with subsequent division of the substrate into plural individual devices

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/78with subsequent division of the substrate into plural individual devices

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices and methods of manufacture
- Patent number 12,243,830
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with electromagnetic interference film and met...
- Patent number 12,243,833
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Hsi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming testing module and method for using the same
- Patent number 12,243,787
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D AND flash memory device and method of fabricating the same
- Patent number 12,245,428
- Issue date Mar 4, 2025
- Macronix International Co., Ltd.
- Hang-Ting Lue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with wettable flank and related methods
- Patent number 12,243,810
- Issue date Mar 4, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Hui Min Ler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer and method of manufacturing semiconductor chip
- Patent number 12,243,831
- Issue date Mar 4, 2025
- JVCKENWOOD CORPORATION
- Takayuki Iwasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser processing device, and method for manufacturing chip
- Patent number 12,233,481
- Issue date Feb 25, 2025
- Nichia Corporation
- Hiroaki Tamemoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Waferscale physiological characteristic sensor package with integra...
- Patent number 12,232,842
- Issue date Feb 25, 2025
- Medtronic MiniMed, Inc.
- Daniel Hahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 12,237,225
- Issue date Feb 25, 2025
- Denso Corporation
- Hiroki Miyake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Correction die for wafer/die stack
- Patent number 12,237,306
- Issue date Feb 25, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 12,237,320
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dicing method for stacked semiconductor devices
- Patent number 12,237,226
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsung-Hsing Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating a semiconductor wafer
- Patent number 12,230,689
- Issue date Feb 18, 2025
- Infineon Technologies AG
- Helmut Brech
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor chip having strength adjustme...
- Patent number 12,230,603
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hong-Wei Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inline wafer defect detection system and method
- Patent number 12,230,522
- Issue date Feb 18, 2025
- Texas Instruments Incorporated
- Patrick David Noll
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of evaluating SiC substrate, method of manufacturing SiC epi...
- Patent number 12,228,523
- Issue date Feb 18, 2025
- Resonac Corporation
- Ling Guo
- C30 - CRYSTAL GROWTH
Information Patent Grant
Die cleaning systems and related methods
- Patent number 12,230,543
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package stress balance structures and related methods
- Patent number 12,230,502
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing system and substrate processing method
- Patent number 12,230,540
- Issue date Feb 18, 2025
- Tokyo Electron Limited
- Yoshihiro Kawaguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for dicing a semiconductor wafer structure
- Patent number 12,230,542
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Hui Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Element chip manufacturing method
- Patent number 12,230,541
- Issue date Feb 18, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Atsushi Harikai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming micro interconnect struc...
- Patent number 12,230,559
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and chip singulation method
- Patent number 12,232,337
- Issue date Feb 18, 2025
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- Yoshihiro Matsushima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with crack-preventing structure
- Patent number 12,230,587
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Minjung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing electronic chips
- Patent number 12,230,602
- Issue date Feb 18, 2025
- STMicroelectronics (Tours) SAS
- Ludovic Fallourd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of separating electronic devices having a back layer and app...
- Patent number 12,224,208
- Issue date Feb 11, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Gordon M. Grivna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional stacking structure and manufacturing method thereof
- Patent number 12,224,265
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a workpiece and system for processing a workpiece
- Patent number 12,224,207
- Issue date Feb 11, 2025
- Disco Corporation
- Hitoshi Hoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating semiconductor package
- Patent number 12,218,001
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Zi-Jheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 12,218,023
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250079240
- Publication date Mar 6, 2025
- Kabushiki Kaisha Toshiba
- Masaaki OGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BACKGRINDING
- Publication number 20250073845
- Publication date Mar 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- GAIL EDSELLE REYES
- B24 - GRINDING POLISHING
Information Patent Application
INCORPORATING SEMICONDUCTORS ON A POLYCRYSTALLINE DIAMOND SUBSTRATE
- Publication number 20250079188
- Publication date Mar 6, 2025
- Texas State University
- Raju Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A POWER COMPONENT BASED ON A WIDE BANDGAP SEMI...
- Publication number 20250079241
- Publication date Mar 6, 2025
- ROBERT BOSCH GmbH
- Kevin Dannecker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING THE SAME
- Publication number 20250079426
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Han-Tang Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNSINGULATED SEMICONDUCTOR PACKAGE
- Publication number 20250079400
- Publication date Mar 6, 2025
- Western Digital Technologies, Inc.
- Yangming Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon Carbide Epitaxy
- Publication number 20250079165
- Publication date Mar 6, 2025
- ThinSiC Inc.
- Tirunelveli Subramaniam Ravi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE TRANSFER METHOD AND APPARATUS
- Publication number 20250079204
- Publication date Mar 6, 2025
- Silicon Box, Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH WAFER TRENCH ISOLATION BETWEEN TRANSISTORS IN AN INTEGRATED...
- Publication number 20250079340
- Publication date Mar 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Scott Robert Summerfelt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR RIGID CHIP-SCALE PACKAGE AND METHOD OF MAKING THE SAME
- Publication number 20250070049
- Publication date Feb 27, 2025
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Lin Lv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20250070079
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- YongChul SHIN
- B32 - LAYERED PRODUCTS
Information Patent Application
SYSTEMS AND METHODS FOR MITIGATING CRACK MEANDERING IN SEMICONDUCTO...
- Publication number 20250069952
- Publication date Feb 27, 2025
- Micron Technology, Inc.
- Vibhav Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BREAKING METHOD
- Publication number 20250069953
- Publication date Feb 27, 2025
- Disco Corporation
- Shinya ARUGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SEAL RING STRUCTURE AND METHOD FOR FORMIN...
- Publication number 20250070052
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ke-Gang Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL DICING METHOD AND SEMICONDUCTOR DEVICE
- Publication number 20250069954
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Ju Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING DEVICE DIE
- Publication number 20250062224
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Che Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF
- Publication number 20250062249
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER AND METHOD OF WAFER THINNING
- Publication number 20250062114
- Publication date Feb 20, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JET ABLATION DIE SINGULATION SYSTEMS AND RELATED METHODS
- Publication number 20250062162
- Publication date Feb 20, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SELECTIVE RELEASE OF COMPONENTS USING THERMAL RELEASE LAYER
- Publication number 20250054785
- Publication date Feb 13, 2025
- Deca Technologies USA, Inc.
- Benedict SAN JOSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...
- Publication number 20250054806
- Publication date Feb 13, 2025
- Mitsubishi Electric Corporation
- Misato HISANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250056911
- Publication date Feb 13, 2025
- XINTEC INC.
- Wei-Luen SUEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHED TRENCHES IN BOND MATERIALS FOR DIE SINGULATION, AND ASSOCIAT...
- Publication number 20250056937
- Publication date Feb 13, 2025
- Micron Technology, Inc.
- Vladimir Odnoblyudov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PREPARING SEMICONDUCTOR CHIP, SEMICONDUCTOR CHIP, AND APP...
- Publication number 20250054813
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Kyungwook HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH PATTERNS OF DIE-SPECIFIC INFORMATION
- Publication number 20250054776
- Publication date Feb 13, 2025
- Micron Technology, Inc.
- Federico Pio
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND WAFER-ATTACHED STRUCTURE
- Publication number 20250046657
- Publication date Feb 6, 2025
- ROHM CO., LTD.
- Masatoshi AKETA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20250046659
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Se Ra Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS WITH THINNING-BASED ALIGNMENT MARK AND METHODS OF MANUFAC...
- Publication number 20250046731
- Publication date Feb 6, 2025
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20250048687
- Publication date Feb 6, 2025
- Kabushiki Kaisha Toshiba
- Hiroki OKUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20250046656
- Publication date Feb 6, 2025
- Socpra Sciences et Genie s.e.c.
- Thierno Mamoudou DIALLO
- C30 - CRYSTAL GROWTH

