with special adaptation of the surface of the body to be connected

Industry

CPC
H01L2224/83888

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83888with special adaptation of the surface of the body to be connected

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device package having an underfill barrier
- Patent number 10,217,649
- Issue date Feb 26, 2019
- Advanced Semiconductor Engineering, Inc.
- Jin-Yuan Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 8,673,688
- Issue date Mar 18, 2014
- Samsung Electronics Co., Ltd.
- Wonkeun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 8,587,134
- Issue date Nov 19, 2013
- Samsung Electronics Co., Ltd.
- Yun-hyeok Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip mounting body, flip chip mounting method and flip chip mo...
- Patent number 8,071,425
- Issue date Dec 6, 2011
- Panasonic Corporation
- Seiichi Nakatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip mounting body, flip chip mounting method and flip chip mo...
- Patent number 7,732,920
- Issue date Jun 8, 2010
- Panasonic Corporation
- Seiichi Nakatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package equipped with semiconductor chip and method for producing same
- Patent number 7,649,267
- Issue date Jan 19, 2010
- Panasonic Corporation
- Tsukasa Shiraishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
FEATURES FOR IMPROVING DIE SIZE AND ORIENTATION DIFFERENTIATION IN...
- Publication number 20220415847
- Publication date Dec 29, 2022
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE USING MICRO-LEDS AND METHOD FOR MANUFACTURING SAME
- Publication number 20220320371
- Publication date Oct 6, 2022
- LG ELECTRONICS INC.
- Chilkeun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING AN UNDERFILL BARRIER
- Publication number 20180358238
- Publication date Dec 13, 2018
- Advanced Semiconductor Engineering, Inc.
- Jin-Yuan LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PROCESS USING TEMPERATURE CONTROLLED CURVATURE CHANGE
- Publication number 20160204078
- Publication date Jul 14, 2016
- International Business Machines Corporation
- Stephen W. Bedell
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20130134606
- Publication date May 30, 2013
- Samsung Electronics Co., Ltd.
- Yun-hyeok IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package And Method Of Manufacturing The Same
- Publication number 20120100671
- Publication date Apr 26, 2012
- Samsung Electronics Co., Ltd.
- Wonkeun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP MOUNTING BODY, FLIP CHIP MOUNTING METHOD AND FLIP CHIP MO...
- Publication number 20100203675
- Publication date Aug 12, 2010
- PANASONIC CORPORATION
- Seiichi NAKATANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT ASSEMBLY, ELECTRIC COMPONENT WITH SOLDER BUMP...
- Publication number 20100011572
- Publication date Jan 21, 2010
- Takashi Kitae
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
FLIP-CHIP MOUNTING BODY AND FLIP-CHIP MOUNTING METHOD
- Publication number 20090085227
- Publication date Apr 2, 2009
- Matsushita Electric Industrial Co., Ltd.
- Tsukasa Shiraishi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
FLIP CHIP MOUNTING BODY, FLIP CHIP MOUNTING METHOD AND FLIP CHIP MO...
- Publication number 20090008800
- Publication date Jan 8, 2009
- Matsushita Electric Industrial Co., Ltd.
- Seiichi Nakatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Equipped with Semiconductor Chip and Method for Producing Same
- Publication number 20080265437
- Publication date Oct 30, 2008
- Tsukasa Shiraishi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

with special adaptation of the surface of the body to be connected

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device package having an underfill barrier

Semiconductor package and method of manufacturing the same

Semiconductor packages

Flip chip mounting body, flip chip mounting method and flip chip mo...

Flip chip mounting body, flip chip mounting method and flip chip mo...

Package equipped with semiconductor chip and method for producing same

Patents Applicationslast 30 patents

FEATURES FOR IMPROVING DIE SIZE AND ORIENTATION DIFFERENTIATION IN...

DISPLAY DEVICE USING MICRO-LEDS AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR DEVICE PACKAGE HAVING AN UNDERFILL BARRIER

BONDING PROCESS USING TEMPERATURE CONTROLLED CURVATURE CHANGE

SEMICONDUCTOR PACKAGES

Semiconductor Package And Method Of Manufacturing The Same

FLIP CHIP MOUNTING BODY, FLIP CHIP MOUNTING METHOD AND FLIP CHIP MO...

ELECTRONIC COMPONENT ASSEMBLY, ELECTRIC COMPONENT WITH SOLDER BUMP...

FLIP-CHIP MOUNTING BODY AND FLIP-CHIP MOUNTING METHOD

FLIP CHIP MOUNTING BODY, FLIP CHIP MOUNTING METHOD AND FLIP CHIP MO...

Package Equipped with Semiconductor Chip and Method for Producing Same