with the stock carried by a movable support for feeding stock into engagement with the cutting blade

Industry

CPC
B28D5/024

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B28Stoneworking B28DWORKING STONE OR STONE-LIKE MATERIALS B28D5/00Fine working of gems, jewels, crystals

Current Industry

B28D5/024with the stock carried by a movable support for feeding stock into engagement with the cutting blade

Industries

Patents Grantslast 30 patents

Information Patent Grant
Processing apparatus
- Patent number 11,820,042
- Issue date Nov 21, 2023
- Disco Corporation
- Kazuki Terada
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Chuck table and processing apparatus including the same
- Patent number 10,870,220
- Issue date Dec 22, 2020
- Disco Corporation
- Kazuma Sekiya
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Semiconductor sawing method and system
- Patent number 10,703,016
- Issue date Jul 7, 2020
- Texas Instruments Incorporated
- Chi-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cutting system and method for a cutting system
- Patent number 10,507,593
- Issue date Dec 17, 2019
- D. SWAROVSKI KG
- Johannes Schweigl
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Workpiece support jig
- Patent number 10,297,488
- Issue date May 21, 2019
- Disco Corporation
- Takeomi Fukuoka
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Singulation apparatus and method
- Patent number 9,508,570
- Issue date Nov 29, 2016
- ASM Technology Singapore Pte. Ltd.
- Chi Wah Cheng
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Methods for separating electronic components utilizing a manipulato...
- Patent number 8,677,592
- Issue date Mar 25, 2014
- Fico B.V.
- Frederik Hendrik In't Veld
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for manufacturing seeds for polycrystalline silicon manuf...
- Patent number 8,425,279
- Issue date Apr 23, 2013
- Misubishi Polycrystalline Silicon America Corporation (MIPSA)
- Larry Gurley
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Substrate dividing system, substrate manufacturing equipment, subst...
- Patent number 7,770,500
- Issue date Aug 10, 2010
- Mitsuboshi Diamond Industrial Co., Ltd.
- Yoshitaka Nishio
- B27 - WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL NAILING OR STAPLING MACH...
Information Patent Grant
Dicing saw with variable indexing capability
- Patent number 7,387,119
- Issue date Jun 17, 2008
- Micron Technology, Inc.
- Salman Akram
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Cutting machine
- Patent number 7,338,345
- Issue date Mar 4, 2008
- Disco Corporation
- Koichi Fujinami
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Cutting machine for plate-shaped material
- Patent number 7,316,174
- Issue date Jan 8, 2008
- Disco Corporation
- Kazuma Sekiya
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method of processing a semiconductor wafer
- Patent number 6,944,370
- Issue date Sep 13, 2005
- Disco Corporation
- Kazuma Sekiya
- B24 - GRINDING POLISHING
Information Patent Grant
Method for sawing wafers employing multiple indexing techniques for...
- Patent number 6,932,077
- Issue date Aug 23, 2005
- Micron Technology, Inc.
- Salman Akram
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method for sawing wafers employing multiple indexing techniques for...
- Patent number 6,897,571
- Issue date May 24, 2005
- Micron Technology, Inc.
- Salman Akram
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Cutting machine
- Patent number 6,776,078
- Issue date Aug 17, 2004
- Disco Corporation
- Takayuki Gawazawa
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Dicing machine
- Patent number 6,743,076
- Issue date Jun 1, 2004
- Tokyo Seimitsu Co., Ltd.
- Tadashi Adachi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cutting apparatus and cutting method
- Patent number 6,736,703
- Issue date May 18, 2004
- Towa Corporation
- Michio Osada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dicing machine
- Patent number 6,729,215
- Issue date May 4, 2004
- Tokyo Seimitsu Co., Ltd.
- Osamu Nishina
- B27 - WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL NAILING OR STAPLING MACH...
Information Patent Grant
Method for sawing wafers employing multiple indexing techniques for...
- Patent number 6,691,696
- Issue date Feb 17, 2004
- Micron Technology, Inc.
- Salman Akram
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Sawing method employing multiple indexing techniques and semiconduc...
- Patent number 6,687,990
- Issue date Feb 10, 2004
- Micron Technology, Inc.
- Salman Akram
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Vertical wafer sawing apparatus
- Patent number 6,662,799
- Issue date Dec 16, 2003
- Samsung Electronics Co., Ltd.
- Dong-Kuk Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for sawing wafers employing multiple indexing techniques...
- Patent number 6,631,662
- Issue date Oct 14, 2003
- Micron Technology, Inc.
- Salman Akram
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Dual-cutting method devoid of useless strokes
- Patent number 6,606,985
- Issue date Aug 19, 2003
- Disco Corporation
- Katsuharu Negishi
- B27 - WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL NAILING OR STAPLING MACH...
Information Patent Grant
Cutting machine
- Patent number 6,581,586
- Issue date Jun 24, 2003
- Disco Corporation
- Kazuma Sekiya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for sawing wafers employing multiple indexing techniques for...
- Patent number 6,578,458
- Issue date Jun 17, 2003
- Micron Technology, Inc.
- Salman Akram
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Cutting machine
- Patent number 6,568,385
- Issue date May 27, 2003
- Disco Corporation
- Kazuma Sekiya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dicing method
- Patent number 6,498,075
- Issue date Dec 24, 2002
- Disco Corporation
- Kouji Fujimoto
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method for sawing wafers employing multiple indexing techniques for...
- Patent number 6,493,934
- Issue date Dec 17, 2002
- Salman Akram
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Work cutting apparatus and work cutting method
- Patent number 6,463,920
- Issue date Oct 15, 2002
- Sumitomo Special Metals Co., Ltd.
- Sadahiko Kondo
- B28 - WORKING CEMENT, CLAY, OR STONE

