with specially adapted redistribution layers [RDL]

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CPC
H01L2224/06187

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/06187with specially adapted redistribution layers [RDL]

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,094,562
- Issue date Aug 17, 2021
- Nexperia B.V.
- Leung Chi Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic system having increased coupling by using horizontal and...
- Patent number 10,861,842
- Issue date Dec 8, 2020
- STMicroelectronics S.r.l.
- Alberto Pagani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic system having increased coupling by using horizontal and...
- Patent number 10,453,833
- Issue date Oct 22, 2019
- STMicroelectonics S.R.L.
- Alberto Pagani
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Electronic system having increased coupling by using horizontal and...
- Patent number 10,319,708
- Issue date Jun 11, 2019
- STMicroelectronics S.r.l.
- Alberto Pagani
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Semiconductor chip with electrically conducting layer
- Patent number 10,109,592
- Issue date Oct 23, 2018
- Infineon Technologies AG
- Chee Yang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic system having increased coupling by using horizontal and...
- Patent number 9,881,911
- Issue date Jan 30, 2018
- STMicroelectronics S.r.l.
- Alberto Pagani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for producing component mounting board
- Patent number 9,237,686
- Issue date Jan 12, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Koji Motomura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method comprising thickened redistribution...
- Patent number 9,177,926
- Issue date Nov 3, 2015
- Deca Technologies Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 7,649,250
- Issue date Jan 19, 2010
- Samsung Electronics Co., Ltd.
- Tae-Sung Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...
- Publication number 20190244948
- Publication date Aug 8, 2019
- STMicroelectronics S.r.l
- Alberto Pagani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...
- Publication number 20180130784
- Publication date May 10, 2018
- STMicroelectronics S.r.l.
- Alberto Pagani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...
- Publication number 20180102353
- Publication date Apr 12, 2018
- STMicroelectronics S.r.l.
- Alberto Pagani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD COMPRISING THICKENED REDISTRIBUTION...
- Publication number 20150187710
- Publication date Jul 2, 2015
- DECA TECHNOLOGIES INC
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR PRODUCING COMPONENT MOUNTING BOARD
- Publication number 20140158751
- Publication date Jun 12, 2014
- PANASONIC CORPORATION
- Koji Motomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...
- Publication number 20130241025
- Publication date Sep 19, 2013
- STMicroelectronics S.r. I.
- Alberto PAGANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20100136747
- Publication date Jun 3, 2010
- SAMSUNG ELECTRONICS CO., LTD.
- Tae-Sung PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20080111229
- Publication date May 15, 2008
- Samsung Electronics Co., Ltd.
- Tae-Sung PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

with specially adapted redistribution layers [RDL]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method of manufacture

Electronic system having increased coupling by using horizontal and...

Electronic system having increased coupling by using horizontal and...

Electronic system having increased coupling by using horizontal and...

Semiconductor chip with electrically conducting layer

Electronic system having increased coupling by using horizontal and...

Method and system for producing component mounting board

Semiconductor device and method comprising thickened redistribution...

Semiconductor package

Patents Applicationslast 30 patents

ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...

ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...

ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...

SEMICONDUCTOR DEVICE AND METHOD COMPRISING THICKENED REDISTRIBUTION...

METHOD AND SYSTEM FOR PRODUCING COMPONENT MOUNTING BOARD

ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME