with subsequent division of the substrate into plural individual devices

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/78with subsequent division of the substrate into plural individual devices

Industries

Patents Grantslast 30 patents

Information Patent Grant
Methods of manufacturing semiconductor chip
- Patent number 11,967,529
- Issue date Apr 23, 2024
- Samsung Electronics Co., Ltd.
- Byung-moon Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device and method for fabricating a packaged...
- Patent number 11,967,562
- Issue date Apr 23, 2024
- Infineon Technologies AG
- Horst Theuss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing GaN layered substrate
- Patent number 11,967,530
- Issue date Apr 23, 2024
- Shin-Etsu Chemical Co., Ltd.
- Sumio Sekiyama
- B32 - LAYERED PRODUCTS
Information Patent Grant
Systems for thermally treating conductive elements on semiconductor...
- Patent number 11,967,576
- Issue date Apr 23, 2024
- Micron Technology, Inc.
- James M. Derderian
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a semiconductor substrate and device by bo...
- Patent number 11,961,765
- Issue date Apr 16, 2024
- Mitsubishi Electric Corporation
- Shuichi Hiza
- C30 - CRYSTAL GROWTH
Information Patent Grant
Semiconductor device and method of making a wafer-level chip-scale...
- Patent number 11,961,764
- Issue date Apr 16, 2024
- STATS ChipPAC Pte. Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to dual-sided radio-frequency package w...
- Patent number 11,961,805
- Issue date Apr 16, 2024
- Skyworks Solutions, Inc.
- Howard E. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device assemblies and packages including multiple d...
- Patent number 11,961,825
- Issue date Apr 16, 2024
- Micron Technology, Inc.
- Aparna U. Limaye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device and manufacturing method of semiconduct...
- Patent number 11,963,351
- Issue date Apr 16, 2024
- SK hynix Inc.
- Nam Jae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate support for reduced damage substrate backside
- Patent number 11,955,362
- Issue date Apr 9, 2024
- Applied Materials, Inc.
- Joel M Huston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating three-dimensional semiconductor device using...
- Patent number 11,956,958
- Issue date Apr 9, 2024
- Yangtze Memory Technologies Co., Ltd.
- He Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive composition, film-like adhesive and production method ther...
- Patent number 11,952,513
- Issue date Apr 9, 2024
- Furukawa Electric Co., Ltd.
- Minoru Morita
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Package-on-package device
- Patent number 11,955,433
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Regulator circuit package techniques
- Patent number 11,955,437
- Issue date Apr 9, 2024
- Analog Devices International Unlimited Company
- Leonard Shtargot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming package structure
- Patent number 11,951,571
- Issue date Apr 9, 2024
- Integrated Silicon Solution Inc.
- Cheng-Fu Yu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Advanced info POP and method of forming thereof
- Patent number 11,955,460
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Da Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field effect transistor based on graphene nanoribbon and method for...
- Patent number 11,948,793
- Issue date Apr 2, 2024
- Tsinghua University
- Tian-Fu Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 11,948,930
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chin-Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,948,896
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturable large area gallium and nitrogen containin...
- Patent number 11,949,212
- Issue date Apr 2, 2024
- KYOCERA SLD Laser, Inc.
- Melvin McLaurin
- C30 - CRYSTAL GROWTH
Information Patent Grant
SOI substrate and related methods
- Patent number 11,948,880
- Issue date Apr 2, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Mark Griswold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging method and semiconductor package device
- Patent number 11,948,911
- Issue date Apr 2, 2024
- TONGFU MICROELECTRONICS CO., LTD.
- Guoqing Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming stacked semiconductors die assemblies
- Patent number 11,948,921
- Issue date Apr 2, 2024
- Randon K. Richards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside metal patterning die singulation systems and related methods
- Patent number 11,942,366
- Issue date Mar 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin semiconductor package for notched semiconductor die
- Patent number 11,942,369
- Issue date Mar 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Shutesh Krishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid crystal on silicon panel, and preparation method thereof
- Patent number 11,940,698
- Issue date Mar 26, 2024
- Advanced Silicon Display Optoelectronics Corporation Ltd.
- Yeuk-Keung Fung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,942,403
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chien Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including an electromagnetic shield and metho...
- Patent number 11,942,437
- Issue date Mar 26, 2024
- Samsung Electronics Co., Ltd.
- Youngwoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dynamic release tapes for assembly of discrete components
- Patent number 11,942,354
- Issue date Mar 26, 2024
- Uniqarta, Inc.
