within sub-racks for removing heat from electronic boards

Industry

CPC
H05K7/20636

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K7/00Constructional details common to different types of electric apparatus

Current Industry

H05K7/20636within sub-racks for removing heat from electronic boards

Industries

Patents Grantslast 30 patents

Information Patent Grant
Liquid cooling structure and liquid cooling system including the li...
- Patent number 12,181,230
- Issue date Dec 31, 2024
- SK hynix Inc.
- Nam Hyeon Choi
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Localized immersion cooling enclosure with thermal efficiency features
- Patent number 12,156,372
- Issue date Nov 26, 2024
- Cisco Technology, Inc.
- M. Baris Dogruoz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Container for one or more electronic devices and methods of use the...
- Patent number 12,120,847
- Issue date Oct 15, 2024
- Engendren LLC
- Alan Paul Meissner
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Systems and methods for electronics cooling
- Patent number 11,895,805
- Issue date Feb 6, 2024
- Eagle Technology, LLC
- Donald S. George
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat transfer interfaces for circuit card assembly (CCA) modules
- Patent number 11,839,061
- Issue date Dec 5, 2023
- Hamilton Sundstrand Corporation
- Alexander Trotman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling electronic devices in a data center
- Patent number 11,832,396
- Issue date Nov 28, 2023
- Google LLC
- Madhusudan Krishnan Iyengar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid cooling system for electronic racks
- Patent number 11,825,628
- Issue date Nov 21, 2023
- BAIDU USA LLC
- Shuai Shao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chassis with thermal transfer fluid path
- Patent number 11,672,106
- Issue date Jun 6, 2023
- Hamilton Sundstrand Corporation
- Jason C. Duffy
- B64 - AIRCRAFT AVIATION COSMONAUTICS
Information Patent Grant
Localized immersion cooling enclosure with thermal efficiency features
- Patent number 11,647,607
- Issue date May 9, 2023
- Cisco Technology, Inc.
- M. Baris Dogruoz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for cooling an electronic device via interface...
- Patent number 11,596,086
- Issue date Feb 28, 2023
- Lenovo Enterprise Solutions (Singapore) Pte. Ltd.
- Paul Artman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal management of high capacity optics in dense arrangements
- Patent number 11,523,541
- Issue date Dec 6, 2022
- Cisco Technology, Inc.
- M. Baris Dogruoz
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Cold plate assembly for an electronic component
- Patent number 11,350,545
- Issue date May 31, 2022
- GE Aviation Systems LLC
- Liqiang Yang
- B64 - AIRCRAFT AVIATION COSMONAUTICS
Information Patent Grant
Housing structure for electronic boards
- Patent number 11,324,136
- Issue date May 3, 2022
- Eurotech S.p.A.
- Mauro Rossi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fluid connectors for modular cooling systems
- Patent number 11,197,393
- Issue date Dec 7, 2021
- Seagate Technology LLC
- Laurence A. Harvilchuck
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Liquid cooling with outdoor chiller rack system
- Patent number 11,147,191
- Issue date Oct 12, 2021
- Quanta Computer Inc.
- Chao-Jung Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for deploying liquid cooling solution in an air-cooled data...
- Patent number 11,032,949
- Issue date Jun 8, 2021
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Direct contact heat exchanger
- Patent number 10,980,153
- Issue date Apr 13, 2021
- GE Aviation Systems LLC
- Nader Dariavach
- B64 - AIRCRAFT AVIATION COSMONAUTICS
Information Patent Grant
Cooling design for PCIE mounted server peripheral electronics
- Patent number 10,980,154
- Issue date Apr 13, 2021
- BAIDU USA LLC
- Tianyi Gao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Rotatable cold plate assembly for cooling pluggable modules
- Patent number 10,874,032
- Issue date Dec 22, 2020
- Hewlett Packard Enterprise Development LP
- Kevin B. Leigh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Cooling for slot mounted electrical modules
- Patent number 10,856,446
- Issue date Dec 1, 2020
- Juniper Networks, Inc.
- Franklin D. Boyden
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Device comprising heat producing components with liquid submersion...
- Patent number 10,716,238
- Issue date Jul 14, 2020
- AECORSIS B.V.
- Dirk Roelof Brink
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Cooling electronic devices in a data center
- Patent number 10,681,846
- Issue date Jun 9, 2020
- Google LLC
- Madhusudan Krishnan Iyengar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forced flow cooling temperature control method, system, and apparatus
- Patent number 10,645,845
- Issue date May 5, 2020
- Northrop Grumman Systems Corporation
- Martin Brokner Christiansen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling assemblies for cooling heat generating components and vehic...
- Patent number 10,562,469
- Issue date Feb 18, 2020
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Ercan M. Dede
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Thermal-control, truss-plate apparatus and method
- Patent number 10,384,318
- Issue date Aug 20, 2019
- Thermal Management Technologies
- J. Clair Batty
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Avionics heat exchanger
- Patent number 10,356,950
- Issue date Jul 16, 2019
- GE Aviation Systems, LLC
- Nader Dariavach
- B64 - AIRCRAFT AVIATION COSMONAUTICS
Information Patent Grant
Server rack heat sink system with combination of liquid cooling dev...
- Patent number 10,356,949
- Issue date Jul 16, 2019
- GUANGDONG SHENLING ENVIRONMENTAL SYSTEMS CO., LTD.
- Zhanhua Pan
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Fluid connectors for modular cooling systems
- Patent number 10,327,358
- Issue date Jun 18, 2019
- Seagate Technology LLC
- Laurence A. Harvilchuck
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Server chassis with a liquid cooling enablement module in an input/...
- Patent number 10,201,115
- Issue date Feb 5, 2019
- Dell Products, L.P.
- Robert W. Johnson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic apparatus and cooling system for electronic apparatus
- Patent number 10,194,559
- Issue date Jan 29, 2019
- EXASCALER INC.
- Motoaki Saito
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
Sealed Rack Server Unit
- Publication number 20240407140
- Publication date Dec 5, 2024
- Nexalus Limited
- Richard Jenkins
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SMART RACK LIQUID COOLING MANIFOLD SYSTEM HAVING INTEGRATED CONTROL...
- Publication number 20240237297
- Publication date Jul 11, 2024
- STRATEGIC THERMAL LABS, LLC
- AUSTIN SHELNUTT
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ARRAYED COLD PLATE FOR DIMMS
- Publication number 20240237296
- Publication date Jul 11, 2024
- QUANTA COMPUTER INC.
- Chao-Jung CHEN
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
COLD PLATE PLACEMENT AND RETRACTION APPARATUS WITH PREDEFINED TRAVE...
- Publication number 20240155796
- Publication date May 9, 2024
- International Business Machines Corporation
- Madhana Sunder
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SMART RACK LIQUID COOLING MANIFOLD SYSTEM HAVING INTEGRATED CONTROL...
- Publication number 20240138118
- Publication date Apr 25, 2024
- STRATEGIC THERMAL LABS, LLC
- AUSTIN SHELNUTT
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR ELECTRONICS COOLING
- Publication number 20240107710
- Publication date Mar 28, 2024
- Eagle Technology, LLC
- Donald S. George
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Liquid cooling high-density pluggable modules for a network element
- Publication number 20240049434
- Publication date Feb 8, 2024
- CIENA CORPORATION
- Behzad Mohajer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT TRANSFER INTERFACES FOR CIRCUIT CARD ASSEMBLY (CCA) MODULES
- Publication number 20230345676
- Publication date Oct 26, 2023
- HAMILTON SUNDSTRAND CORPORATION
- Alexander Trotman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOCALIZED IMMERSION COOLING ENCLOSURE WITH THERMAL EFFICIENCY FEATURES
- Publication number 20230209767
- Publication date Jun 29, 2023
- Cisco Technology, Inc.
- M. Baris Dogruoz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL MANAGEMENT OF HIGH CAPACITY OPTICS IN DENSE ARRANGEMENTS
- Publication number 20230124658
- Publication date Apr 20, 2023
- Cisco Technology, Inc.
- M. Baris Dogruoz
