with subsequent division of the substrate into plural individual devices

Industry

CPC
H01L21/78

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/78with subsequent division of the substrate into plural individual devices

Industries

Patents Grantslast 30 patents

Information Patent Grant
Light-emitting device
- Patent number 12,155,019
- Issue date Nov 26, 2024
- Epistar Corporation
- Hsin-Ying Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structures
- Patent number 12,154,897
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer and method of wafer thinning
- Patent number 12,154,783
- Issue date Nov 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of obtaining a smooth surface with epitaxial lateral overgrowth
- Patent number 12,146,237
- Issue date Nov 19, 2024
- The Regents of the University of California
- Takeshi Kamikawa
- C30 - CRYSTAL GROWTH
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 12,148,712
- Issue date Nov 19, 2024
- Mitsubishi Electric Corporation
- Kazuya Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shift control method in manufacture of semiconductor device
- Patent number 12,148,733
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cleave systems having spring members for cleaving a semiconductor s...
- Patent number 12,148,635
- Issue date Nov 19, 2024
- GlobalWafers Co., Ltd.
- Justin Scott Kayser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for use in wafer processing
- Patent number 12,148,640
- Issue date Nov 19, 2024
- Infineon Technologies AG
- Thomas Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Jet ablation die singulation systems and related methods
- Patent number 12,148,665
- Issue date Nov 19, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method and wafer-attached structure
- Patent number 12,148,667
- Issue date Nov 19, 2024
- Rohm Co., Ltd.
- Masatoshi Aketa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Through wafer trench isolation between transistors in an integrated...
- Patent number 12,148,717
- Issue date Nov 19, 2024
- Texas Instruments Incorporated
- Scott Robert Summerfelt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabrcating the same
- Patent number 12,148,732
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method of manufacturing semiconductor device,...
- Patent number 12,148,666
- Issue date Nov 19, 2024
- Kioxia Corporation
- Hidekazu Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier modules including semiconductor resistor and tantal...
- Patent number 12,143,077
- Issue date Nov 12, 2024
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 12,142,571
- Issue date Nov 12, 2024
- Advanced Semiconductor Engineering, Inc.
- Chao Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method and semiconductor device...
- Patent number 12,136,569
- Issue date Nov 5, 2024
- FILNEX INC.
- Mitsuhiko Ogihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an interposer in which one or more die...
- Patent number 12,136,597
- Issue date Nov 5, 2024
- Mediatek Inc.
- Yi-Lin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etched trenches in bond materials for die singulation, and associat...
- Patent number 12,132,155
- Issue date Oct 29, 2024
- Micron Technology, Inc.
- Vladimir Odnoblyudov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer dicing using femtosecond-based laser and plasma etch
- Patent number 12,131,952
- Issue date Oct 29, 2024
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked device with backside power distribution network and method...
- Patent number 12,131,996
- Issue date Oct 29, 2024
- Samsung Electronics Co., Ltd.
- Saehan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with patterns of die-specific information
- Patent number 12,131,916
- Issue date Oct 29, 2024
- Micron Technology, Inc.
- Federico Pio
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Laser processing method, and laser processing device
- Patent number 12,128,498
- Issue date Oct 29, 2024
- Hamamatsu Photonics K.K.
- Takafumi Ogiwara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package having multiple chips integrated therein and manufacturing...
- Patent number 12,125,821
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming hybrid TIM layers
- Patent number 12,125,764
- Issue date Oct 22, 2024
- STATS ChipPAC Pte. Ltd.
- TaeKeun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating semiconductor package
- Patent number 12,125,741
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Zi-Jheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing workpiece and laser processing apparatus
- Patent number 12,121,993
- Issue date Oct 22, 2024
- Disco Corporation
- Masatoshi Nayuki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing ferromagnetic-dielectric composite material
- Patent number 12,125,713
- Issue date Oct 22, 2024
- Ferric Inc.
- Michael Lekas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating the same die stack structure and semiconduct...
- Patent number 12,119,328
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for an improved integrated circuit package
- Patent number 12,119,263
- Issue date Oct 15, 2024
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate via structure and method of manufacture
