within sub-racks for removing heat from electronic boards

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H05K7/20563

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K7/00Constructional details common to different types of electric apparatus

Current Industry

H05K7/20563within sub-racks for removing heat from electronic boards

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Casing and electronic device
- Patent number 12,167,576
- Issue date Dec 10, 2024
- ZTE Corporation
- Zhifeng Zhu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Heat dissipation subrack, heat dissipation cabinet, and backplane c...
- Patent number 12,096,592
- Issue date Sep 17, 2024
- Xi'an Zhongxing New Software Co., Ltd.
- Jun Wei
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Modular intelligent electronic device (IED) with convection cooling
- Patent number 12,062,906
- Issue date Aug 13, 2024
- HITACHI ENERGY LTD
- Fredrik Alfredsson
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Front-to-rear airflow assembly for an equipment casing mounted on a...
- Patent number 11,997,829
- Issue date May 28, 2024
- Ciena Corporation
- Simon J. E. Shearman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Data storage cooling module
- Patent number 11,925,004
- Issue date Mar 5, 2024
- Sanmina Corporation
- Odie Banks Killen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic assembly having sealing retainer coupling an electronic...
- Patent number 11,895,806
- Issue date Feb 6, 2024
- Eagle Technology, LLC
- Voi Nguyen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Air flow control in data storage systems
- Patent number 11,737,245
- Issue date Aug 22, 2023
- Seagate Technology LLC
- Angel Castillo de la Cruz
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Heat dissipation case
- Patent number 11,612,078
- Issue date Mar 21, 2023
- Fulian Precision Electronics (Tianjin) Co., LTD.
- Tung-Ho Shih
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for generating in a graphical user interface a...
- Patent number 11,570,934
- Issue date Jan 31, 2023
- SCHNEIDER ELECTRIC IT CORPORATION
- James William VanGilder
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat sink and printed circuit board arrangements for data storage s...
- Patent number 11,516,941
- Issue date Nov 29, 2022
- Seagate Technology LLC
- Mohamad El-Batal
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal management of printed circuit board components
- Patent number 11,284,540
- Issue date Mar 22, 2022
- Elbit Systems Ltd.
- Oleg Naigertsik
- D03 - WEAVING
Information Patent Grant
Systems and methods for generating in a graphical user interface a...
- Patent number 11,246,240
- Issue date Feb 8, 2022
- SCHNEIDER ELECTRIC IT CORPORATION
- James William VanGilder
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Equipment shelf
- Patent number 11,212,941
- Issue date Dec 28, 2021
- Astec International Limited
- Angelito Hatol
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Programmable AC power distribution device
- Patent number 10,925,173
- Issue date Feb 16, 2021
- CHYNG HONG ELECTRONIC CO., LTD.
- Mu-Chun Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilevel enclosure cooling
- Patent number 10,856,436
- Issue date Dec 1, 2020
- Seagate Technology LLC
- Kevin Lee Van Pelt
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Airflow characterization system
- Patent number 10,827,651
- Issue date Nov 3, 2020
- Dell Products L.P.
- Hasnain Shabbir
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for housing electronic equipment and increasin...
- Patent number 10,806,048
- Issue date Oct 13, 2020
- BlackHawk Labs LLC
- Tod A. Wagner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for detecting a level of dirtiness of a filter ma...
- Patent number 10,775,318
- Issue date Sep 15, 2020
- Xieon Networks S.a.r.l.
- Lutz Rapp
- G01 - MEASURING TESTING
Information Patent Grant
Radio remote unit and communications device
- Patent number 10,757,832
- Issue date Aug 25, 2020
- Huawei Technologies Co., Ltd.
- Weifeng Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single plate heat radiation device and method
- Patent number 10,743,402
- Issue date Aug 11, 2020
- ZTE Corporation
- Zhan Su
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Base station interface device of distributed antenna system
- Patent number 10,559,869
- Issue date Feb 11, 2020
- SOLID, INC.
- Dongwon Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for installing an insert for fluid-flow-through cooling of...
- Patent number 10,548,243
- Issue date Jan 28, 2020
- Lockheed Martin Corporation
- Brian W. Kaplun
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal management via active surfaces
- Patent number 10,440,860
- Issue date Oct 8, 2019
- EMC IP Holding Company LLC
- Jean-Philippe Fricker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Modular electrical system
- Patent number 10,433,456
- Issue date Oct 1, 2019
- Coriant Oy
- Antti Holma
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Optical module heatsink lifter and method
- Patent number 10,401,581
- Issue date Sep 3, 2019
- Ciena Corporation
- Adrianus Van Gaal
- G02 - OPTICS
Information Patent Grant
Integrated cell site module for mounting a remote radio unit and ra...
- Patent number 10,390,386
- Issue date Aug 20, 2019
- CommScope Technologies LLC
- Walter Mark Hendrix
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Process for making an apparatus with fluid-flow-through cooling of...
- Patent number 10,362,713
- Issue date Jul 23, 2019
- Lockheed Martin Corporation
- Brian W. Kaplun
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus, system, and method for directing air in a storage-system...
- Patent number 10,349,554
- Issue date Jul 9, 2019
- Facebook, Inc.
- Jason David Adrian
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for housing electronic equipment and increasin...
- Patent number 10,321,598
- Issue date Jun 11, 2019
- BlackHawk Labs LLC
- Tod A. Wagner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Enhanced cooling design for computing device
- Patent number 10,306,807
- Issue date May 28, 2019
- International Business Machines Corporation
- William J. Anderl
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
