within server blades for removing heat from heat source

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CPC
H05K7/20772

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K7/00Constructional details common to different types of electric apparatus

Current Industry

H05K7/20772within server blades for removing heat from heat source

Industries

Patents Grantslast 30 patents

Information Patent Grant
Heat exchange assembly for an electrical device
- Patent number 12,225,692
- Issue date Feb 11, 2025
- TE CONNECTIVITY SOLUTIONS GmbH
- Alex Michael Sharf
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reverse-return parallel loop thermal management system for an elect...
- Patent number 12,219,740
- Issue date Feb 4, 2025
- Advanced Liquid Cooling Technologies Inc.
- Nan Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Configurable cold-plates of datacenter cooling systems
- Patent number 12,213,281
- Issue date Jan 28, 2025
- NVIDIA Corporation
- Ali Heydari
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Self cooling adaptive flow branching heat exchanger system for cool...
- Patent number 12,213,288
- Issue date Jan 28, 2025
- Intel Corporation
- Prabhakar Subrahmanyam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cam system for liquid cooled computing system
- Patent number 12,207,440
- Issue date Jan 21, 2025
- ZT GROUP INT'L, INC.
- Chen An
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Intelligent and integrated liquid-cooled rack for datacenters
- Patent number 12,200,913
- Issue date Jan 14, 2025
- NVIDIA Corporation
- Ali Heydari
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Liquid cooling distribution in a modular electronic system
- Patent number 12,200,906
- Issue date Jan 14, 2025
- Cisco Technology, Inc.
- Rakesh Chopra
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and extraction system for extracting an electronic device fr...
- Patent number 12,200,901
- Issue date Jan 14, 2025
- OVH
- Ali Chehade
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Immersion cooling system and immersion cooling method
- Patent number 12,200,904
- Issue date Jan 14, 2025
- Delta Electronics, Inc.
- Wei-Chih Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid pumping units, and related systems and methods
- Patent number 12,193,193
- Issue date Jan 7, 2025
- CoolIT Systems, Inc.
- Sebastian Varela Benitez
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Configurable cold-plates of datacenter cooling systems
- Patent number 12,185,495
- Issue date Dec 31, 2024
- NVIDIA Corporation
- Ali Heydari
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid cooling manifold for information technology equipment
- Patent number 12,185,496
- Issue date Dec 31, 2024
- Dell Products, L.P.
- William Kenneth Coxe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rack system for housing at least one immersion case
- Patent number 12,167,568
- Issue date Dec 10, 2024
- OVH
- Gregory Francis Louis Bauchart
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Cooling system and electronic device
- Patent number 12,167,578
- Issue date Dec 10, 2024
- NEC Platforms, Ltd.
- Satoshi Isoya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Devices, systems, and methods for a hybrid cooling system
- Patent number 12,156,383
- Issue date Nov 26, 2024
- Microsoft Technology Licensing, LLC
- Brandon Earl Gary
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rack system for housing an electronic device
- Patent number 12,156,370
- Issue date Nov 26, 2024
- OVH
- Ali Chehade
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
System comprising a rack, with support members and components inser...
- Patent number 12,156,362
- Issue date Nov 26, 2024
- OVH
- Jules Hermann Bonenfant
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and systems for fluid immersion cooling
- Patent number 12,156,371
- Issue date Nov 26, 2024
- CGG SERVICES SAS
- Laurent Clerc
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid submerged, horizontal computer server rack and systems and m...
- Patent number 12,150,282
- Issue date Nov 19, 2024
- GREEN REVOLUTION COOLING, INC.
- Christiaan Scott Best
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Data center rack system with integrated liquid and dielectric immer...
- Patent number 12,144,145
- Issue date Nov 12, 2024
- OVH
- Ali Chehade
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Cooling system and electronic device
- Patent number 12,137,538
- Issue date Nov 5, 2024
- NEC Platforms, Ltd.
- Yasuhito Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic module
- Patent number 12,136,576
- Issue date Nov 5, 2024
- Peter C. Salmon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling mass and spring element for low insertion force hot swappab...
- Patent number 12,133,368
- Issue date Oct 29, 2024
- Intel Corporation
- Hardeep Singh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat dissipation device and server including a fixing bracket and h...
- Patent number 12,089,376
- Issue date Sep 10, 2024
- Huawei Technologies Co., Ltd.
- Guidong Song
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Server and cooling system for enhanced immersion cooling
- Patent number 12,089,366
- Issue date Sep 10, 2024
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 12,082,371
- Issue date Sep 3, 2024
- NEC Platforms, Ltd.
- Satoshi Isoya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
IT cooling enclosures for energy storage backup systems
- Patent number 12,048,117
- Issue date Jul 23, 2024
- BAIDU USA LLC
- Tianyi Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flow-through, hot-spot-targeting immersion cooling assembly
- Patent number 12,048,118
- Issue date Jul 23, 2024
- Jetcool Technologies Inc.
- Bernard Malouin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling system and cooling device
- Patent number 12,029,007
- Issue date Jul 2, 2024
- Wistron Corporation
- Hua Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chassis cooling resource
- Patent number 12,029,016
- Issue date Jul 2, 2024
- Hewlett Packard Enterprise Development LP
- John P. Franz
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
COMPUTING SYSTEM WITH COOLING CONFIGURATION
- Publication number 20250053208