- Patent number 12,119,294
- Issue date Oct 15, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20240395620
- Publication date Nov 28, 2024
- Disco Corporation
- Jonghyun RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING METHOD FOR STACKED SEMICONDUCTOR DEVICES
- Publication number 20240395621
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Tsung-Hsing Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TAPE HEATING METHODS
- Publication number 20240395593
- Publication date Nov 28, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGULATION AND BONDING METHODS AND STRUCTURES FORMED THEREBY
- Publication number 20240395775
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS FOR SOURCE-DOWN VERTICAL SEMICONDUCTOR DEVICE
- Publication number 20240395925
- Publication date Nov 28, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Gordon M. Grivna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES, PACKAGING METHODS, AND PACKAGED SEMI...
- Publication number 20240395792
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jie CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectromechanical Systems (MEMS) Fabrication Process Including...
- Publication number 20240395540
- Publication date Nov 28, 2024
- StethX Microsystems
- Farrokh Ayazi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Manufacture
- Publication number 20240387391
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240387450
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF GROUP III-V SEMICONDUCTOR PACKAGE
- Publication number 20240387300
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-An Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICES AND METHODS THEREFOR
- Publication number 20240387271
- Publication date Nov 21, 2024
- NXP B.V.
- Kuan-Hsiang Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240387417
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carrier Assisted Substrate Method of Manufacturing an Electronic De...
- Publication number 20240387230
- Publication date Nov 21, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Roger St. Amand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR PRODUCING AND PREPARING ELECTRONIC COMPONENTS
- Publication number 20240387270
- Publication date Nov 21, 2024
- EV GROUP E. THALLNER GMBH
- Jurgen Burggraf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Extended Seal Ring Structure on Wafer-Stacking
- Publication number 20240387403
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Hsorng Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method of Manufacturing The Same
- Publication number 20240387196
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR LOW-COST, HIGH-BANDWIDTH MONOLITHIC SYSTEM INTEGRATION B...
- Publication number 20240387351
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Murat Kerem AKARVARDAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-Dimensional Vertical Interconnect Architecture and Methods Fo...
- Publication number 20240387458
- Publication date Nov 21, 2024
- Applied Materials, Inc.
- Suketu PARIKH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ELECTROMAGNETIC INTERFERENCE FILM AND MET...
- Publication number 20240387401
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chi-Hsi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240379478
- Publication date Nov 14, 2024
- Samsung Electronics Co., Ltd.
- Yeongkwon KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE UTILIZING WAFER TO WAFER BONDING
- Publication number 20240379487
- Publication date Nov 14, 2024
- Qorvo US, Inc.
- Anthony Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LEVEL STACKING OF WAFERS AND CHIPS
- Publication number 20240379614
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20240379402
- Publication date Nov 14, 2024
- Disco Corporation
- Tomoharu TAKITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICE
- Publication number 20240379382
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- SHOU ZEN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER IRRADIATING DEVICE, LASER IRRADIATING METHOD, AND LASER PROCE...
- Publication number 20240375209
- Publication date Nov 14, 2024
- TOKYO SEIMITSU CO., LTD.
- Yusuke KANESHIRO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
EXPANDING DEVICE, SEMICONDUCTOR CHIP MANUFACTURING METHOD, AND SEMI...
- Publication number 20240379389
- Publication date Nov 14, 2024
- YAMAHA HATSUDOKI KABUSHIKI KAISHA
- Yoshikuni SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK GRINDING ADHESIVE FILM AND METHOD FOR MANUFACTURING ELECTRONIC...
- Publication number 20240379403
- Publication date Nov 14, 2024
- MITSUI CHEMICALS TOHCELLO, INC.
- Hiroto YASUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE, DICING METHOD THEREOF, AND MEMORY
- Publication number 20240379578
- Publication date Nov 14, 2024
- Yangtze Memory Technologies Co., Ltd.
- Dongyu Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIFT CONTROL METHOD IN MANUFACTURE OF SEMICONDUCTOR DEVICE
- Publication number 20240379617
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240371695
- Publication date Nov 7, 2024
- UNITED MICROELECTRONICS CORP.
- Chuan-Lan Lin
- H01 - BASIC ELECTRIC ELEMENTS

with subsequent division of the substrate into plural individual devices

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Light-emitting device

Package structures

Semiconductor wafer and method of wafer thinning

Method of obtaining a smooth surface with epitaxial lateral overgrowth

Semiconductor device and method of manufacturing semiconductor device

Shift control method in manufacture of semiconductor device

Cleave systems having spring members for cleaving a semiconductor s...

Method and apparatus for use in wafer processing

Jet ablation die singulation systems and related methods

Semiconductor device manufacturing method and wafer-attached structure

Through wafer trench isolation between transistors in an integrated...

Package structure and method of fabrcating the same

Semiconductor device, method of manufacturing semiconductor device,...

Power amplifier modules including semiconductor resistor and tantal...

Semiconductor device package and method of manufacturing the same

Semiconductor device manufacturing method and semiconductor device...

Semiconductor package having an interposer in which one or more die...

Etched trenches in bond materials for die singulation, and associat...

Wafer dicing using femtosecond-based laser and plasma etch

Stacked device with backside power distribution network and method...

Semiconductor packages with patterns of die-specific information

Laser processing method, and laser processing device

Package having multiple chips integrated therein and manufacturing...

Semiconductor device and method of forming hybrid TIM layers

Semiconductor package and method of fabricating semiconductor package

Method of processing workpiece and laser processing apparatus

Method for manufacturing ferromagnetic-dielectric composite material

Methods of fabricating the same die stack structure and semiconduct...

Methods and apparatus for an improved integrated circuit package

Through-substrate via structure and method of manufacture

Patents Applicationslast 30 patents

WAFER PROCESSING METHOD

DICING METHOD FOR STACKED SEMICONDUCTOR DEVICES

TAPE HEATING METHODS

SINGULATION AND BONDING METHODS AND STRUCTURES FORMED THEREBY

STRUCTURES AND METHODS FOR SOURCE-DOWN VERTICAL SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE PACKAGES, PACKAGING METHODS, AND PACKAGED SEMI...

Microelectromechanical Systems (MEMS) Fabrication Process Including...

Semiconductor Devices and Methods of Manufacture

REDISTRIBUTION STRUCTURE AND METHOD OF FORMING THE SAME

MANUFACTURING METHOD OF GROUP III-V SEMICONDUCTOR PACKAGE

PACKAGED SEMICONDUCTOR DEVICES AND METHODS THEREFOR

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Carrier Assisted Substrate Method of Manufacturing an Electronic De...

METHOD AND DEVICE FOR PRODUCING AND PREPARING ELECTRONIC COMPONENTS

Extended Seal Ring Structure on Wafer-Stacking

Semiconductor Package and Method of Manufacturing The Same

METHOD FOR LOW-COST, HIGH-BANDWIDTH MONOLITHIC SYSTEM INTEGRATION B...

Three-Dimensional Vertical Interconnect Architecture and Methods Fo...

SEMICONDUCTOR DEVICE WITH ELECTROMAGNETIC INTERFERENCE FILM AND MET...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

PACKAGE ARCHITECTURE UTILIZING WAFER TO WAFER BONDING

MULTI-LEVEL STACKING OF WAFERS AND CHIPS

WAFER PROCESSING METHOD

MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICE

LASER IRRADIATING DEVICE, LASER IRRADIATING METHOD, AND LASER PROCE...

EXPANDING DEVICE, SEMICONDUCTOR CHIP MANUFACTURING METHOD, AND SEMI...

BACK GRINDING ADHESIVE FILM AND METHOD FOR MANUFACTURING ELECTRONIC...

SEMICONDUCTOR STRUCTURE, DICING METHOD THEREOF, AND MEMORY

SHIFT CONTROL METHOD IN MANUFACTURE OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME