with the principal constituent melting at less than 400 degrees C

Industry

CPC
B23K35/26

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B23Machine tools B23KSOLDERING OR UNSOLDERING WELDING CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting

Current Industry

B23K35/26with the principal constituent melting at less than 400 degrees C

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for step-soldering
- Patent number 12,179,291
- Issue date Dec 31, 2024
- Senju Metal Industry Co., Ltd.
- Takashi Saito
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free solder alloy
- Patent number 12,172,242
- Issue date Dec 24, 2024
- Nihon Superior Co., Ltd.
- Takatoshi Nishimura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder particles
- Patent number 12,172,240
- Issue date Dec 24, 2024
- Resonac Corporation
- Kunihiko Akai
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Light emitting diode for low temperature applications
- Patent number 12,159,961
- Issue date Dec 3, 2024
- Azenta Life Sciences, Inc.
- Aarash Navabi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flux, solder paste, soldering process, method for producing soldere...
- Patent number 12,138,714
- Issue date Nov 12, 2024
- ORIGIN COMPANY, LIMITED
- Arisa Shiraishi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder paste
- Patent number 12,138,715
- Issue date Nov 12, 2024
- Heraeus Deutschland GmbH & Co. KG
- Lei Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing a vehicle glass assembly
- Patent number 12,128,493
- Issue date Oct 29, 2024
- ACR II GLASS AMERICA INC.
- Olivier Farreyrol
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free solder compositions
- Patent number 12,115,602
- Issue date Oct 15, 2024
- Alpha Assembly Solutions Inc.
- Ranjit Pandher
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder alloy, solder ball, solder paste, and solder joint
- Patent number 12,109,653
- Issue date Oct 8, 2024
- Senju Metal Industry Co., Ltd.
- Takahiro Matsufuji
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free solder alloy composition suitable for use in high-tempera...
- Patent number 12,103,114
- Issue date Oct 1, 2024
- KYUNG DONG MTEC CO., LTD.
- Heung Rak Sohn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High reliability lead-free solder alloys for harsh environment elec...
- Patent number 12,090,579
- Issue date Sep 17, 2024
- Indium Corporation
- Weiping Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing a vehicle glass assembly
- Patent number 12,091,729
- Issue date Sep 17, 2024
- ACR II GLASS AMERICA INC.
- Olivier Farreyrol
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Co-production of lead and tin products
- Patent number 12,060,626
- Issue date Aug 13, 2024
- METALLO BELGIUM
- Bert Coletti
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder alloy, solder paste, solder ball, solder preform, solder joi...
- Patent number 12,053,843
- Issue date Aug 6, 2024
- Senju Metal Industry Co., Ltd.
- Shunsaku Yoshikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connector
- Patent number 12,036,628
- Issue date Jul 16, 2024
- Aptiv Technologies AG
- Stephen Antaya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free solder alloy and method of manufacturing electronic devic...
- Patent number 12,030,140
- Issue date Jul 9, 2024
- MK Electron Co., Ltd.
- Young Woo Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board assembly process using multiple solders and a...
- Patent number 12,035,483
- Issue date Jul 9, 2024
- Dell Products L.P.
- Subramanian Vasudevan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sn—Cu mixed alloy solder paste, method of making the same and solde...
- Patent number 12,030,139
- Issue date Jul 9, 2024
- Robert Bosch GmbH
- Wallace Chuang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder paste
- Patent number 12,017,306
- Issue date Jun 25, 2024
- Senju Metal Industry Co., Ltd.
- Takeshi Sakamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flux, solder paste, and electronic circuit board
- Patent number 12,011,787
- Issue date Jun 18, 2024
- HARIMA CHEMICALS, INCORPORATED
- Kazuki Ikeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal and tin alloy having low alpha-ray emission, and method for p...
- Patent number 12,000,020
- Issue date Jun 4, 2024
- Mitsubishi Materials Corporation
- Hirotaka Hirano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
SnBi and SnIn solder alloys
- Patent number 11,999,018
- Issue date Jun 4, 2024
- Indium Corporation
- Francis M. Mutuku
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder alloy and solder joint
- Patent number 11,992,902
- Issue date May 28, 2024
- Senju Metal Industry Co., Ltd.
- Takahiro Yokoyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder and method for producing high purity lead
- Patent number 11,992,903
- Issue date May 28, 2024
- METALLO BELGIUM
- Koen Govaerts
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free and halogen-free solder paste
- Patent number 11,992,901
- Issue date May 28, 2024
- DONGGUAN CITY THOUSAND ISLAND METAL FOIL CO., LTD.
- Jianping Cao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder joint part and method for manufacturing the same
- Patent number 11,980,974
- Issue date May 14, 2024
- Nihon Superior Co., Ltd.
- Kazuhiro Nogita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing at least one defined connecting layer between...
- Patent number 11,951,559
- Issue date Apr 9, 2024
- Bayerische Motoren Werke Aktiengesellschaft
- Bernhard Glueck
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flux and solder paste
- Patent number 11,945,055
- Issue date Apr 2, 2024
- Senju Metal Industry Co., Ltd.
- Hiroshi Sugii
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder alloy, solder paste, solder preform and solder joint
- Patent number 11,911,854
- Issue date Feb 27, 2024
- Senju Metal Industry Co., Ltd.
- Yoshie Tachibana
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tin production, which includes a composition comprising tin, lead,...
- Patent number 11,913,091
- Issue date Feb 27, 2024
- METALLO BELGIUM
- Bert Coletti
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SOLDER PARTICLES, SOLDER PARTICLE PRODUCTION METHOD, AND CONDUCTIVE...
- Publication number 20250001528
- Publication date Jan 2, 2025
- Dexerials Corporation
- Hidetsugu NAMIKI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SOLDER ALLOY, SOLDER JOINT, AND SEMICONDUCTOR PACKAGE INCLUDING SOL...
- Publication number 20250001529
- Publication date Jan 2, 2025
- DUKSAN HI-METAL CO., LTD.
- Eun Kwang PARK
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER ALLOY, SOLDER JOINT, AND SEMICONDUCTOR PACKAGE INCLUDING SOL...
- Publication number 20250006680
- Publication date Jan 2, 2025
- DUKSAN HI-METAL CO., LTD.
- Eun Kwang PARK
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH RELIABILITY LEAD-FREE SOLDER ALLOYS FOR HARSH ENVIRONMENT ELEC...
- Publication number 20250001530
- Publication date Jan 2, 2025
- Indium Corporation
- Weiping Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder Alloy, Solder Ball, Solder Paste, and Solder Joint
- Publication number 20240424615
- Publication date Dec 26, 2024
- SENJU METAL INDUSTRY CO., LTD.
- Takahiro Matsufuji
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
JOINED BODY, METHOD OF MANUFACTURING JOINED BODY, AND METHOD OF EVA...
- Publication number 20240429108
- Publication date Dec 26, 2024
- MITSUBISHI MATERIALS CORPORATION
- Shujie Fei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING MATERIAL COMPOSITION, METHOD FOR MANUFACTURING BONDING MATE...
- Publication number 20240408703
- Publication date Dec 12, 2024
- FURUKAWA ELECTRIC CO., LTD.
- Norzafriza NITTA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WATER-SOLUBLE FLUX AND SOLDER PASTE
- Publication number 20240408705
- Publication date Dec 12, 2024
- SENJU METAL INDUSTRY CO., LTD
- Yo YAMADA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder Alloy, Solder Ball, Solder Preform, Solder Paste, and Solder...
- Publication number 20240399512
- Publication date Dec 5, 2024
- SENJU METAL INDUSTRY CO., LTD.
- Takahiro Yokoyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS...
- Publication number 20240389240
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chao-Wei Chiu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER PARTICLES, METHOD FOR PRODUCING SOLDER PARTICLES, AND CONDUC...
- Publication number 20240367270
- Publication date Nov 7, 2024
- Dexerials Corporation
- Hidetsugu NAMIKI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Lead-Free Solder Ball
- Publication number 20240363571
- Publication date Oct 31, 2024
- SENJU METAL INDUSTRY CO., LTD.
- Yoshie Yamanaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joi...
- Publication number 20240342838
- Publication date Oct 17, 2024
- SENJU METAL INDUSTRY CO., LTD.
- Shunsaku YOSHIKAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD ASSEMBLY PROCESS USING MULTIPLE SOLDERS AND A...
- Publication number 20240341040
- Publication date Oct 10, 2024
- Dell Products L.P.
- Subramanian Vasudevan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUX AND SOLDER PASTE
- Publication number 20240278360
- Publication date Aug 22, 2024
- SENJU METAL INDUSTRY CO., LTD
- Yutaka HASHIMOTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING SHEET AND METHOD FOR PRODUCING SAME
- Publication number 20240269780
- Publication date Aug 15, 2024
- NITTO DENKO CORPORATION
- Masatoshi KATO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SPUTTERING TARGET AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240263296
- Publication date Aug 8, 2024
- Chao Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ALLOY
- Publication number 20240247340
- Publication date Jul 25, 2024
- Peter PRENOSIL
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAD-FREE SOLDER PASTE
- Publication number 20240238915
- Publication date Jul 18, 2024
- NIHON SUPERIOR CO., LTD.
- Tetsuro NISHIMURA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joi...
- Publication number 20240238913
- Publication date Jul 18, 2024
- SENJU METAL INDUSTRY CO., LTD.
- Takahiro Yokoyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joi...
- Publication number 20240238912
- Publication date Jul 18, 2024
- SENJU METAL INDUSTRY CO., LTD.
- Takahiro Yokoyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joi...
- Publication number 20240238914
- Publication date Jul 18, 2024
- SENJU METAL INDUSTRY CO., LTD.
- Takahiro Yokoyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ENGINEERED MATERIALS FOR ELECTRONICS ASSEMBLY
- Publication number 20240198460
- Publication date Jun 20, 2024
- Alpha Assembly Solutions Inc.
- Ranjit PANDHER
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING SHEET
- Publication number 20240139887
- Publication date May 2, 2024
- NITTO DENKO CORPORATION
- Ayumi NITTA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL PARTICLE FOR JOINT MATERIAL
- Publication number 20240109156
- Publication date Apr 4, 2024
- NAPRA CO., LTD.
- Shigenobu SEKINE
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SOLDER JOINT
- Publication number 20240109157
- Publication date Apr 4, 2024
- Fuji Electric Co., Ltd.
- Hirohiko WATANABE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAD-FREE SOLDER ALLOY COMPOSITION, SOLDER BALL INCLUDING THE SAME,...
- Publication number 20240100634
- Publication date Mar 28, 2024
- Research & Business Foundation Sungkyunkwan University
- Jaeseok JANG
- B22 - CASTING POWDER METALLURGY
Information Patent Application
CORE MATERIAL, ELECTRONIC COMPONENT AND METHOD FOR FORMING BUMP ELE...
- Publication number 20240100635
- Publication date Mar 28, 2024
- SENJU METAL INDUSTRY CO., LTD.
- Shigeki Kondoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS...
- Publication number 20240107682
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chao-Wei Chiu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER MATERIAL
- Publication number 20240075559
- Publication date Mar 7, 2024
- Fuji Electric Co., Ltd.
- Hirohiko WATANABE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

with the principal constituent melting at less than 400 degrees C

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for step-soldering

Lead-free solder alloy

Solder particles

Light emitting diode for low temperature applications

Flux, solder paste, soldering process, method for producing soldere...

Solder paste

Method of producing a vehicle glass assembly

Lead-free solder compositions

Solder alloy, solder ball, solder paste, and solder joint

Lead-free solder alloy composition suitable for use in high-tempera...

High reliability lead-free solder alloys for harsh environment elec...

Method of producing a vehicle glass assembly

Co-production of lead and tin products

Solder alloy, solder paste, solder ball, solder preform, solder joi...

Electrical connector

Lead-free solder alloy and method of manufacturing electronic devic...

Printed circuit board assembly process using multiple solders and a...

Sn—Cu mixed alloy solder paste, method of making the same and solde...

Solder paste

Flux, solder paste, and electronic circuit board

Metal and tin alloy having low alpha-ray emission, and method for p...

SnBi and SnIn solder alloys

Solder alloy and solder joint

Solder and method for producing high purity lead

Lead-free and halogen-free solder paste

Solder joint part and method for manufacturing the same

Method for producing at least one defined connecting layer between...

Flux and solder paste

Solder alloy, solder paste, solder preform and solder joint

Tin production, which includes a composition comprising tin, lead,...

Patents Applicationslast 30 patents

SOLDER PARTICLES, SOLDER PARTICLE PRODUCTION METHOD, AND CONDUCTIVE...

SOLDER ALLOY, SOLDER JOINT, AND SEMICONDUCTOR PACKAGE INCLUDING SOL...

SOLDER ALLOY, SOLDER JOINT, AND SEMICONDUCTOR PACKAGE INCLUDING SOL...

HIGH RELIABILITY LEAD-FREE SOLDER ALLOYS FOR HARSH ENVIRONMENT ELEC...

Solder Alloy, Solder Ball, Solder Paste, and Solder Joint

JOINED BODY, METHOD OF MANUFACTURING JOINED BODY, AND METHOD OF EVA...

BONDING MATERIAL COMPOSITION, METHOD FOR MANUFACTURING BONDING MATE...

WATER-SOLUBLE FLUX AND SOLDER PASTE

Solder Alloy, Solder Ball, Solder Preform, Solder Paste, and Solder...

MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS...

SOLDER PARTICLES, METHOD FOR PRODUCING SOLDER PARTICLES, AND CONDUC...

Lead-Free Solder Ball

Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joi...

PRINTED CIRCUIT BOARD ASSEMBLY PROCESS USING MULTIPLE SOLDERS AND A...

FLUX AND SOLDER PASTE

BONDING SHEET AND METHOD FOR PRODUCING SAME

SPUTTERING TARGET AND METHOD FOR MANUFACTURING THE SAME

ALLOY

LEAD-FREE SOLDER PASTE

Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joi...

Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joi...

Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joi...

ENGINEERED MATERIALS FOR ELECTRONICS ASSEMBLY

BONDING SHEET

METAL PARTICLE FOR JOINT MATERIAL

SOLDER JOINT

LEAD-FREE SOLDER ALLOY COMPOSITION, SOLDER BALL INCLUDING THE SAME,...

CORE MATERIAL, ELECTRONIC COMPONENT AND METHOD FOR FORMING BUMP ELE...

MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS...

SOLDER MATERIAL