with subsequent division of the substrate into plural individual devices

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor devices and methods of manufacture

Semiconductor device with electromagnetic interference film and met...

Method of forming testing module and method for using the same

3D AND flash memory device and method of fabricating the same

Semiconductor package with wettable flank and related methods

Semiconductor wafer and method of manufacturing semiconductor chip

Laser processing device, and method for manufacturing chip

Waferscale physiological characteristic sensor package with integra...

Method for manufacturing semiconductor device

Correction die for wafer/die stack

Package structure and method of forming the same

Dicing method for stacked semiconductor devices

Semiconductor device and method for fabricating a semiconductor wafer

Method of fabricating a semiconductor chip having strength adjustme...

Inline wafer defect detection system and method

Method of evaluating SiC substrate, method of manufacturing SiC epi...

Die cleaning systems and related methods

Semiconductor package stress balance structures and related methods

Substrate processing system and substrate processing method

Method for dicing a semiconductor wafer structure

Element chip manufacturing method

Semiconductor device and method of forming micro interconnect struc...

Semiconductor device and chip singulation method

Semiconductor device with crack-preventing structure

Method for manufacturing electronic chips

Method of separating electronic devices having a back layer and app...

Three-dimensional stacking structure and manufacturing method thereof

Method of processing a workpiece and system for processing a workpiece

Semiconductor package and method of fabricating semiconductor package

Semiconductor package and method of forming the same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

WAFER BACKGRINDING

INCORPORATING SEMICONDUCTORS ON A POLYCRYSTALLINE DIAMOND SUBSTRATE

METHOD FOR PRODUCING A POWER COMPONENT BASED ON A WIDE BANDGAP SEMI...

SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING THE SAME

UNSINGULATED SEMICONDUCTOR PACKAGE

Silicon Carbide Epitaxy

DIE TRANSFER METHOD AND APPARATUS

THROUGH WAFER TRENCH ISOLATION BETWEEN TRANSISTORS IN AN INTEGRATED...

SEMICONDUCTOR RIGID CHIP-SCALE PACKAGE AND METHOD OF MAKING THE SAME

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

SYSTEMS AND METHODS FOR MITIGATING CRACK MEANDERING IN SEMICONDUCTO...

BREAKING METHOD

SEMICONDUCTOR DEVICE WITH SEAL RING STRUCTURE AND METHOD FOR FORMIN...

WAFER LEVEL DICING METHOD AND SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING DEVICE DIE

PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF

SEMICONDUCTOR WAFER AND METHOD OF WAFER THINNING

JET ABLATION DIE SINGULATION SYSTEMS AND RELATED METHODS

METHOD OF SELECTIVE RELEASE OF COMPONENTS USING THERMAL RELEASE LAYER

SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

ETCHED TRENCHES IN BOND MATERIALS FOR DIE SINGULATION, AND ASSOCIAT...

METHOD OF PREPARING SEMICONDUCTOR CHIP, SEMICONDUCTOR CHIP, AND APP...

SEMICONDUCTOR PACKAGES WITH PATTERNS OF DIE-SPECIFIC INFORMATION

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND WAFER-ATTACHED STRUCTURE

SEMICONDUCTOR PACKAGES

APPARATUS WITH THINNING-BASED ALIGNMENT MARK AND METHODS OF MANUFAC...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME