with subsequent division of the substrate into plural individual devices

Industry

CPC
H01L21/78

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/78with subsequent division of the substrate into plural individual devices

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor chip and method for manufacturing the same
- Patent number 12,293,945
- Issue date May 6, 2025
- Denso Corporation
- Shinichi Hoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Side-solderable leadless package
- Patent number 12,293,960
- Issue date May 6, 2025
- Semtech Corporation
- Henry Descalzo Bathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with partial EMI shielding and method of makin...
- Patent number 12,288,753
- Issue date Apr 29, 2025
- STATS ChipPAC Pte. Ltd.
- Changoh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PSPI-based patterning method for RDL
- Patent number 12,288,781
- Issue date Apr 29, 2025
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Separating device and method of separation
- Patent number 12,288,718
- Issue date Apr 29, 2025
- Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Kaijun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing process including forming a bond...
- Patent number 12,288,719
- Issue date Apr 29, 2025
- SanDisk Technologies, Inc.
- Takuya Maehara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip, processed wafer, and method for manufacturing s...
- Patent number 12,288,720
- Issue date Apr 29, 2025
- Denso Corporation
- Masatake Nagaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor package, and methods of manufac...
- Patent number 12,288,730
- Issue date Apr 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chang-Jung Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor package
- Patent number 12,283,541
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Ming Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing singulated encapsulated components
- Patent number 12,283,491
- Issue date Apr 22, 2025
- EV Group E. Thallner GmbH
- Gerald Mittendorfer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,283,614
- Issue date Apr 22, 2025
- Kabushiki Kaisha Toshiba
- Shinji Onduka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extended seal ring structure on wafer-stacking
- Patent number 12,283,552
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Hsorng Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical solid-state transducers and high voltage solid-state trans...
- Patent number 12,279,468
- Issue date Apr 15, 2025
- Micron Technology, Inc.
- Vladimir Odnoblyudov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated voltage regulator and passive components
- Patent number 12,278,215
- Issue date Apr 15, 2025
- Adeia Semiconductor Inc.
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor package including sub-interpose...
- Patent number 12,278,222
- Issue date Apr 15, 2025
- Samsung Electronics Co., Ltd.
- Yanggyoo Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing nitride mesas each intended to form an electro...
- Patent number 12,278,224
- Issue date Apr 15, 2025
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Guy Feuillet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, and method for manufacturing semiconductor de...
- Patent number 12,278,262
- Issue date Apr 15, 2025
- Rohm Co., Ltd.
- Katsuhisa Nagao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacking structure, package structure and method of fabricating the...
- Patent number 12,272,674
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epitaxial high-K etch stop layer for backside reveal integration
- Patent number 12,272,601
- Issue date Apr 8, 2025
- Tokyo Electron Limited
- Robert D. Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a cleaved semiconductor wafer
- Patent number 12,270,768
- Issue date Apr 8, 2025
- GlobalWafers Co., Ltd.
- Benjamin Michael Meyer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Metal-bump sidewall protection
- Patent number 12,272,663
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor devices in a layer of epitaxial si...
- Patent number 12,272,738
- Issue date Apr 8, 2025
- Infineon Technologies AG
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 12,272,655
- Issue date Apr 8, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Ji Hoon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated devices in semiconductor packages and methods of forming...
- Patent number 12,266,619
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package structure
- Patent number 12,266,616
- Issue date Apr 1, 2025
- Unimicron Technology Corp.
- Kai-Ming Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack structure and manufacturing method thereof
- Patent number 12,266,637
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Info structure with copper pillar having reversed profile
- Patent number 12,261,074
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mold shelf package design and process flow for advanced package arc...
- Patent number 12,261,150
- Issue date Mar 25, 2025
- Intel Corporation
- Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out wafer level packaging of semiconductor devices
- Patent number 12,261,084
- Issue date Mar 25, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- George Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 12,261,131
- Issue date Mar 25, 2025
- Fuji Electric Co., Ltd.
- Tsuneyuki Matsushima
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED DEVICE PACKAGES WITH INTEGRATED DEVICE DIE AND DUMMY ELE...
- Publication number 20250149483
- Publication date May 8, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DICING A SEMICONDUCTOR WAFER STRUCTURE
- Publication number 20250149384
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Hui Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20250149424
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250149385
- Publication date May 8, 2025
- DENSO CORPORATION
- Hiroki MIYAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE CLEANING SYSTEMS AND RELATED METHODS
- Publication number 20250149386
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGING SUBSTRATE AND MANUFACTURING METHOD OF PACKAGING SUBSTRATE
- Publication number 20250149400
- Publication date May 8, 2025
- ABSOLICS INC.
- Bongyeol LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making a Semiconductor Package w...
- Publication number 20250151421
- Publication date May 8, 2025
- UTAC Headquarters Pte. Ltd.
- Jeffrey Punzalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20250149425
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SCHEME FOR SEMICONDUCTOR PACKAGING
- Publication number 20250149488
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Co, LTD.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING WAFER
- Publication number 20250140613
- Publication date May 1, 2025
- Disco Corporation
- Tsubasa HIROSE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR WAFER DICING
- Publication number 20250140612
- Publication date May 1, 2025
- Siliconware Precision Industries Co., Ltd.
- Ming-Hui CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGES WITH ISOLATED DIES
- Publication number 20250140624
- Publication date May 1, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Hau NGUYEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING METHOD OF WAFER
- Publication number 20250140561
- Publication date May 1, 2025
- Disco Corporation
- Tsubasa HIROSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250132269
- Publication date Apr 24, 2025
- Murata Manufacturing Co., Ltd.
- Shinya MASUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20250132216
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER THINNED BY CRACK PROPAGATION
- Publication number 20250132205
- Publication date Apr 24, 2025
- Western Digital Technologies, Inc.
- Fan Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING METHOD
- Publication number 20250125198
- Publication date Apr 17, 2025
- Disco Corporation
- Masayuki KAWASE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE-STACKING STRUCTURE AND SUBSTRATE-CUTTING METHOD
- Publication number 20250121460
- Publication date Apr 17, 2025
- SAMSUNG DISPLAY CO., LTD.
- GEUNWOO YUG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIE AND MANUFACTURING METHOD THEREOF AS WELL AS SEMICONDUCTOR PACKA...
- Publication number 20250125216
- Publication date Apr 17, 2025
- ORIENT SEMICONDUCTOR ELECTRONICS, LIMITED
- YUEH-MING TUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP
- Publication number 20250125197
- Publication date Apr 17, 2025
- Samsung Electronics Co., Ltd.
- Junyun Kweon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250118718
- Publication date Apr 10, 2025
- SK HYNIX INC.
- Heon Yong CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING THEREOF
- Publication number 20250118575
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250118685
- Publication date Apr 10, 2025
- RENESAS ELECTRONICS CORPORATION
- Takashi MORIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH WETTABLE FLANK
- Publication number 20250118635
- Publication date Apr 10, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Hui Min LER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR DIVIDING WAFER
- Publication number 20250118601
- Publication date Apr 10, 2025
- Disco Corporation
- Shinya ARUGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE TRANSFER METHOD AND APPARATUS FOR MULTI-CHIP MODULE
- Publication number 20250118589
- Publication date Apr 10, 2025
- Silicon Box, Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SiC SEMICONDUCTOR DEVICE
- Publication number 20250120148
- Publication date Apr 10, 2025
- ROHM CO., LTD.
- Yuki NAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR CHIP
- Publication number 20250118565
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Hyunho Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGES
- Publication number 20250118574
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Jeonggi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250118682
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jhih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS

with subsequent division of the substrate into plural individual devices

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor chip and method for manufacturing the same

Side-solderable leadless package

Semiconductor device with partial EMI shielding and method of makin...

PSPI-based patterning method for RDL

Separating device and method of separation

Semiconductor device manufacturing process including forming a bond...

Semiconductor chip, processed wafer, and method for manufacturing s...

Semiconductor device, semiconductor package, and methods of manufac...

Manufacturing method of semiconductor package

Method for producing singulated encapsulated components

Semiconductor device

Extended seal ring structure on wafer-stacking

Vertical solid-state transducers and high voltage solid-state trans...

Integrated voltage regulator and passive components

Method of fabricating semiconductor package including sub-interpose...

Method for producing nitride mesas each intended to form an electro...

Semiconductor device, and method for manufacturing semiconductor de...

Stacking structure, package structure and method of fabricating the...

Epitaxial high-K etch stop layer for backside reveal integration

Method of processing a cleaved semiconductor wafer

Metal-bump sidewall protection

Methods of forming semiconductor devices in a layer of epitaxial si...

Semiconductor devices and methods of manufacturing semiconductor de...

Integrated devices in semiconductor packages and methods of forming...

Integrated circuit package structure

Die stack structure and manufacturing method thereof

Info structure with copper pillar having reversed profile

Mold shelf package design and process flow for advanced package arc...

Fan-out wafer level packaging of semiconductor devices

Semiconductor device and method of manufacturing semiconductor device

Patents Applicationslast 30 patents

INTEGRATED DEVICE PACKAGES WITH INTEGRATED DEVICE DIE AND DUMMY ELE...

METHOD FOR DICING A SEMICONDUCTOR WAFER STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

DIE CLEANING SYSTEMS AND RELATED METHODS

PACKAGING SUBSTRATE AND MANUFACTURING METHOD OF PACKAGING SUBSTRATE

Semiconductor Device and Method of Making a Semiconductor Package w...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

BONDING SCHEME FOR SEMICONDUCTOR PACKAGING

METHOD OF PROCESSING WAFER

METHOD FOR WAFER DICING

PACKAGES WITH ISOLATED DIES

PROCESSING METHOD OF WAFER

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR WAFER THINNED BY CRACK PROPAGATION

PROCESSING METHOD

SUBSTRATE-STACKING STRUCTURE AND SUBSTRATE-CUTTING METHOD

DIE AND MANUFACTURING METHOD THEREOF AS WELL AS SEMICONDUCTOR PACKA...

SEMICONDUCTOR CHIP

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE WITH WETTABLE FLANK

METHOD AND APPARATUS FOR DIVIDING WAFER

DIE TRANSFER METHOD AND APPARATUS FOR MULTI-CHIP MODULE

SiC SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR CHIP

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGES

PACKAGE STRUCTURE