Patents Applicationslast 30 patents

Information Patent Application
PROCESSING APPARATUS
- Publication number 20210107180
- Publication date Apr 15, 2021
- Disco Corporation
- Kazuki TERADA
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Semiconductor Sawing Method and System
- Publication number 20190389091
- Publication date Dec 26, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Chi-Hung Chen
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
CHUCK TABLE AND PROCESSING APPARATUS INCLUDING THE SAME
- Publication number 20190275700
- Publication date Sep 12, 2019
- Disco Corporation
- Kazuma Sekiya
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
CUTTING BLADE DETECTING MECHANISM FOR CUTTING APPARATUS
- Publication number 20180333895
- Publication date Nov 22, 2018
- Disco Corporation
- Satoshi Sawaki
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
CUTTING SYSTEM AND METHOD FOR A CUTTING SYSTEM
- Publication number 20180104852
- Publication date Apr 19, 2018
- D. SWAROVSKI KG
- Johannes Schweigl
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
CUTTING APPARATUS
- Publication number 20160271835
- Publication date Sep 22, 2016
- Disco Corporation
- Takuya Kato
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF CUTTING A MOTHER SUBSTRATE [as amended]
- Publication number 20130042735
- Publication date Feb 21, 2013
- Sang-Hyung Lim
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
Saw For Cutting Silicon Into Seed Rods For Use In A Chemical Vapor...
- Publication number 20130014738
- Publication date Jan 17, 2013
- MEMC ELECTRONIC MATERIALS SPA
- Paolo Molino
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
APPARATUS FOR MANUFACTURING SEEDS FOR POLYCRYSTALLINE SILICON MANUF...
- Publication number 20100077897
- Publication date Apr 1, 2010
- Mitsubishi Polycrystalline Silicon America Corporation
- Larry Gurley
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Mother substrate cutting apparatus, method of cutting a mother subs...
- Publication number 20100011925
- Publication date Jan 21, 2010
- Sang-Hyung Lim
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Device and Method for Separating Electronic Components
- Publication number 20080289165
- Publication date Nov 27, 2008
- Fico Singulation B.V.
- Frederik Hendrik In't Veld
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DRIVING MECHANISM AND CUTTING APPARATUS HAVING THE DRIVING MECHANISM
- Publication number 20080210028
- Publication date Sep 4, 2008
- Disco Corporation
- Seishi Sato
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Substrate Dividing System, Substrate Manufacturing Equipment, Subst...
- Publication number 20070281444
- Publication date Dec 6, 2007
- MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD.
- Yoshitaka Nishio
- B27 - WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL NAILING OR STAPLING MACH...
Information Patent Application
Sawing Apparatus and a Control Method for Manufacturing Processes o...
- Publication number 20070259483
- Publication date Nov 8, 2007
- Hanmi Semiconductor Co., Ltd.
- Yong-Goo Lee
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Dicing apparatus and dicing method
- Publication number 20070087661
- Publication date Apr 19, 2007
- TOKYO SEIMITSU CO., LTD.
- Masanobu KOYATA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Group encapsulated dicing chuck
- Publication number 20070068504
- Publication date Mar 29, 2007
- Warren M. Farnworth
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Group encapsulated dicing chuck
- Publication number 20070062511
- Publication date Mar 22, 2007
- Warren M. Farnworth
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Cutting machine
- Publication number 20060112802
- Publication date Jun 1, 2006
- DISCO CORPORATION
- Koichi Fujinami
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Group encapsulated dicing chuck
- Publication number 20060065262
- Publication date Mar 30, 2006
- Warren M. Farnworth
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Dicing saw with variable indexing capability
- Publication number 20050211236
- Publication date Sep 29, 2005
- Salman Akram
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Group encapsulated dicing chuck
- Publication number 20050186761
- Publication date Aug 25, 2005
- Warren M. Farnworth
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Cutting machine for plate-shaped material
- Publication number 20050136801
- Publication date Jun 23, 2005
- Kazuma Sekiya
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Finishing machine using laser beam
- Publication number 20040164061
- Publication date Aug 26, 2004
- Masaya Takeuchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of processing a semiconductor wafer
- Publication number 20040115903
- Publication date Jun 17, 2004
- Kazuma Sekiya
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Method for sawing wafers employing multiple indexing techniques for...
- Publication number 20040089282
- Publication date May 13, 2004
- Salman Akram
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Group encapsulated dicing chuck
- Publication number 20040031476
- Publication date Feb 19, 2004
- Warren M. Farnworth
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Cutting machine
- Publication number 20030070520
- Publication date Apr 17, 2003
- Takayuki Gawazawa
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Method for sawing wafers employing multiple indexing techniques for...
- Publication number 20030030122
- Publication date Feb 13, 2003
- Salman Akram
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Sawing method employing multiple indexing techniques and semiconduc...
- Publication number 20020194968
- Publication date Dec 26, 2002
- Salman Akram
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Group encapsulated dicing chuck
- Publication number 20020185121
- Publication date Dec 12, 2002
- Warren M. Farnworth
- B28 - WORKING CEMENT, CLAY, OR STONE