COMPOSITE HEAT DISSIPATION DEVICE
- Publication number 20240268081
- Publication date Aug 8, 2024
- TAIWAN MICROLOOPS CORP.
- Chun-Hung LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Front-to-rear airflow assembly for an equipment casing mounted on a...
- Publication number 20240114665
- Publication date Apr 4, 2024
- CIENA CORPORATION
- Simon J. E. Shearman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ENHANCED AVIONICS RACK MODULE
- Publication number 20240081028
- Publication date Mar 7, 2024
- Airbus Operations SAS
- Bernardo ARMERO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Liquid cooling high-density pluggable modules for a network element
- Publication number 20240049434
- Publication date Feb 8, 2024
- CIENA CORPORATION
- Behzad Mohajer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC ASSEMBLY HAVING SEALING RETAINER COUPLING AN ELECTRONIC...
- Publication number 20230354559
- Publication date Nov 2, 2023
- Eagle Technology, LLC
- VOI NGUYEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DATA STORAGE COOLING MODULE
- Publication number 20230232592
- Publication date Jul 20, 2023
- Sanmina Corporation
- Odie Banks Killen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CASING AND ELECTRONIC DEVICE
- Publication number 20230225089
- Publication date Jul 13, 2023
- ZTE CORPORATION
- Zhifeng ZHU
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Front-to-rear airflow assembly for an equipment casing mounted on a...
- Publication number 20220418164
- Publication date Dec 29, 2022
- CIENA CORPORATION
- Simon J. E. Shearman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR GENERATING IN A GRAPHICAL USER INTERFACE A...
- Publication number 20220151109
- Publication date May 12, 2022
- SCHNEIDER ELECTRIC IT CORPORATION
- James William VanGilder
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT SINK AND PRINTED CIRCUIT BOARD ARRANGEMENTS FOR DATA STORAGE S...
- Publication number 20220095487
- Publication date Mar 24, 2022
- SEAGATE TECHNOLOGY LLC
- Mohamad El-Batal
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION CASE
- Publication number 20220071062
- Publication date Mar 3, 2022
- HONGFUJIN PRECISION ELECTRONICS(TIANJIN)CO.,LTD.
- TUNG-HO SHIH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Equipment Shelf
- Publication number 20210378146
- Publication date Dec 2, 2021
- Astec International Limited
- Angelito HATOL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
AIR FLOW CONTROL IN DATA STORAGE SYSTEMS
- Publication number 20210267091
- Publication date Aug 26, 2021
- SEAGATE TECHNOLOGY LLC
- Angel Castillo de la Cruz
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Application
SYSTEMS AND METHODS FOR GENERATING IN A GRAPHICAL USER INTERFACE A...
- Publication number 20210185858
- Publication date Jun 17, 2021
- SCHNEIDER ELECTRIC IT CORPORATION
- James William VanGilder
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILEVEL ENCLOSURE COOLING
- Publication number 20200253084
- Publication date Aug 6, 2020
- SEAGATE TECHNOLOGY LLC
- Kevin Lee Van Pelt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL MANAGEMENT OF PRINTED CIRCUIT BOARD COMPONENTS
- Publication number 20200245502
- Publication date Jul 30, 2020
- Elbit Systems Ltd.
- Oleg Naigertsik
- D03 - WEAVING
Information Patent Application
AIRFLOW CHARACTERIZATION SYSTEM
- Publication number 20200037464
- Publication date Jan 30, 2020
- Dell Products L.P.
- Hasnain Shabbir
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD FOR HOUSING ELECTRONIC EQUIPMENT AND INCREASIN...
- Publication number 20190297742
- Publication date Sep 26, 2019
- BlackHawk Labs LLC
- TOD A. WAGNER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Radio Remote Unit and Communications Device
- Publication number 20190230815
- Publication date Jul 25, 2019
- Huawei Technologies Co., Ltd
- Weifeng Hu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SYSTEM AND METHOD FOR DETECTING A LEVEL OF DIRTINESS OF A FILTER MA...
- Publication number 20190128820
- Publication date May 2, 2019
- Xieon Networks S.a.r.l.
- Lutz RAPP
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
APPARATUS, SYSTEM, AND METHOD FOR DIRECTING AIR IN A STORAGE-SYSTEM...
- Publication number 20190069440
- Publication date Feb 28, 2019
- FACEBOOK, INC.
- Jason David Adrian
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING SYSTEM FOR AN ELECTRONICS ENCLOSURE
- Publication number 20180310437
- Publication date Oct 25, 2018
- International Business Machines Corporation
- William J. ANDERL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BASE STATION INTERFACE DEVICE OF DISTRIBUTED ANTENNA SYSTEM
- Publication number 20180254539
- Publication date Sep 6, 2018
- SOLiD, INC.
- Dongwon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Enhanced Cooling Design for Computing Device
- Publication number 20180213683
- Publication date Jul 26, 2018
- International Business Machines Corporation
- William J. Anderl
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED CELL SITE SECTOR MODULE
- Publication number 20180176985
- Publication date Jun 21, 2018
- CommScope Technologies LLC
- Walter Mark Hendrix
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL MANAGEMENT OF PRINTED CIRCUIT BOARD COMPONENTS
- Publication number 20170359921
- Publication date Dec 14, 2017
- Elbit Systems Ltd.
- Oleg Naigertsik
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT RELAY NETWORK SYSTEM FOR TELECOMMUNICATION EQUIPMENT
- Publication number 20170196123
- Publication date Jul 6, 2017
- Infinera Corp.
- Matthew James Kelty
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUID-FLOW-THROUGH COOLING OF CIRCUIT BOARDS
- Publication number 20160278240
- Publication date Sep 22, 2016
- Lockheed Martin Corporation
- Brian W. Kaplun
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUID-FLOW-THROUGH COOLING OF CIRCUIT BOARDS
- Publication number 20160278241
- Publication date Sep 22, 2016
- Lockheed Martin Corporation
- Brian W. Kaplun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-DENSITY RACK UNIT SYSTEMS AND METHODS
- Publication number 20140369001
- Publication date Dec 18, 2014
- Menara Networks, Inc..
- Daniel L. Miller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

