with special adaptation of the surface or of an auxiliary substrate

Industry

CPC
H01L2224/11524

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/11524with special adaptation of the surface or of an auxiliary substrate

Industries

Patents Grantslast 30 patents

Information Patent Grant
Metal particles-dispersed composition and flip chip mounting proces...
- Patent number 7,910,403
- Issue date Mar 22, 2011
- Panasonic Corporation
- Koichi Hirano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip mounting process and bump-forming process using electrica...
- Patent number 7,726,545
- Issue date Jun 1, 2010
- Panasonic Corporation
- Takashi Ichiryu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BRIDGING ARRANGEMENT, MICROELECTRONIC COMPONENT AND METHOD FOR MANU...
- Publication number 20160126202
- Publication date May 5, 2016
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20150200173
- Publication date Jul 16, 2015
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIA-CHUN MIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL PARTICLES-DISPERSED COMPOSITION AND FLIP CHIP MOUNTING PROCES...
- Publication number 20110133137
- Publication date Jun 9, 2011
- Koichi Hirano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT ASSEMBLY, ELECTRIC COMPONENT WITH SOLDER BUMP...
- Publication number 20100011572
- Publication date Jan 21, 2010
- Takashi Kitae
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Flip Clip Mounting Process And Bump-Forming Process Using Electrica...
- Publication number 20080165518
- Publication date Jul 10, 2008
- Takashi Ichiryu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Metal Particles-Dispersed Composition and Flip Chip Mounting Proces...
- Publication number 20080142966
- Publication date Jun 19, 2008
- Koichi Hirano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

with special adaptation of the surface or of an auxiliary substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Metal particles-dispersed composition and flip chip mounting proces...

Flip chip mounting process and bump-forming process using electrica...

Patents Applicationslast 30 patents

BRIDGING ARRANGEMENT, MICROELECTRONIC COMPONENT AND METHOD FOR MANU...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

METAL PARTICLES-DISPERSED COMPOSITION AND FLIP CHIP MOUNTING PROCES...

ELECTRONIC COMPONENT ASSEMBLY, ELECTRIC COMPONENT WITH SOLDER BUMP...

Flip Clip Mounting Process And Bump-Forming Process Using Electrica...

Metal Particles-Dispersed Composition and Flip Chip Mounting Proces...