- Val Marinov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive tape for semiconductor processing and method for producing...
- Patent number 11,942,353
- Issue date Mar 26, 2024
- Lintec Corporation
- Kazuto Aizawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240136301
- Publication date Apr 25, 2024
- Power Master Semiconductor Co., Ltd.
- Sangwoo PAK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NO MOLD SHELF PACKAGE DESIGN AND PROCESS FLOW FOR ADVANCED PACKAGE...
- Publication number 20240136326
- Publication date Apr 25, 2024
- Intel Corporation
- Wei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING AND PACKAGING
- Publication number 20240128199
- Publication date Apr 18, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jane Qian Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO IMPLEMENT WAFER-LEVEL CHIP-SCALE PACKAGES WITH GROUNDED C...
- Publication number 20240128202
- Publication date Apr 18, 2024
- Intel Corporation
- Gianni SIGNORINI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SIZE PACKAGE AND SYSTEM
- Publication number 20240128203
- Publication date Apr 18, 2024
- STMicroelectronics Pte Ltd
- Jing-En LUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR STRUCTURES AND RESULTING SEMICONDU...
- Publication number 20240128336
- Publication date Apr 18, 2024
- Wolfspeed, Inc.
- Christer Hallin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240128143
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Han Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL SOLID-STATE TRANSDUCERS AND HIGH VOLTAGE SOLID-STATE TRANS...
- Publication number 20240128426
- Publication date Apr 18, 2024
- Micron Technology, Inc.
- Vladimir Odnoblyudov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR DIE AND SEMICONDUCTOR DEVICE THEREOF
- Publication number 20240128123
- Publication date Apr 18, 2024
- Magnachip Semiconductor, Ltd.
- Jin Won JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carbon Assisted Semiconductor Dicing And Method
- Publication number 20240120284
- Publication date Apr 11, 2024
- ThinSiC Inc.
- Tirunelveli Subramaniam Ravi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ION IMPLANTATION WITH ANNEALING FOR SUBSTRATE CUTTING
- Publication number 20240120314
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Huicheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE, METHOD FOR MANUFACTURING SEMICONDUCTOR SUB...
- Publication number 20240120238
- Publication date Apr 11, 2024
- FILNEX INC.
- Mitsuhiko OGIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER COMPOSITE, SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING...
- Publication number 20240112956
- Publication date Apr 4, 2024
- INFINEON TECHNOLOGIES AUSTRIA AG
- Hermann Gruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF CHIPS
- Publication number 20240112955
- Publication date Apr 4, 2024
- Disco Corporation
- Yu ZHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS
- Publication number 20240112924
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsu-Hsien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE
- Publication number 20240105512
- Publication date Mar 28, 2024
- GLOBALWAFERS CO., LTD.
- Chih-Yuan Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING METHOD OF SUBSTRATE AND MANUFACTURING METHOD OF CHIPS
- Publication number 20240105511
- Publication date Mar 28, 2024
- Disco Corporation
- Fumiya KAWANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME
- Publication number 20240096634
- Publication date Mar 21, 2024
- STATS ChipPAC Pte Ltd.
- IkSoo JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING METHOD OF WAFER
- Publication number 20240096704
- Publication date Mar 21, 2024
- Disco Corporation
- Masaru Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER DICING METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVIC...
- Publication number 20240096703
- Publication date Mar 21, 2024
- Samsung Electronics Co., Ltd.
- Youngchul Kwon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR DEVICE
- Publication number 20240088056
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jhih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20240087974
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNABLE DIE ATTACH MATERIALS AND PROCESSES FOR PATTERNING
- Publication number 20240088052
- Publication date Mar 14, 2024
- Intel Corporation
- Bai NIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE COMPOSITION, FILM ADHESIVE, AND SEMICONDUCTOR PACKAGE USIN...
- Publication number 20240084172
- Publication date Mar 14, 2024
- FURUKAWA ELECTRIC CO., LTD.
- Minoru MORITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER
- Publication number 20240088066
- Publication date Mar 14, 2024
- EM Microelectronic-Marin SA
- Christophe ENTRINGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE DIE STRUCTURE AND METHOD OF FABRICATING THEREOF
- Publication number 20240087902
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chieh-Lung LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240088119
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240087903
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR CHIP INCLUDING FORMING DICING...
- Publication number 20240079272
- Publication date Mar 7, 2024
- SK HYNIX INC.
- Byung Cheol LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH CONDUCTIVE SHIELDING FILM
- Publication number 20240079381
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua YU
- H01 - BASIC ELECTRIC ELEMENTS

with subsequent division of the substrate into plural individual devices

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods of manufacturing semiconductor chip

Packaged semiconductor device and method for fabricating a packaged...

Method for producing GaN layered substrate

Systems for thermally treating conductive elements on semiconductor...

Method for manufacturing a semiconductor substrate and device by bo...

Semiconductor device and method of making a wafer-level chip-scale...

Devices and methods related to dual-sided radio-frequency package w...

Microelectronic device assemblies and packages including multiple d...

Semiconductor memory device and manufacturing method of semiconduct...

Substrate support for reduced damage substrate backside

Method for fabricating three-dimensional semiconductor device using...

Adhesive composition, film-like adhesive and production method ther...

Package-on-package device

Regulator circuit package techniques

Method of forming package structure

Advanced info POP and method of forming thereof

Field effect transistor based on graphene nanoribbon and method for...

Semiconductor package and method of manufacturing the same

Package structure

Method for manufacturable large area gallium and nitrogen containin...

SOI substrate and related methods

Semiconductor packaging method and semiconductor package device

Methods of forming stacked semiconductors die assemblies

Backside metal patterning die singulation systems and related methods

Thin semiconductor package for notched semiconductor die

Liquid crystal on silicon panel, and preparation method thereof

Integrated circuit package and method

Semiconductor package including an electromagnetic shield and metho...

Dynamic release tapes for assembly of discrete components

Adhesive tape for semiconductor processing and method for producing...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

NO MOLD SHELF PACKAGE DESIGN AND PROCESS FLOW FOR ADVANCED PACKAGE...

SUBSTRATE PROCESSING AND PACKAGING

METHOD TO IMPLEMENT WAFER-LEVEL CHIP-SCALE PACKAGES WITH GROUNDED C...

CHIP SIZE PACKAGE AND SYSTEM

METHODS OF FORMING SEMICONDUCTOR STRUCTURES AND RESULTING SEMICONDU...

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

VERTICAL SOLID-STATE TRANSDUCERS AND HIGH VOLTAGE SOLID-STATE TRANS...

METHOD FOR FORMING SEMICONDUCTOR DIE AND SEMICONDUCTOR DEVICE THEREOF

Carbon Assisted Semiconductor Dicing And Method

ION IMPLANTATION WITH ANNEALING FOR SUBSTRATE CUTTING

SEMICONDUCTOR SUBSTRATE, METHOD FOR MANUFACTURING SEMICONDUCTOR SUB...

WAFER COMPOSITE, SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING...

MANUFACTURING METHOD OF CHIPS

INTEGRATED CIRCUIT PACKAGES AND METHODS

SEMICONDUCTOR SUBSTRATE

PROCESSING METHOD OF SUBSTRATE AND MANUFACTURING METHOD OF CHIPS

SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME

PROCESSING METHOD OF WAFER

WAFER DICING METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVIC...

METHOD OF FORMING SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

PATTERNABLE DIE ATTACH MATERIALS AND PROCESSES FOR PATTERNING

ADHESIVE COMPOSITION, FILM ADHESIVE, AND SEMICONDUCTOR PACKAGE USIN...

SEMICONDUCTOR WAFER

MULTIPLE DIE STRUCTURE AND METHOD OF FABRICATING THEREOF

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

PACKAGE STRUCTURE

METHOD OF MANUFACTURING SEMICONDUCTOR CHIP INCLUDING FORMING DICING...

CHIP PACKAGE STRUCTURE WITH CONDUCTIVE SHIELDING FILM