with specially adapted redistribution layers [RDL]

Industry

CPC
H01L2224/06167

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/06167with specially adapted redistribution layers [RDL]

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Fan-out semiconductor package
- Patent number 10,770,418
- Issue date Sep 8, 2020
- Samsung Electronics Co., Ltd.
- Da Hee Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 10,573,613
- Issue date Feb 25, 2020
- Samsung Electronics Co., Ltd.
- Da Hee Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 10,515,916
- Issue date Dec 24, 2019
- Samsung Electronics Co., Ltd.
- Dae Jung Byun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit die having a split solder pad
- Patent number 10,192,798
- Issue date Jan 29, 2019
- EM Microelectronic-Marin SA
- Christoph Kuratli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package
- Patent number 9,209,124
- Issue date Dec 8, 2015
- Xintec Inc.
- Yu-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for forming the same
- Patent number 9,196,594
- Issue date Nov 24, 2015
- Xintec Inc.
- Chao-Yen Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip package and method for forming the same
- Patent number 9,030,011
- Issue date May 12, 2015
- Xintec Inc.
- Chao-Yen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for forming the same
- Patent number 8,507,321
- Issue date Aug 13, 2013
- Chao-Yen Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip with chip selection structure and stacked semico...
- Patent number 7,898,834
- Issue date Mar 1, 2011
- Hynix Semiconductor Inc.
- Sung Min Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20140328523
- Publication date Nov 6, 2014
- Chao-Yen LIN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20140054786
- Publication date Feb 27, 2014
- Xintec Inc.
- Yu-Lung HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20130320532
- Publication date Dec 5, 2013
- Xintec Inc.
- Chao-Yen LIN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20110278724
- Publication date Nov 17, 2011
- Chao-Yen LIN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR CHIP WITH CHIP SELECTION STRUCTURE AND STACKED SEMICO...
- Publication number 20090189267
- Publication date Jul 30, 2009
- Sung Min Kim
- H01 - BASIC ELECTRIC ELEMENTS

with specially adapted redistribution layers [RDL]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Fan-out semiconductor package

Fan-out semiconductor package

Fan-out semiconductor package

Integrated circuit die having a split solder pad

Chip package

Chip package and method for forming the same

Chip package and method for forming the same

Chip package and method for forming the same

Semiconductor chip with chip selection structure and stacked semico...

Patents Applicationslast 30 patents

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR CHIP WITH CHIP SELECTION STRUCTURE AND STACKED SEMICO...