with specially adapted redistribution layers [RDL]

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H01L2224/06157

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/06157with specially adapted redistribution layers [RDL]

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,094,562
- Issue date Aug 17, 2021
- Nexperia B.V.
- Leung Chi Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip device having simplified routing
- Patent number 8,362,613
- Issue date Jan 29, 2013
- STMicroelectronics Pvt. Ltd.
- Anil Yadav
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FLIP CHIP DEVICE HAVING SIMPLIFIED ROUTING
- Publication number 20120168934
- Publication date Jul 5, 2012
- STMICROELECTRONICS PVT. LTD.
- Anil Yadav
- H01 - BASIC ELECTRIC ELEMENTS