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
SIMPLIFIED LIQUID COOLED CARD CAGE WITH INTERNAL AND EXTERNAL HEAT
- Publication number 20220256743
- Publication date Aug 11, 2022
- BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
- Gerard J. Pelletier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYBRID COOLING SYSTEM FOR ELECTRONIC RACKS
- Publication number 20220061187
- Publication date Feb 24, 2022
- BAIDU USA LLC
- Shuai Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COLD PLATE ASSEMBLY FOR AN ELECTRONIC COMPONENT
- Publication number 20210176896
- Publication date Jun 10, 2021
- GE AVIATION SYSTEMS LLC
- Liqiang Yang
- B64 - AIRCRAFT AVIATION COSMONAUTICS
Information Patent Application
METHOD FOR DEPLOYING LIQUID COOLING SOLUTION IN AN AIR-COOLED DATA...
- Publication number 20210100134
- Publication date Apr 1, 2021
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HOUSING STRUCTURE FOR ELECTRONIC BOARDS
- Publication number 20210051813
- Publication date Feb 18, 2021
- EUROTECH SPA
- Mauro ROSSI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEMS AND METHODS FOR COOLING AN ELECTRONIC DEVICE VIA INTERFACE...
- Publication number 20200315066
- Publication date Oct 1, 2020
- LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD.
- Paul Artman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING ELECTRONIC DEVICES IN A DATA CENTER
- Publication number 20200296862
- Publication date Sep 17, 2020
- Google LLC
- Madhusudan Krishnan Iyengar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ROTATABLE COLD PLATE ASSEMBLY FOR COOLING PLUGGABLE MODULES
- Publication number 20200260615
- Publication date Aug 13, 2020
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Kevin B. Leigh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LIQUID COOLING WITH OUTDOOR CHILLER RACK SYSTEM
- Publication number 20200137927
- Publication date Apr 30, 2020
- QUANTA COMPUTER INC.
- Chao-Jung CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIRECT CONTACT HEAT EXCHANGER
- Publication number 20190289749
- Publication date Sep 19, 2019
- GE AVIATION SYSTEMS LLC
- Nader Dariavach
- B64 - AIRCRAFT AVIATION COSMONAUTICS
Information Patent Application
FLUID CONNECTORS FOR MODULAR COOLING SYSTEMS
- Publication number 20190269039
- Publication date Aug 29, 2019
- SEAGATE TECHNOLOGY LLC
- Laurence A. Harvilchuck
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
COOLING FOR SLOT MOUNTED ELECTRICAL MODULES
- Publication number 20190246523
- Publication date Aug 8, 2019
- Juniper Networks, Inc.
- Franklin D. Boyden
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
AVIONICS HEAT EXCHANGER
- Publication number 20190191594
- Publication date Jun 20, 2019
- GE AVIATION SYSTEMS, LLC
- Nader Dariavach
- B64 - AIRCRAFT AVIATION COSMONAUTICS
Information Patent Application
SERVER RACK HEAT SINK SYSTEM WITH COMBINATION OF LIQUID COOLING DEV...
- Publication number 20180042140
- Publication date Feb 8, 2018
- GUANGDONG SHENLING AIR-CONDITIONING EQUIPMENT CO., LTD.
- Zhanhua PAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Silicon Cooling Plate With An Integrated PCB
- Publication number 20170303431
- Publication date Oct 19, 2017
- Gerald Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR COOLING SYSTEM
- Publication number 20160381834
- Publication date Dec 29, 2016
- SEAGATE TECHNOLOGY LLC
- Laurence A. Harvilchuck
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
METHOD AND APPARATUS TO MANAGE COOLANT PRESSURE AND FLOW FOR AN ARR...
- Publication number 20160360649
- Publication date Dec 8, 2016
- LIQUIDCOOL SOLUTIONS, INC.
- Laurent Regimbal
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID COOLING MEDIUM FOR ELECTRONIC DEVICE COOLING
- Publication number 20150319887
- Publication date Nov 5, 2015
- DOW GLOBAL TECHNOLOGIES LLC
- Anny L. Flory
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
THERMAL TRANSFER AND COOLANT-COOLED STRUCTURES FACILITATING COOLING...
- Publication number 20140240930
- Publication date Aug 28, 2014
- International Business Machines Corporation
- Amilcar R. ARVELO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE THERMAL INTERFACE FOR ELECTRONICS
- Publication number 20140146475
- Publication date May 29, 2014
- Northrop Grumman Systems Corporation
- Clint G. Buckman
- F28 - HEAT EXCHANGE IN GENERAL

