with subsequent division of the substrate into plural individual devices

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H01L21/78

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/78with subsequent division of the substrate into plural individual devices

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure having photonic die and electronic die
- Patent number 12,368,147
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,368,084
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of packaging semiconductor devices and packaged semiconduct...
- Patent number 12,362,260
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Hui Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 12,362,344
- Issue date Jul 15, 2025
- Samsung Electronics Co., Ltd.
- Juhyeon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer with semiconductor devices and integrated electrostatic disch...
- Patent number 12,362,294
- Issue date Jul 15, 2025
- NXP USA, INC.
- Colby Greg Rampley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a chip package
- Patent number 12,362,178
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing electronic device
- Patent number 12,362,221
- Issue date Jul 15, 2025
- MITSUI CHEMICALS ICT MATERIA, INC.
- Toru Miura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Systems for fabrication of MMIC and RF devices on engineered substr...
- Patent number 12,362,296
- Issue date Jul 15, 2025
- QROMIS, Inc.
- Ozgur Aktas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing an integrated circuit chip including a back-sid...
- Patent number 12,362,236
- Issue date Jul 15, 2025
- Imec VZW
- Anabela Veloso
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing method
- Patent number 12,354,902
- Issue date Jul 8, 2025
- Disco Corporation
- Jinyan Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Singulation systems and related methods
- Patent number 12,354,917
- Issue date Jul 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating package structure
- Patent number 12,355,008
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Element forming wafer and method for manufacturing the same
- Patent number 12,354,875
- Issue date Jul 8, 2025
- Denso Corporation
- Akihiko Teshigahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing wafer
- Patent number 12,354,916
- Issue date Jul 8, 2025
- Disco Corporation
- Hayato Iga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal routing between memory die and logic die for performing oper...
- Patent number 12,354,649
- Issue date Jul 8, 2025
- Micron Technology, Inc.
- Aliasger T. Zaidy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor chip and semiconductor package
- Patent number 12,355,004
- Issue date Jul 8, 2025
- Samsung Electronics Co., Ltd.
- Junyeong Heo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for mitigating crack propagation in semiconduct...
- Patent number 12,347,732
- Issue date Jul 1, 2025
- Micron Technology, Inc.
- Wei Yeeng Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 12,347,791
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inspection apparatus, manufacturing method of integrated circuit, a...
- Patent number 12,347,708
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die separation ring for wafers having a large die aspect ratio
- Patent number 12,347,733
- Issue date Jul 1, 2025
- SanDisk Technologies, Inc.
- Shuo Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing chips
- Patent number 12,341,068
- Issue date Jun 24, 2025
- Disco Corporation
- Hideyuki Sandoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside metal patterning die singulation system and related methods
- Patent number 12,341,069
- Issue date Jun 24, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-faced molded semiconductor package and related methods
- Patent number 12,341,014
- Issue date Jun 24, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Eiji Kurose
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crackstop structures
- Patent number 12,341,111
- Issue date Jun 24, 2025
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Ranjan Rajoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 12,341,067
- Issue date Jun 24, 2025
- United Microelectronics Corp.
- Meng-Ting Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Detachable structure used for transferring or handling layers, and...
- Patent number 12,334,347
- Issue date Jun 17, 2025
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- François-Xavier Darras
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with tilted interface between device die and encapsulating...
- Patent number 12,334,406
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cleave systems having spring members for cleaving a semiconductor s...
- Patent number 12,334,369
- Issue date Jun 17, 2025
- GlobalWafers Co., Ltd.
- Justin Scott Kayser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming recesses in molding compound of wafer to reduce stress
- Patent number 12,334,474
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple wafer stack architecture to enable singulation
- Patent number 12,334,472
- Issue date Jun 17, 2025
- Intel Corporation
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS AND METHOD FOR DICING A WAFER
- Publication number 20250239467
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Hyun Soo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING CAPACITOR ARCHITECTURE USING CHIPPING D...
- Publication number 20250239539
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Minsu JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED DEVICE STRUCTURES WITH IMPROVED STRESS DISTRIBUTION AND REDU...
- Publication number 20250239548
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Yung Lin Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250239568
- Publication date Jul 24, 2025
- Chipbond Technology Corporation
- Cheng-Hung Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250239463
- Publication date Jul 24, 2025
- UNITED MICROELECTRONICS CORP.
- Chien-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE EDGE STRUCTURE FOR MOLDING COMPOUND FILLING AND THE METHODS OF...
- Publication number 20250239490
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Min-Hsuan Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEFORMATION CONTROL FOR DIE-TO-WAFER AND DIE-TO-DIE BONDING IN DEVI...
- Publication number 20250239492
- Publication date Jul 24, 2025
- Applied Materials, Inc.
- San-Kuei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING WAFER
- Publication number 20250239468
- Publication date Jul 24, 2025
- Disco Corporation
- Akira MIZUTANI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PROCESSING WORKPIECE
- Publication number 20250239453
- Publication date Jul 24, 2025
- Disco Corporation
- Kensuke FURUTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250239491
- Publication date Jul 24, 2025
- Chipbond Technology Corporation
- Cheng-Hung Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE CHIP MANUFACTURING METHOD AND WORKPIECE PROCESSING APPARATUS
- Publication number 20250239493
- Publication date Jul 24, 2025
- Disco Corporation
- Kazuma Sekiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250239501
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING ELECTRONIC CHIPS
- Publication number 20250239481
- Publication date Jul 24, 2025
- STMicroelectronics International N.V.
- Gregoire DELACOURT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRESS BALANCE STRUCTURES AND RELATED METHODS
- Publication number 20250232978
- Publication date Jul 17, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE CLEANING SYSTEMS AND RELATED METHODS
- Publication number 20250233021
- Publication date Jul 17, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20250233081
- Publication date Jul 17, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Ji Hoon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRESS BALANCE STRUCTURES AND RELATED METHODS
- Publication number 20250232979
- Publication date Jul 17, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20250226238
- Publication date Jul 10, 2025
- Resonac Corporation
- Keiichi HATAKEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Workpiece Processing Method
- Publication number 20250226229
- Publication date Jul 10, 2025
- LINTEC CORPORATION
- Hayato Nakanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING WAFER
- Publication number 20250226242
- Publication date Jul 10, 2025
- Disco Corporation
- Akira MIZUTANI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250226278
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hsien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT WAFER LEVEL PACKAGING OF SEMICONDUCTOR DEVICES
- Publication number 20250226264
- Publication date Jul 10, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- George CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNING BACKSIDE GATE CONNECTION
- Publication number 20250218870
- Publication date Jul 3, 2025
- Applied Materials, Inc.
- Ashish PAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPANDING DEVICE, SEMICONDUCTOR CHIP MANUFACTURING METHOD, AND SEMI...
- Publication number 20250218871
- Publication date Jul 3, 2025
- YAMAHA HATSUDOKI KABUSHIKI KAISHA
- Yoshikuni SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPANDING DEVICE, SEMICONDUCTOR CHIP MANUFACTURING METHOD, AND SEMI...
- Publication number 20250218872
- Publication date Jul 3, 2025
- YAMAHA HATSUDOKI KABUSHIKI KAISHA
- Yoshikuni SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250218922
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Ming Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR A STACK OF COMPONENTS EMBEDDED IN A SUBSTRATE CORE
- Publication number 20250218962
- Publication date Jul 3, 2025
- Intel Corporation
- Mahdi Mohammadighaleni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL CHIP SCALE PACKAGE SEMICONDUCTOR DEVICES WITH LIGHT BLO...
- Publication number 20250218975
- Publication date Jul 3, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Daiki Komatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP MANUFACTURING METHOD
- Publication number 20250210355
- Publication date Jun 26, 2025
- Disco Corporation
- Yuki OGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20250210416
- Publication date Jun 26, 2025
- Kabushiki Kaisha Toshiba
- Etsuo HAMADA
- H01 - BASIC ELECTRIC ELEMENTS

with subsequent division of the substrate into plural individual devices

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor structure having photonic die and electronic die

Package structure and manufacturing method thereof

Methods of packaging semiconductor devices and packaged semiconduct...

Semiconductor package and method of manufacturing the same

Wafer with semiconductor devices and integrated electrostatic disch...

Method for fabricating a chip package

Method for manufacturing electronic device

Systems for fabrication of MMIC and RF devices on engineered substr...

Method of producing an integrated circuit chip including a back-sid...

Wafer processing method

Singulation systems and related methods

Methods of fabricating package structure

Element forming wafer and method for manufacturing the same

Method of processing wafer

Signal routing between memory die and logic die for performing oper...

Semiconductor chip and semiconductor package

Systems and methods for mitigating crack propagation in semiconduct...

Integrated circuit package and method

Inspection apparatus, manufacturing method of integrated circuit, a...

Die separation ring for wafers having a large die aspect ratio

Method of manufacturing chips

Backside metal patterning die singulation system and related methods

Multi-faced molded semiconductor package and related methods

Crackstop structures

Manufacturing method of semiconductor device

Detachable structure used for transferring or handling layers, and...

Package with tilted interface between device die and encapsulating...

Cleave systems having spring members for cleaving a semiconductor s...

Forming recesses in molding compound of wafer to reduce stress

Multiple wafer stack architecture to enable singulation

Patents Applicationslast 30 patents

APPARATUS AND METHOD FOR DICING A WAFER

SEMICONDUCTOR DEVICE HAVING CAPACITOR ARCHITECTURE USING CHIPPING D...

BONDED DEVICE STRUCTURES WITH IMPROVED STRESS DISTRIBUTION AND REDU...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

DIE EDGE STRUCTURE FOR MOLDING COMPOUND FILLING AND THE METHODS OF...

DEFORMATION CONTROL FOR DIE-TO-WAFER AND DIE-TO-DIE BONDING IN DEVI...

METHOD OF PROCESSING WAFER

METHOD FOR PROCESSING WORKPIECE

CHIP STRUCTURE AND METHOD OF MANUFACTURING THE SAME

DEVICE CHIP MANUFACTURING METHOD AND WORKPIECE PROCESSING APPARATUS

SEMICONDUCTOR PACKAGE

METHOD OF FABRICATING ELECTRONIC CHIPS

SEMICONDUCTOR PACKAGE STRESS BALANCE STRUCTURES AND RELATED METHODS

DIE CLEANING SYSTEMS AND RELATED METHODS

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR PACKAGE STRESS BALANCE STRUCTURES AND RELATED METHODS

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

Workpiece Processing Method

METHOD OF PROCESSING WAFER

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

FAN-OUT WAFER LEVEL PACKAGING OF SEMICONDUCTOR DEVICES

SELF-ALIGNING BACKSIDE GATE CONNECTION

EXPANDING DEVICE, SEMICONDUCTOR CHIP MANUFACTURING METHOD, AND SEMI...

EXPANDING DEVICE, SEMICONDUCTOR CHIP MANUFACTURING METHOD, AND SEMI...

SEMICONDUCTOR PACKAGE

TECHNOLOGIES FOR A STACK OF COMPONENTS EMBEDDED IN A SUBSTRATE CORE

WAFER-LEVEL CHIP SCALE PACKAGE SEMICONDUCTOR DEVICES WITH LIGHT BLO...

CHIP MANUFACTURING METHOD

SEMICONDUCTOR DEVICE MANUFACTURING METHOD