEVICE

POLISHING LIQUID AND POLISHING METHOD

SYSTEMS AND METHODS FOR SUCTION PAD ASSEMBLIES

SELF-HEALING POLISHING PAD

PROTECTIVE WAFER GROOVING STRUCTURE FOR WAFER THINNING AND METHODS...

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

MODIFICATION METHOD OF POLYURETHANE, POLYURETHANE, POLISHING PAD, A...

METHODS AND APPARATUS TO REDUCE STRESS IN INTEGRATED CIRCUIT PACKAGES

POLISHING PAD WITH ADJUSTED CONTENT OF CHLORINE AND PROCESS FOR PRE...

COMPOSITE SUBSTRATE FOR FABRICATION OF BETA GALLIUM OXIDE DEVICES

METHOD OF FABRICATING SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT AND METHOD FOR FORMING THE SAME