within sub-racks for removing heat from electronic boards

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Liquid cooling structure and liquid cooling system including the li...

Localized immersion cooling enclosure with thermal efficiency features

Container for one or more electronic devices and methods of use the...

Systems and methods for electronics cooling

Heat transfer interfaces for circuit card assembly (CCA) modules

Cooling electronic devices in a data center

Hybrid cooling system for electronic racks

Chassis with thermal transfer fluid path

Localized immersion cooling enclosure with thermal efficiency features

Systems and methods for cooling an electronic device via interface...

Thermal management of high capacity optics in dense arrangements

Cold plate assembly for an electronic component

Housing structure for electronic boards

Fluid connectors for modular cooling systems

Liquid cooling with outdoor chiller rack system

Method for deploying liquid cooling solution in an air-cooled data...

Direct contact heat exchanger

Cooling design for PCIE mounted server peripheral electronics

Rotatable cold plate assembly for cooling pluggable modules

Cooling for slot mounted electrical modules

Device comprising heat producing components with liquid submersion...

Cooling electronic devices in a data center

Forced flow cooling temperature control method, system, and apparatus

Cooling assemblies for cooling heat generating components and vehic...

Thermal-control, truss-plate apparatus and method

Avionics heat exchanger

Server rack heat sink system with combination of liquid cooling dev...

Fluid connectors for modular cooling systems

Server chassis with a liquid cooling enablement module in an input/...

Electronic apparatus and cooling system for electronic apparatus

Patents Applicationslast 30 patents

Sealed Rack Server Unit

SMART RACK LIQUID COOLING MANIFOLD SYSTEM HAVING INTEGRATED CONTROL...

ARRAYED COLD PLATE FOR DIMMS

COLD PLATE PLACEMENT AND RETRACTION APPARATUS WITH PREDEFINED TRAVE...

SMART RACK LIQUID COOLING MANIFOLD SYSTEM HAVING INTEGRATED CONTROL...

SYSTEMS AND METHODS FOR ELECTRONICS COOLING

Liquid cooling high-density pluggable modules for a network element

HEAT TRANSFER INTERFACES FOR CIRCUIT CARD ASSEMBLY (CCA) MODULES

LOCALIZED IMMERSION COOLING ENCLOSURE WITH THERMAL EFFICIENCY FEATURES

THERMAL MANAGEMENT OF HIGH CAPACITY OPTICS IN DENSE ARRANGEMENTS

SIMPLIFIED LIQUID COOLED CARD CAGE WITH INTERNAL AND EXTERNAL HEAT

HYBRID COOLING SYSTEM FOR ELECTRONIC RACKS

COLD PLATE ASSEMBLY FOR AN ELECTRONIC COMPONENT

METHOD FOR DEPLOYING LIQUID COOLING SOLUTION IN AN AIR-COOLED DATA...

HOUSING STRUCTURE FOR ELECTRONIC BOARDS

SYSTEMS AND METHODS FOR COOLING AN ELECTRONIC DEVICE VIA INTERFACE...

COOLING ELECTRONIC DEVICES IN A DATA CENTER

ROTATABLE COLD PLATE ASSEMBLY FOR COOLING PLUGGABLE MODULES

LIQUID COOLING WITH OUTDOOR CHILLER RACK SYSTEM

DIRECT CONTACT HEAT EXCHANGER

FLUID CONNECTORS FOR MODULAR COOLING SYSTEMS

COOLING FOR SLOT MOUNTED ELECTRICAL MODULES

AVIONICS HEAT EXCHANGER

SERVER RACK HEAT SINK SYSTEM WITH COMBINATION OF LIQUID COOLING DEV...

Silicon Cooling Plate With An Integrated PCB

MODULAR COOLING SYSTEM

METHOD AND APPARATUS TO MANAGE COOLANT PRESSURE AND FLOW FOR AN ARR...

LIQUID COOLING MEDIUM FOR ELECTRONIC DEVICE COOLING

THERMAL TRANSFER AND COOLANT-COOLED STRUCTURES FACILITATING COOLING...

FLEXIBLE THERMAL INTERFACE FOR ELECTRONICS