with the stock carried by a movable support for feeding stock into engagement with the cutting blade

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Processing apparatus

Chuck table and processing apparatus including the same

Semiconductor sawing method and system

Cutting system and method for a cutting system

Workpiece support jig

Singulation apparatus and method

Methods for separating electronic components utilizing a manipulato...

Apparatus for manufacturing seeds for polycrystalline silicon manuf...

Substrate dividing system, substrate manufacturing equipment, subst...

Dicing saw with variable indexing capability

Cutting machine

Cutting machine for plate-shaped material

Method of processing a semiconductor wafer

Method for sawing wafers employing multiple indexing techniques for...

Method for sawing wafers employing multiple indexing techniques for...

Cutting machine

Dicing machine

Cutting apparatus and cutting method

Dicing machine

Method for sawing wafers employing multiple indexing techniques for...

Sawing method employing multiple indexing techniques and semiconduc...

Vertical wafer sawing apparatus

Apparatus for sawing wafers employing multiple indexing techniques...

Dual-cutting method devoid of useless strokes

Cutting machine

Method for sawing wafers employing multiple indexing techniques for...

Cutting machine

Dicing method

Method for sawing wafers employing multiple indexing techniques for...

Work cutting apparatus and work cutting method

Patents Applicationslast 30 patents

PROCESSING APPARATUS

Semiconductor Sawing Method and System

CHUCK TABLE AND PROCESSING APPARATUS INCLUDING THE SAME

CUTTING BLADE DETECTING MECHANISM FOR CUTTING APPARATUS

CUTTING SYSTEM AND METHOD FOR A CUTTING SYSTEM

CUTTING APPARATUS

METHOD OF CUTTING A MOTHER SUBSTRATE [as amended]

Saw For Cutting Silicon Into Seed Rods For Use In A Chemical Vapor...

APPARATUS FOR MANUFACTURING SEEDS FOR POLYCRYSTALLINE SILICON MANUF...

Mother substrate cutting apparatus, method of cutting a mother subs...

Device and Method for Separating Electronic Components

DRIVING MECHANISM AND CUTTING APPARATUS HAVING THE DRIVING MECHANISM

Substrate Dividing System, Substrate Manufacturing Equipment, Subst...

Sawing Apparatus and a Control Method for Manufacturing Processes o...

Dicing apparatus and dicing method

Group encapsulated dicing chuck

Group encapsulated dicing chuck

Cutting machine

Group encapsulated dicing chuck

Dicing saw with variable indexing capability

Group encapsulated dicing chuck

Cutting machine for plate-shaped material

Finishing machine using laser beam

Method of processing a semiconductor wafer

Method for sawing wafers employing multiple indexing techniques for...

Group encapsulated dicing chuck

Cutting machine

Method for sawing wafers employing multiple indexing techniques for...

Sawing method employing multiple indexing techniques and semiconduc...

Group encapsulated dicing chuck