with specially adapted redistribution layers [RDL]

Industry

CPC
H01L2224/06182

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/06182with specially adapted redistribution layers [RDL]

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,199,016
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Shaofeng Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with non-uniformly distributed vias
- Patent number 12,159,829
- Issue date Dec 3, 2024
- Infineon Technologies Austria AG
- Sergey Yuferev
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Packaged multi-chip semiconductor devices and methods of fabricatin...
- Patent number 12,132,019
- Issue date Oct 29, 2024
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and methods of manufacturing a semiconductor...
- Patent number 12,087,717
- Issue date Sep 10, 2024
- Infineon Technologies Austria AG
- Thomas Feil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device including semiconductor chips and method for producing such...
- Patent number 12,027,481
- Issue date Jul 2, 2024
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer, method for fabricating the same, and semiconductor pack...
- Patent number 11,984,415
- Issue date May 14, 2024
- Samsung Electronics Co., Ltd.
- Yukyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,973,016
- Issue date Apr 30, 2024
- Infineon Technologies Austria AG
- Elvir Kahrimanovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,948,903
- Issue date Apr 2, 2024
- Samsung Electronics Co., Ltd.
- Sang-Sick Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LTHC as charging barrier in info package formation
- Patent number 11,923,353
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,876,038
- Issue date Jan 16, 2024
- Samsung Electronics Co., Ltd.
- Shaofeng Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a metallization structure
- Patent number 11,876,041
- Issue date Jan 16, 2024
- Infineon Technologies Austria AG
- Oliver Blank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System, device and methods of manufacture
- Patent number 11,848,235
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,616,039
- Issue date Mar 28, 2023
- Samsung Electronics Co., Ltd.
- Sang-Sick Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication and use of through silicon vias on double sided interco...
- Patent number 11,594,524
- Issue date Feb 28, 2023
- Intel Corporation
- Brennen K. Mueller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,581,279
- Issue date Feb 14, 2023
- Samsung Electronics Co., Ltd.
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device including semiconductor chips and method for producing such...
- Patent number 11,569,186
- Issue date Jan 31, 2023
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged multi-chip semiconductor devices and methods of fabricatin...
- Patent number 11,552,033
- Issue date Jan 10, 2023
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer, microelectronic device assembly including same and meth...
- Patent number 11,476,241
- Issue date Oct 18, 2022
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing a semiconductor p...
- Patent number 11,444,017
- Issue date Sep 13, 2022
- Infineon Technologies Austria AG
- Sergey Yuferev
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
LTHC as charging barrier in InFO package formation
- Patent number 11,437,361
- Issue date Sep 6, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting package structure and manufacturing method thereof
- Patent number 11,437,355
- Issue date Sep 6, 2022
- Lite-On Opto Technology (Changzhou) Co., Ltd.
- Chien-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System, device and methods of manufacture
- Patent number 11,404,316
- Issue date Aug 2, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication and use of through silicon vias on double sided interco...
- Patent number 11,251,156
- Issue date Feb 15, 2022
- Intel Corporation
- Brennen K. Mueller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,189,583
- Issue date Nov 30, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Sheng-Chau Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with embedded stacked through-silicon via die
- Patent number 11,107,766
- Issue date Aug 31, 2021
- Intel Corporation
- Javier Soto Gonzalez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and methods of manufacturing a semiconductor...
- Patent number 11,081,457
- Issue date Aug 3, 2021
- Infineon Technologies Austria AG
- Thomas Feil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module, electronic component and method of manufactur...
- Patent number 11,069,639
- Issue date Jul 20, 2021
- Infineon Technologies Austria AG
- Thomas Feil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,004,814
- Issue date May 11, 2021
- Samsung Electronics Co., Ltd.
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device including semiconductor chips and method for producing such...
- Patent number 10,903,180
- Issue date Jan 26, 2021
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with heat-dissipating structure and method of...
- Patent number 10,679,955
- Issue date Jun 9, 2020
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Tae Hyun Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGED MULTI-CHIP SEMICONDUCTOR DEVICES AND METHODS OF FABRICATIN...
- Publication number 20250015026
- Publication date Jan 9, 2025
- Samsung Electronics Co., LTD
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250014968
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Shaofeng DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250006594
- Publication date Jan 2, 2025
- Samsung Electronics Co., Ltd.
- Shaofeng DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package with Organic Integrated Circuit Substrate Embedded in Inorg...
- Publication number 20240387456
- Publication date Nov 21, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Minwoo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE INCLUDING SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING SUCH...
- Publication number 20240355767
- Publication date Oct 24, 2024
- INFINEON TECHNOLOGIES AG
- Petteri PALM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE DIES INCLUDING VERTICAL INTERCONNECTS FOR SIGNAL AND POWER...
- Publication number 20240282729
- Publication date Aug 22, 2024
- QUALCOMM Incorporated
- Mustafa Badaroglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER, METHOD FOR FABRICATING THE SAME, AND SEMICONDUCTOR PACK...
- Publication number 20240274553
- Publication date Aug 15, 2024
- Samsung Electronics Co., Ltd.
- Yukyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LTHC AS CHARGING BARRIER IN INFO PACKAGE FORMATION
- Publication number 20240222352
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Col., Ltd.
- Yi-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20240194638
- Publication date Jun 13, 2024
- Powerchip Semiconductor Manufacturing Corporation
- Yasuhiro Konishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ADVANCED PAD STRUCTURE AND METHOD FOR FOR...
- Publication number 20240153897
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fu-Chiang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, ELECTRONIC STRUCTURE AND METHOD OF MANUFACTURING...
- Publication number 20240105527
- Publication date Mar 28, 2024
- NANYA TECHNOLOGY CORPORATION
- Yi-Jen LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE UNIT, METHOD OF MANUFACTURING THE SAME, AND PACKAGE ST...
- Publication number 20240021552
- Publication date Jan 18, 2024
- Walton Advanced Engineering, Inc
- HONG-CHI YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230223373
- Publication date Jul 13, 2023
- Samsung Electronics Co., Ltd.
- Sang-Sick PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230187393
- Publication date Jun 15, 2023
- Samsung Electronics Co., Ltd.
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE INCLUDING SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING SUCH...
- Publication number 20230170319
- Publication date Jun 1, 2023
- INFINEON TECHNOLOGIES AG
- Petteri PALM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MULTI-CHIP SEMICONDUCTOR DEVICES AND METHODS OF FABRICATIN...
- Publication number 20230163088
- Publication date May 25, 2023
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY BACKPLANE AND MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE
- Publication number 20230043192
- Publication date Feb 9, 2023
- BOE TECHNOLOGY GROUP CO., LTD.
- Liang CHEN
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230016380
- Publication date Jan 19, 2023
- Jerry Lutiva TAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220384373
- Publication date Dec 1, 2022
- XINTEC INC.
- Chieh CHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH NON-UNIFORMLY DISTRIBUTED VIAS
- Publication number 20220367350
- Publication date Nov 17, 2022
- Sergey Yuferev
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220278024
- Publication date Sep 1, 2022
- Samsung Electronics Co., Ltd.
- Shaofeng DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20220254703
- Publication date Aug 11, 2022
- Elvir Kahrimanovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION AND USE OF THROUGH SILICON VIAS ON DOUBLE SIDED INTERCO...
- Publication number 20220130803
- Publication date Apr 28, 2022
- Intel Corporation
- Brennen K. MUELLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND IMPLANTABLE MEDICAL DEVICE INCLUDING SAME
- Publication number 20220077085
- Publication date Mar 10, 2022
- Medtronic, Inc.
- Mark E. Henschel
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210407949
- Publication date Dec 30, 2021
- Samsung Electronics Co., Ltd.
- Sang-Sick PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MULTI-CHIP SEMICONDUCTOR DEVICES AND METHODS OF FABRICATIN...
- Publication number 20210358875
- Publication date Nov 18, 2021
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING A SEMICONDUCTOR...
- Publication number 20210335739
- Publication date Oct 28, 2021
- Thomas Feil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210233879
- Publication date Jul 29, 2021
- Samsung Electronics Co., Ltd.
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM, DEVICE AND METHODS OF MANUFACTURE
- Publication number 20210202312
- Publication date Jul 1, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE INCLUDING SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING SUCH...
- Publication number 20210151401
- Publication date May 20, 2021
- INFINEON TECHNOLOGIES AG
- Petteri PALM
- H01 - BASIC ELECTRIC ELEMENTS