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Sungeun JO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC DEVICE AND IMMERSION COOLING SYSTEM
- Publication number 20250056751
- Publication date Feb 13, 2025
- PURPLE CLOUD DEVELOPMENT PTE. LTD.
- Yu-Lun HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING ELEMENT TYPE DETERMINATION AND CONTROL
- Publication number 20250053212
- Publication date Feb 13, 2025
- LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD.
- Robert R. Wolford
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FLEXIBLE LIQUID COOLING HEAT DISSIPATION UNIT
- Publication number 20250048590
- Publication date Feb 6, 2025
- Huawei Technologies Co., Ltd
- Min LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CABINET AND DATA CENTER COMPUTER ROOM
- Publication number 20250048599
- Publication date Feb 6, 2025
- Hebei Qinhuai Data Co., Limited.
- Binghua ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND SERVER
- Publication number 20250048600
- Publication date Feb 6, 2025
- xFusion Digital Technologies Co., Ltd
- Chenglong Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING MASS AND SPRING ELEMENT FOR LOW INSERTION FORCE HOT SWAPPAB...
- Publication number 20250024647
- Publication date Jan 16, 2025
- Intel Corporation
- Hardeep SINGH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NODE UNIT, ELECTRONIC DEVICE AND IMMERSION COOLING TYPE EQUIPMENT
- Publication number 20250016964
- Publication date Jan 9, 2025
- ASUSTek COMPUTER INC.
- Yu-Wen Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
System and methods for the individual immersion cooling of hardware...
- Publication number 20250008686
- Publication date Jan 2, 2025
- LIQOMI B.V.
- Christianus Theodorus DE KLEIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR SERVER LEVEL COOLING
- Publication number 20250008698
- Publication date Jan 2, 2025
- ADVANCED MICRO DEVICES, INC.
- Girish Anant Kini
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SERVER COOLING WITH IMMERSED HEAT SINK
- Publication number 20240431070
- Publication date Dec 26, 2024
- Carrier Corporation
- Arindom Joardar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID COOLING PLATE AND SERVER
- Publication number 20240414879
- Publication date Dec 12, 2024
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Jiang-jun WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
JOINT MODULE AND COMPUTING DEVICE
- Publication number 20240414872
- Publication date Dec 12, 2024
- Fulian Precision Electronics (Tianjin) Co., LTD.
- CHANG-JU WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SERVER WITH HYBRID THERMAL MANAGEMENT SYSTEM
- Publication number 20240414873
- Publication date Dec 12, 2024
- Carrier Corporation
- Arindom Joardar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID COOLING PLATE ASSEMBLY AND SERVER
- Publication number 20240414890
- Publication date Dec 12, 2024
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Jiang-jun WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
JOINT MODULE AND SERVER SYSTEM
- Publication number 20240414891
- Publication date Dec 12, 2024
- Fulian Precision Electronics (Tianjin) Co., LTD.
- CHANG-JU WU
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
SERVER DEVICE AND COOLING APPARATUS
- Publication number 20240407131
- Publication date Dec 5, 2024
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Jiaqing JI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Sealed Rack Server Unit
- Publication number 20240407139
- Publication date Dec 5, 2024
- Nexalus Limited
- Richard Jenkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID COOLING DEVICE AND SERVER
- Publication number 20240397673
- Publication date Nov 28, 2024
- Fulian Precision Electronics (Tianjin) Co., LTD.
- YU-CHIA TING
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION APPARATUS AND SERVER
- Publication number 20240389262
- Publication date Nov 21, 2024
- Huawei Technologies Co., Ltd
- Dingfang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DUAL LIQUID PUMP LIQUID COOLING RADIATOR AND LIQUID COOLING HEAT DI...
- Publication number 20240389275
- Publication date Nov 21, 2024
- Tsung-Hsien Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIRECTING COOLANT TO FLOW TOWARD HEAT SINKS OF ELECTRIC COMPONENTS...
- Publication number 20240381585
- Publication date Nov 14, 2024
- SUPER MICRO COMPUTER, INC.
- Yi-Kuan LIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SERVER COOLING USING SPRAYED FLUID AND HIGH CONDUCTIVITY GAS OR AIR
- Publication number 20240381571
- Publication date Nov 14, 2024
- Microsoft Technology Licensing, LLC
- Hariharan KUMAR
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC APPARATUS AND COOLING SYSTEM FOR HEAT DISSIPATION OF HEA...
- Publication number 20240381575
- Publication date Nov 14, 2024
- Wiwynn Corporation
- Chun-Wei Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL MANAGEMENT SYSTEMS WITH ACOUSTIC ISOLATION
- Publication number 20240379084
- Publication date Nov 14, 2024
- NVIDIA Corporation
- William Mecham
- G10 - MUSICAL INSTRUMENTS ACOUSTICS
Information Patent Application
IMMERSION COOLING USING COOLING CONTAINERS FOR AN ELECTRONIC DEVICE
- Publication number 20240365502
- Publication date Oct 31, 2024
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP.
- Ching-Chun Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMBINED AIR-COOLING AND LIQUID-COOLING REFRIGERATION SYSTEM AND DA...
- Publication number 20240357771
- Publication date Oct 24, 2024
- Hebei Qinhuai Data Co., Limited.
- Binghua ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DATA CENTER COOLING SYSTEM AND DATA CENTER
- Publication number 20240357772
- Publication date Oct 24, 2024
- Beijing Bytedance Network Technology Co., Ltd.
- Tangbo Jing
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING MODULE AND COMPUTING DEVICE
- Publication number 20240357773
- Publication date Oct 24, 2024
- Huawei Technologies Co., Ltd
- Zelong JIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTAINERIZED SINGLE-PHASE LIQUID IMMERSION COOLING SYSTEM
- Publication number 20240349449
- Publication date Oct 17, 2024
- Hangzhou Dare Rouhan Technology Co., Ltd.
- Minghui SUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

within server blades for removing heat from heat source

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Heat exchange assembly for an electrical device

Reverse-return parallel loop thermal management system for an elect...

Configurable cold-plates of datacenter cooling systems

Self cooling adaptive flow branching heat exchanger system for cool...

Cam system for liquid cooled computing system

Intelligent and integrated liquid-cooled rack for datacenters

Liquid cooling distribution in a modular electronic system

Method and extraction system for extracting an electronic device fr...

Immersion cooling system and immersion cooling method

Liquid pumping units, and related systems and methods

Configurable cold-plates of datacenter cooling systems

Liquid cooling manifold for information technology equipment

Rack system for housing at least one immersion case

Cooling system and electronic device

Devices, systems, and methods for a hybrid cooling system

Rack system for housing an electronic device

System comprising a rack, with support members and components inser...

Methods and systems for fluid immersion cooling

Liquid submerged, horizontal computer server rack and systems and m...

Data center rack system with integrated liquid and dielectric immer...

Cooling system and electronic device

Microelectronic module

Cooling mass and spring element for low insertion force hot swappab...

Heat dissipation device and server including a fixing bracket and h...

Server and cooling system for enhanced immersion cooling

Electronic device

IT cooling enclosures for energy storage backup systems

Flow-through, hot-spot-targeting immersion cooling assembly

Cooling system and cooling device

Chassis cooling resource

Patents Applicationslast 30 patents

COMPUTING SYSTEM WITH COOLING CONFIGURATION

ELECTRONIC DEVICE AND IMMERSION COOLING SYSTEM

COOLING ELEMENT TYPE DETERMINATION AND CONTROL

FLEXIBLE LIQUID COOLING HEAT DISSIPATION UNIT

INTEGRATED CABINET AND DATA CENTER COMPUTER ROOM

ELECTRONIC DEVICE AND SERVER

COOLING MASS AND SPRING ELEMENT FOR LOW INSERTION FORCE HOT SWAPPAB...

NODE UNIT, ELECTRONIC DEVICE AND IMMERSION COOLING TYPE EQUIPMENT

System and methods for the individual immersion cooling of hardware...

SYSTEMS AND METHODS FOR SERVER LEVEL COOLING

SERVER COOLING WITH IMMERSED HEAT SINK

LIQUID COOLING PLATE AND SERVER

JOINT MODULE AND COMPUTING DEVICE

SERVER WITH HYBRID THERMAL MANAGEMENT SYSTEM

LIQUID COOLING PLATE ASSEMBLY AND SERVER

JOINT MODULE AND SERVER SYSTEM

SERVER DEVICE AND COOLING APPARATUS

Sealed Rack Server Unit

LIQUID COOLING DEVICE AND SERVER

HEAT DISSIPATION APPARATUS AND SERVER

DUAL LIQUID PUMP LIQUID COOLING RADIATOR AND LIQUID COOLING HEAT DI...

DIRECTING COOLANT TO FLOW TOWARD HEAT SINKS OF ELECTRIC COMPONENTS...

SERVER COOLING USING SPRAYED FLUID AND HIGH CONDUCTIVITY GAS OR AIR

ELECTRONIC APPARATUS AND COOLING SYSTEM FOR HEAT DISSIPATION OF HEA...

THERMAL MANAGEMENT SYSTEMS WITH ACOUSTIC ISOLATION

IMMERSION COOLING USING COOLING CONTAINERS FOR AN ELECTRONIC DEVICE

COMBINED AIR-COOLING AND LIQUID-COOLING REFRIGERATION SYSTEM AND DA...

DATA CENTER COOLING SYSTEM AND DATA CENTER

COOLING MODULE AND COMPUTING DEVICE

CONTAINERIZED SINGLE-PHASE LIQUID IMMERSION COOLING SYSTEM