within sub-racks for removing heat from electronic boards

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Casing and electronic device

Heat dissipation subrack, heat dissipation cabinet, and backplane c...

Modular intelligent electronic device (IED) with convection cooling

Front-to-rear airflow assembly for an equipment casing mounted on a...

Data storage cooling module

Electronic assembly having sealing retainer coupling an electronic...

Air flow control in data storage systems

Heat dissipation case

Systems and methods for generating in a graphical user interface a...

Heat sink and printed circuit board arrangements for data storage s...

Thermal management of printed circuit board components

Systems and methods for generating in a graphical user interface a...

Equipment shelf

Programmable AC power distribution device

Multilevel enclosure cooling

Airflow characterization system

Apparatus and method for housing electronic equipment and increasin...

System and method for detecting a level of dirtiness of a filter ma...

Radio remote unit and communications device

Single plate heat radiation device and method

Base station interface device of distributed antenna system

Process for installing an insert for fluid-flow-through cooling of...

Thermal management via active surfaces

Modular electrical system

Optical module heatsink lifter and method

Integrated cell site module for mounting a remote radio unit and ra...

Process for making an apparatus with fluid-flow-through cooling of...

Apparatus, system, and method for directing air in a storage-system...

Apparatus and method for housing electronic equipment and increasin...

Enhanced cooling design for computing device

Patents Applicationslast 30 patents

COMPOSITE HEAT DISSIPATION DEVICE

Front-to-rear airflow assembly for an equipment casing mounted on a...

ENHANCED AVIONICS RACK MODULE

Liquid cooling high-density pluggable modules for a network element

ELECTRONIC ASSEMBLY HAVING SEALING RETAINER COUPLING AN ELECTRONIC...

DATA STORAGE COOLING MODULE

CASING AND ELECTRONIC DEVICE

Front-to-rear airflow assembly for an equipment casing mounted on a...

SYSTEMS AND METHODS FOR GENERATING IN A GRAPHICAL USER INTERFACE A...

HEAT SINK AND PRINTED CIRCUIT BOARD ARRANGEMENTS FOR DATA STORAGE S...

HEAT DISSIPATION CASE

Equipment Shelf

AIR FLOW CONTROL IN DATA STORAGE SYSTEMS

SYSTEMS AND METHODS FOR GENERATING IN A GRAPHICAL USER INTERFACE A...

MULTILEVEL ENCLOSURE COOLING

THERMAL MANAGEMENT OF PRINTED CIRCUIT BOARD COMPONENTS

AIRFLOW CHARACTERIZATION SYSTEM

APPARATUS AND METHOD FOR HOUSING ELECTRONIC EQUIPMENT AND INCREASIN...

Radio Remote Unit and Communications Device

SYSTEM AND METHOD FOR DETECTING A LEVEL OF DIRTINESS OF A FILTER MA...

APPARATUS, SYSTEM, AND METHOD FOR DIRECTING AIR IN A STORAGE-SYSTEM...

COOLING SYSTEM FOR AN ELECTRONICS ENCLOSURE

BASE STATION INTERFACE DEVICE OF DISTRIBUTED ANTENNA SYSTEM

Enhanced Cooling Design for Computing Device

INTEGRATED CELL SITE SECTOR MODULE

THERMAL MANAGEMENT OF PRINTED CIRCUIT BOARD COMPONENTS

HEAT RELAY NETWORK SYSTEM FOR TELECOMMUNICATION EQUIPMENT

FLUID-FLOW-THROUGH COOLING OF CIRCUIT BOARDS

FLUID-FLOW-THROUGH COOLING OF CIRCUIT BOARDS

HIGH-DENSITY RACK UNIT SYSTEMS AND METHODS