with specially adapted redistribution layers [RDL]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Semiconductor package with non-uniformly distributed vias

Packaged multi-chip semiconductor devices and methods of fabricatin...

Semiconductor package and methods of manufacturing a semiconductor...

Device including semiconductor chips and method for producing such...

Interposer, method for fabricating the same, and semiconductor pack...

Semiconductor device

Semiconductor package

LTHC as charging barrier in info package formation

Semiconductor device

Semiconductor device having a metallization structure

System, device and methods of manufacture

Semiconductor package

Fabrication and use of through silicon vias on double sided interco...

Semiconductor device

Device including semiconductor chips and method for producing such...

Packaged multi-chip semiconductor devices and methods of fabricatin...

Interposer, microelectronic device assembly including same and meth...

Semiconductor package and method of manufacturing a semiconductor p...

LTHC as charging barrier in InFO package formation

Light-emitting package structure and manufacturing method thereof

System, device and methods of manufacture

Fabrication and use of through silicon vias on double sided interco...

Semiconductor structure and manufacturing method thereof

Substrate with embedded stacked through-silicon via die

Semiconductor package and methods of manufacturing a semiconductor...

Semiconductor module, electronic component and method of manufactur...

Semiconductor device

Device including semiconductor chips and method for producing such...

Semiconductor package with heat-dissipating structure and method of...

Patents Applicationslast 30 patents

PACKAGED MULTI-CHIP SEMICONDUCTOR DEVICES AND METHODS OF FABRICATIN...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

Package with Organic Integrated Circuit Substrate Embedded in Inorg...

DEVICE INCLUDING SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING SUCH...

PACKAGE DIES INCLUDING VERTICAL INTERCONNECTS FOR SIGNAL AND POWER...

INTERPOSER, METHOD FOR FABRICATING THE SAME, AND SEMICONDUCTOR PACK...

LTHC AS CHARGING BARRIER IN INFO PACKAGE FORMATION

STACKED SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE WITH ADVANCED PAD STRUCTURE AND METHOD FOR FOR...

ELECTRONIC DEVICE, ELECTRONIC STRUCTURE AND METHOD OF MANUFACTURING...

CHIP PACKAGE UNIT, METHOD OF MANUFACTURING THE SAME, AND PACKAGE ST...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

DEVICE INCLUDING SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING SUCH...

PACKAGED MULTI-CHIP SEMICONDUCTOR DEVICES AND METHODS OF FABRICATIN...

DISPLAY BACKPLANE AND MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE

SEMICONDUCTOR PACKAGE

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE WITH NON-UNIFORMLY DISTRIBUTED VIAS

SEMICONDUCTOR DEVICE

Semiconductor Device

FABRICATION AND USE OF THROUGH SILICON VIAS ON DOUBLE SIDED INTERCO...

ELECTRONIC PACKAGE AND IMPLANTABLE MEDICAL DEVICE INCLUDING SAME

SEMICONDUCTOR PACKAGE

PACKAGED MULTI-CHIP SEMICONDUCTOR DEVICES AND METHODS OF FABRICATIN...

SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING A SEMICONDUCTOR...

SEMICONDUCTOR DEVICE

SYSTEM, DEVICE AND METHODS OF MANUFACTURE

DEVICE INCLUDING SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING SUCH...